公开(公告)号：US20110003412A1

公开(公告)日：2011-01-06

申请号：US12883815

申请日：2010-09-16

申请人： Su-ho SHIN ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho SHIN ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L33/48

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US20100033546A1

公开(公告)日：2010-02-11

申请号：US12436318

申请日：2009-05-06

申请人： SOON-CHEOL KWEON ,  Kyu-ho Shin ,  Ki-hwan Kwon

发明人： SOON-CHEOL KWEON ,  Kyu-ho Shin ,  Ki-hwan Kwon

IPC分类号： B41J2/41

CPC分类号： G03G15/0928 ,  G03G2215/0634 ,  G03G2215/0651

摘要： Provided are a toner supply roller and an image forming apparatus using the toner supply roller. The image forming apparatus employs a direct image developing technique, and includes the toner supply roller having a plurality of electrodes formed on an outer surface thereof to selectively supply toner to an image forming unit.

摘要翻译： 提供了使用调色剂供应辊的调色剂供应辊和图像形成装置。 图像形成装置采用直接图像显影技术，并且包括具有形成在其外表面上的多个电极的调色剂供应辊，以选择性地向图像形成单元供应调色剂。

公开(公告)号：US20070023893A1

公开(公告)日：2007-02-01

申请号：US11408101

申请日：2006-04-21

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L23/34

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US08002443B2

公开(公告)日：2011-08-23

申请号：US11473188

申请日：2006-06-23

申请人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

发明人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

IPC分类号： F21V29/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  F21V29/52 ,  F21V29/67 ,  F21V29/677 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/10106 ,  H01L2924/00014

摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。

公开(公告)号：US07928545B2

公开(公告)日：2011-04-19

申请号：US11416107

申请日：2006-05-03

申请人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

发明人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

IPC分类号： H01L23/495

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/12041 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上​​金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。

公开(公告)号：US07821027B2

公开(公告)日：2010-10-26

申请号：US11408101

申请日：2006-04-21

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L29/74

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US20070001582A1

公开(公告)日：2007-01-04

申请号：US11473188

申请日：2006-06-23

申请人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

发明人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

IPC分类号： H01J1/62

CPC分类号： F21V29/51 ,  F21K9/00 ,  F21V29/52 ,  F21V29/67 ,  F21V29/677 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/10106 ,  H01L2924/00014

摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。

公开(公告)号：US08334585B2

公开(公告)日：2012-12-18

申请号：US13077186

申请日：2011-03-31

申请人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

发明人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

IPC分类号： H01L23/495

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/12041 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上​​金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。

公开(公告)号：US08592231B2

公开(公告)日：2013-11-26

申请号：US12883815

申请日：2010-09-16

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L21/00

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US20070039164A1

公开(公告)日：2007-02-22

申请号：US11416107

申请日：2006-05-03

申请人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

发明人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

IPC分类号： H01S4/00

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/12041 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上​​金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。