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    SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE
    1.
    发明申请
    SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE 审中-公开
    基板处理装置，层压基板的剥离方法和移除粘合剂的方法

    公开(公告)号：US20160225613A1

    公开(公告)日：2016-08-04

    申请号：US15021182

    申请日：2014-09-24

    Applicant: SHIBAURA MECHATRONICS CORPORATION

    Inventor： Takahiro Kanai ,  Emi Matsui ,  Konosuke Hayashi

    IPC: H01L21/02

    Abstract: The embodiment of a substrate treatment device includes a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed, a transport section configured to transport the treatment object, a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object. the treatment object is at least one of: a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate, the device substrate with the adhesive attached thereto, and the support substrate with the adhesive attached thereto.

    Abstract translation: 基板处理装置的实施方式包括：处理槽，其配置为储存待处理对象物被浸渍的处理液，配置成输送处理对象物的输送部，设置在至少一个处理槽中的温度控制部 以及与治疗浴间隔开并且被配置为执行治疗对象的加热和冷却中的至少一个的位置。 处理对象是以下中的至少一种：包括装置基板，支撑基板和设置在装置基板和支撑基板之间的粘合剂的层压基板，附着有粘合剂的装置基板和具有粘合剂的支撑基板 附在其上。

    Suction stage, lamination device, and method for manufacturing laminated substrate
    3.
    发明授权
    Suction stage, lamination device, and method for manufacturing laminated substrate 有权

    公开(公告)号：US10586727B2

    公开(公告)日：2020-03-10

    申请号：US15021516

    申请日：2014-09-24

    Applicant: Shibaura Mechatronics Corporation

    Inventor： Emi Matsui ,  Konosuke Hayashi ,  Takahiro Kanai

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  B32B37/10 ,  B32B37/14

    Abstract: A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.

    Substrate processing apparatus and substrate processing method
    5.
    发明授权
    Substrate processing apparatus and substrate processing method 有权

    公开(公告)号：US11322384B2

    公开(公告)日：2022-05-03

    申请号：US17034173

    申请日：2020-09-28

    Applicant: SHIN-ETSU ENGINEERING CO., LTD. ,  SHIBAURA MECHATRONICS CORPORATION

    Inventor： Shunya Kubota ,  Emi Matsui ,  Katsuhiro Yamazaki ,  Yoshikazu Ohtani ,  Kyouhei Tomioka

    IPC: H01L21/67 ,  H01L21/683

    Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a table 20 configured to support a processing target W including a substrate W1, a ring W2 surrounding a surrounding of the substrate W1, and a dicing tape W3 adhered to a lower surface of the substrate W1 and a lower surface of the ring W2, and a liquid supplier 50 configured to eject a liquid which does not mix with a processing liquid for processing the substrate W1 and which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, an outer circumference end portion of the substrate W1 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, and between the substrate W1 and the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism in accordance with a rotation number of the table 20 to supply the liquid between the substrate W1 and the ring W2 of the processing target W.

    SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE
    6.
    发明申请
    SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE 审中-公开
    吸收级，层压装置和制造层压基板的方法

    公开(公告)号：US20160225655A1

    公开(公告)日：2016-08-04

    申请号：US15021516

    申请日：2014-09-24

    Applicant: SHIBAURA MECHATRONICS CORPORATION

    Inventor： Emi Matsui ,  Konosuke Hayashi ,  Takahiro Kanai

    IPC: H01L21/683 ,  B32B37/10 ,  B32B37/14

    Abstract: According to the embodiment, a suction stage includes a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a first wall part provided on an outer peripheral side of one end surface of the mounting section and shaped like a ring, and a second wall part provided inside the first wall part and shaped like a ring. The evacuation section includes a first control valve provided between the evacuation section and a first region between the first wall part and the second wall part, a second control valve provided between the evacuation section and a second region inside the second wall part, and a control section configured to control the first control valve and the second control valve. The control section is configured to control the first control valve and the second control valve so that suction of the first substrate and deactivation of the suction of the first substrate are alternately performed in at least one of the first region and the second region. While the suction of the first substrate is deactivated in one of the first region and the second region, the suction of the first substrate is performed in the other region.

    Abstract translation: 根据本实施方式，吸入台具备：搭载第一基板的安装部和构成为在第一基板与安装部之间抽空的排气部。 安装部包括：第一壁部，其设置在安装部的一个端面的外周侧，成形为环状;第二壁部，设置在第一壁部的内部，形状为环状。 排气部包括设置在排气部与第一壁部与第二壁部之间的第一区域之间的第一控制阀，设置在排气部与第二壁部内部的第二区域之间的第二控制阀， 该部分被配置为控制第一控制阀和第二控制阀。 控制部被配置为控制第一控制阀和第二控制阀，使得在第一区域和第二区域中的至少一个中交替地执行第一基板的吸入和第一基板的抽吸的停用。 当在第一区域和第二区域中的一个区域中第一基板的抽吸被停用时，第一基板的吸力在另一区域中执行。

    BONDING APPARATUS AND BONDING PROCESS METHOD
    7.
    发明申请
    BONDING APPARATUS AND BONDING PROCESS METHOD 有权
    连接装置和接合工艺方法

    公开(公告)号：US20140182761A1

    公开(公告)日：2014-07-03

    申请号：US14138196

    申请日：2013-12-23

    Applicant: Shibaura Mechatronics Corporation

    Inventor： Konosuke Hayashi ,  Emi Matsui

    IPC: H01L21/673

    CPC classification number: H01L21/673 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/10 ,  Y10T156/17

    Abstract: According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.

    Abstract translation: 根据一个实施例，用于处理保留基板的接合装置包括主体单元，喷嘴，气体供应单元和基板支撑单元。 喷嘴在保持第一基板的一侧在主体单元的表面上开口。 气体供给单元构造成向喷嘴供给气体，以向第一基板施加吸力并将基板与主体单元的表面分离。 衬底支撑单元构造成以预定的间隙支撑设置成与第一衬底相对的第二衬底的外围边缘部分。

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