公开(公告)号：US10593452B2

公开(公告)日：2020-03-17

申请号：US15609309

申请日：2017-05-31

Applicant: SKC CO., LTD.

Inventor： Tae Kyoung Kim ,  Jong Hwi Park ,  Jin Cheol Kim ,  Jonghak Choi ,  Nah Young Kim ,  Hyun Gon Moon

IPC: H01F1/147 ,  H01F41/16 ,  H01Q7/00 ,  H01F27/36 ,  H01F1/26 ,  H01F38/14

Abstract: A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.

公开(公告)号：US09640304B2

公开(公告)日：2017-05-02

申请号：US13939905

申请日：2013-07-11

Applicant: SKC CO., LTD

Inventor： Il Hwan Yoo ,  Jin Cheol Kim ,  Tae Kyoung Kim ,  Dong Gyu Lee ,  Yu Jin Lee

IPC: B32B38/04 ,  B32B3/18 ,  B32B9/04 ,  B32B27/14 ,  H01B17/60 ,  B29C67/00 ,  B32B9/00 ,  B32B18/00 ,  B32B38/00 ,  C04B35/26 ,  C04B37/00 ,  H05K9/00 ,  H01F1/375 ,  B32B7/12 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B3/26 ,  H01Q1/38 ,  H01Q7/06

CPC classification number: H01B17/60 ,  B29C67/0011 ,  B32B3/266 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B18/00 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B38/0004 ,  B32B2038/0024 ,  B32B2307/558 ,  B32B2315/02 ,  B32B2457/00 ,  C04B35/265 ,  C04B37/008 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/668 ,  C04B2237/34 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/708 ,  H01F1/375 ,  H01Q1/38 ,  H01Q7/06 ,  H05K9/0075 ,  Y10T156/1052 ,  Y10T428/252

Abstract: Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet.

公开(公告)号：US10479050B2

公开(公告)日：2019-11-19

申请号：US15609100

申请日：2017-05-31

Applicant: SKC CO., LTD.

Inventor： Tae Kyoung Kim ,  Jong Hwi Park ,  Jin Cheol Kim ,  Hyun Gon Moon ,  Jonghak Choi ,  Nah Young Kim

IPC: B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/40 ,  H01Q1/24 ,  H01Q1/36 ,  B32B5/16 ,  B32B15/16 ,  B32B15/20 ,  H01Q7/06 ,  B32B37/06 ,  B32B37/10 ,  B32B38/00 ,  H02J7/02 ,  H04B5/00 ,  B32B37/18 ,  B32B37/20

Abstract: According to a method of preparing a conductive magnetic composite sheet, the method comprising preparing a magnetic sheet comprising a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained stack to bond the magnetic sheet and the first conductive foil, a conductive magnetic composite sheet having excellent interlayer adhesion between the magnetic sheet and the conductive foil can be prepared while having an excellent magnetic property at NFC, WPC, and MST frequencies.

公开(公告)号：US09522511B2

公开(公告)日：2016-12-20

申请号：US14199289

申请日：2014-03-06

Applicant: SKC CO., LTD.

Inventor： Dong Gyu Lee ,  Jin Cheol Kim ,  Pyung Soo Ha ,  Il Hwan Yoo ,  Dongjin Park ,  Tae Kyoung Kim

IPC: B32B3/02 ,  B32B38/10 ,  B26F1/40 ,  B32B15/08 ,  B32B43/00 ,  B26D3/06 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B25/08 ,  B32B27/28 ,  B32B27/30 ,  B26F1/02 ,  B26F1/44

CPC classification number: B32B3/02 ,  B26D3/065 ,  B26F1/02 ,  B26F1/40 ,  B26F2001/449 ,  B32B7/06 ,  B32B9/005 ,  B32B9/045 ,  B32B15/08 ,  B32B25/08 ,  B32B27/283 ,  B32B27/308 ,  B32B38/10 ,  B32B43/003 ,  B32B2307/546 ,  Y10T156/1052 ,  Y10T156/1082 ,  Y10T428/24777

Abstract: A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet.

Abstract translation: 可以通过在基片上层叠保护片，然后进行简单的两步剪切处理来制备切割层压片。 如此制备的切割层压片具有突出部分，其通过使保护片的移除容易而有助于提高生产率; 因此可以有效地用于广泛的工业应用中，例如脆性片和柔性片。

公开(公告)号：US10903157B2

公开(公告)日：2021-01-26

申请号：US16296659

申请日：2019-03-08

Applicant: SKC Co., Ltd.

Inventor： Sung Jin Kim ,  Young-Ho Rho ,  Jin Cheol Kim ,  Byung Kyu Jang

IPC: H01L23/49 ,  H01L23/15 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48

Abstract: Disclosed are a packaging substrate and a semiconductor device. The semiconductor device includes an element unit including a semiconductor element and a packaging substrate electrically connected to the element unit. By applying a glass substrate to the packaging substrate as a core substrate, connecting the semiconductor element and a motherboard can be closer to each other, so that electrical signals are transferred through as short a path, and significantly improved electrical properties such as a signal transfer rate could be achieved. Also, it is possible to prevent an occurrence of a parasitic element effect and to apply to a high-speed circuit device without additional insulating process.