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公开(公告)号:US20240061324A1
公开(公告)日:2024-02-22
申请号:US18451607
申请日:2023-08-17
申请人: SK enpulse Co., Ltd.
发明人: GeonGon LEE , Seong Yoon KIM , Min Gyo JEONG , Hyung Joo LEE , Sung Hoon SON , Tae Young KIM
摘要: A blank mask includes a light transmissive substrate and a multilayer comprising a light shielding layer and a phase shift layer disposed between the light transmissive substrate and the light shielding layer. The phase shift layer includes an upper surface facing the light shielding layer and a side surface connected to the upper surface, such that the light shielding layer is disposed on the upper surface and the side surface of the phase shift layer. When viewed from a top surface of the multilayer, the multilayer includes a central portion and an outer portion surrounding the central portion. The outer portion has a curved upper surface, which greatly suppresses damage to the phase shift layer by a cleaning solution and effectively reduces a frequency of particle generation at edges of the phase shift layer and the light shielding layer.
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公开(公告)号:US20230418150A1
公开(公告)日:2023-12-28
申请号:US18340334
申请日:2023-06-23
申请人: SK enpulse Co., Ltd.
发明人: GeonGon LEE , Hyung-joo LEE , Suhyeon KIM , Sung Hoon SON , Seong Yoon KIM , Min Gyo JEONG , Taewan KIM , Inkyun SHIN , Tae Young KIM
IPC分类号: G03F1/32
CPC分类号: G03F1/32
摘要: A blank mask includes a light transmissive substrate, and a light-blocking layer, disposed on the light transmissive substrate, comprising a transition metal and either one or both of oxygen and nitrogen. An average value of grain sizes of a surface of the light-blocking layer ranges from 14 nm to 24 nm.
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公开(公告)号:US20230408903A1
公开(公告)日:2023-12-21
申请号:US18309427
申请日:2023-04-28
申请人: SK enpulse Co., Ltd.
发明人: Seong Yoon KIM , GeonGon LEE , Min Gyo JEONG , Sung Hoon SON , Inkyun SHIN
CPC分类号: G03F1/38 , G03F1/68 , G03F7/706851 , G03F7/2047
摘要: A shadow mask includes a mask including one surface, another surface, and an opening that passes from one surface to the other, and a shutter provided on the one surface of the mask and configured to adjust a size of the opening, wherein the shutter is configured to move from an edge to a center of the opening to adjust the size of the opening, and the shadow mask is applied in manufacturing a blank mask for a semiconductor lithography process.
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公开(公告)号:US20240345468A1
公开(公告)日:2024-10-17
申请号:US18750609
申请日:2024-06-21
申请人: SK enpulse Co., Ltd.
发明人: Hyung-joo LEE , Kyuhun KIM , JiYeon RYU , INKYUN SHIN , Seong Yoon KIM , Suk Young CHOI , Suhyeon KIM , SUNG HOON SON , Min Gyo JEONG
IPC分类号: G03F1/32
CPC分类号: G03F1/32
摘要: A blank mask including a transparent substrate, a phase shift film disposed on the transparent substrate, and a light shielding film disposed on the phase shift film. The phase shift film has XRD maximum peak at 20 of 15° to 30° when normal mode XRD analysis is performed on an upper surface of the phase shift film. The transparent substrate has XRD maximum peak at 20 of 15° to 30° when performing normal mode XRD analysis on a lower surface of the transparent substrate. AI1 value of the blank mask expressed by below Equation is 0.9 to 1.1.
AI
1
=
XM
1
XQ
1
XM1 is the maximum value of the measured X-ray intensity when the normal mode XRD analysis is performed on upper surface of the phase shift film. XQ1 is the maximum value of the measured X-ray intensity when the normal mode XRD analysis is performed on the lower surface of the transparent substrate.-
公开(公告)号:US20240192584A1
公开(公告)日:2024-06-13
申请号:US18080186
申请日:2022-12-13
申请人: SK enpulse Co., Ltd.
发明人: Hyung-joo LEE , Kyuhun KIM , GeonGon LEE , Seong Yoon KIM , Suk Young CHOI , Suhyeon KIM , Sung Hoon SON , Min Gyo JEONG , Inkyun SHIN
IPC分类号: G03F1/50 , G02F1/00 , G02F1/1335 , G03F1/60 , G03F1/80 , H01L21/285
CPC分类号: G03F1/50 , G02F1/0063 , G02F1/133512 , G03F1/60 , G03F1/80 , H01L21/28568
摘要: A blank mask includes a light-transmitting substrate; and a light-shielding film, disposed on the light-transmitting substrate, including a first light-shielding layer and a second light-shielding layer disposed on the first light-shielding layer. The second light-shielding layer includes at least one of a transition metal, oxygen, or nitrogen, or any combination thereof. A reflectance of a surface of the light-shielding film with respect to light having a wavelength of 193 nm is 20% or more and 40% or less. A hardness value of the second light-shielding layer is 0.3 kPa or more and 0.55 kPa or less.
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公开(公告)号:US20240248389A1
公开(公告)日:2024-07-25
申请号:US18412602
申请日:2024-01-15
申请人: SK enpulse Co., Ltd.
发明人: Tae Wan KIM , Geon Gon LEE , Seong Yoon KIM
摘要: Disclosed is an apparatus for fabricating a blank mask, the apparatus including: a chamber; and a rotatable chuck placed inside the chamber, wherein the rotatable chuck includes: a support part configured to support an optical substrate placed on the support part; and a guide part disposed on a side of the optical substrate and connected to the support part, wherein an interval between the guide part and a side surface of the optical substrate is greater than 0 mm and less than 1 mm.
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公开(公告)号:US20230367200A1
公开(公告)日:2023-11-16
申请号:US18312942
申请日:2023-05-05
申请人: SK enpulse Co., Ltd.
发明人: Seong Yoon KIM , Sung Hoon SON , Min Gyo JEONG , Inkyun SHIN , Suk Young CHOI , Hyung-ju LEE , Suhyeon KIM
摘要: A blank mask includes a light-transmitting substrate; and a light-shielding film on the light-transmitting substrate. The light-shielding film includes a transition metal and oxygen, and a scum formation time required to generate scum is 120 minutes or more when light with a wavelength of 172 nm and an intensity of 10 kJ/cm2 is applied on the light-shielding film.
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公开(公告)号:US20230305382A1
公开(公告)日:2023-09-28
申请号:US18187829
申请日:2023-03-22
申请人: SK enpulse Co., Ltd.
发明人: Seong Yoon KIM , Tae Young KIM , GeonGon LEE , Min Gyo JEONG , Sung Hoon SON , Inkyun SHIN
IPC分类号: G03F1/24
CPC分类号: G03F1/24
摘要: An extreme ultraviolet photomask includes a conductive layer; a substrate disposed on the conductive layer; a multilayer, comprising different metals alternately stacked on the substrate; a protective layer disposed on the multilayer; a low-reflectance part disposed on a portion of the protective layer, wherein the low-reflectance part comprises a first absorbent layer disposed on the portion of the protective layer, a low-reflectance layer formed on the first absorbent layer, and a first intagliated part formed at the portion where the protective layer is exposed; and a high-reflectance part disposed on another portion of the protective layer, wherein the high-reflectance part comprises a second absorbent layer disposed on the other portion of the protective layer, a high-reflectance layer disposed on the second absorbent layer, and a second intagliated part formed at the other where the protective layer is exposed.
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