公开(公告)号：US20140261566A1

公开(公告)日：2014-09-18

申请号：US14212899

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Masaaki FURUYA ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA ,  Atsushi KINASE ,  Masahiro ABE

IPC: B08B3/10

CPC classification number: B08B3/10 ,  H01L21/67028 ,  H01L21/67034

Abstract: A substrate processing device 10 includes a suction drying unit 65 drying a surface of a substrate W by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate W by a heating operation of a heating unit 64.

Abstract translation: 基板处理装置10包括吸引干燥单元65，其通过加热单元64的加热操作吸收和去除形成在基板W的表面上的挥发性溶剂的液滴来干燥基板W的表面。

公开(公告)号：US20200025643A1

公开(公告)日：2020-01-23

申请号：US16587737

申请日：2019-09-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masataka YOKOI ,  Nobuo KOBAYASHI ,  Masaaki FURUYA ,  Atsushi KINASE

IPC: G01M3/28 ,  H05B3/06

Abstract: According to one of embodiments, a gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed are provided. There is provided a gas leak detecting device of a heater pipe 10 which is provided with an inside pipe 10a housing a heater element and an outside pipe 10b sealed surrounding this inside pipe and which is adjusted through piping 30 by a pressure adjustment mechanism 20 in gas pressure in a space between the outside pipe 10b and the inside pipe 10a to a predetermined pressure value, comprising a gas flow resistance part 21 (213) provided at the piping 30 and locally resistant to flow of gas, a pressure detection unit 23 detecting gas pressure of a space between the outside pipe 10b and the inside pipe 10a between the gas flow resistance part 21 and the heater pipe 10 in the piping 30, and a leak judging means 50 for judging whether gas is leaking from the heater pipe 10 based on a detected pressure value obtained by the pressure detection unit 23.

公开(公告)号：US20140261554A1

公开(公告)日：2014-09-18

申请号：US14212382

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Masaaki FURUYA ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA ,  Atsushi KINASE ,  Masahiro ABE

IPC: H01L21/67

CPC classification number: H01L21/6704 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67115

Abstract: In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.

Abstract translation: 在具有用于干燥基板W的表面的加热和干燥单元103的基板处理装置10中，加热和干燥单元103向上加热基板W的垂直向下的表面，以通过掉落和去除来干燥基板的表面， 通过重力，通过加热操作形成在基板W的表面上的挥发性溶剂的液滴。

公开(公告)号：US20140261549A1

公开(公告)日：2014-09-18

申请号：US14212218

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Masaaki FURUYA ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA ,  Atsushi KINASE ,  Masahiro ABE

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6776

Abstract: A substrate processing device 100 includes a cleaning liquid supply unit 114 supplying a cleaning liquid to a surface of a substrate W, a solvent supply unit 115 supplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unit 117 heating the substrate W supplied with the volatile solvent, and a drying unit 118 drying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit 117, and the heating unit 117 and the drying unit 118 are arranged in a course of transportation of the substrate W transported from the solvent supply unit 115.

Abstract translation: 基板处理装置100包括向基板W的表面供给清洗液的清洗液供给部114，向供给清洗液的基板W的表面供给挥发性溶剂的溶剂供给部115，以更换清洗液 在具有挥发性溶剂的基板W的表面上，加热单元117，加热供给挥发性溶剂的基板W，以及干燥单元118，通过除去表面上产生的挥发性溶剂的液滴来干燥基板W的表面 通过加热单元117的加热操作，加热单元117和干燥单元118在从溶剂供应单元115输送的基板W的输送过程中布置。