公开(公告)号：US08728337B2

公开(公告)日：2014-05-20

申请号：US13773711

申请日：2013-02-22

Applicant: SPTS Technologies Limited

Inventor： Carl Brancher ,  John MacNeil ,  Robert Trowell

IPC: H01L21/306

CPC classification number: H01L21/306 ,  B44C1/227 ,  C23C16/455 ,  C23C16/45544 ,  C23C16/45589 ,  H01L21/6719 ,  H01L21/67207

Abstract: A method is for processing a substrate. The method includes placing the substrate in a process volume and introducing a process gas or vapor into the process volume and/or subsequently removing gas or vapor from the volume. The step of introducing and/or removing the gas is at least partially performed by moving a movable wall to change the process volume in an appropriate sense.

Abstract translation: 一种用于处理衬底的方法。 该方法包括将基底放置在处理体积中并将工艺气体或蒸气引入到处理体积中和/或随后从体积中除去气体或蒸气。 引入和/或去除气体的步骤至少部分地通过移动可移动壁来适当地改变处理体积来执行。

公开(公告)号：US11643744B2

公开(公告)日：2023-05-09

申请号：US17357406

申请日：2021-06-24

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： John MacNeil ,  Martin Ayres ,  Trevor Thomas

IPC: C25D17/00 ,  C25D17/06 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/288

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/6719 ,  H01L21/6723 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/68707 ,  H01L21/2885

Abstract: A method of processing a semiconductor wafer is provided. The method includes introducing the wafer to a main chamber via a loading port, using a transfer mechanism to transfer the wafer to a first wafer processing module in a stack so that the wafer is disposed substantially horizontally in the first wafer processing module with a front face facing upwards, and performing a processing step on the front face of the wafer in the first wafer processing module.

公开(公告)号：US11236433B2

公开(公告)日：2022-02-01

申请号：US16845487

申请日：2020-04-10

Applicant: SPTS Technologies Limited

Inventor： Martin Ayres ,  John MacNeil ,  Trevor Thomas

IPC: C25D7/12 ,  C25D21/10 ,  C25D17/00 ,  C25D21/12

Abstract: An apparatus for electrochemically processing a semiconductor substrate includes a processing chamber of the type that is sealable to a peripheral portion of a semiconductor substrate so as to define a covered processing volume. The semiconductor substrate is supported by a substrate support. A magnetic arrangement is disposed outside of the processing chamber and produces a magnetic field. The magnetic field is changed using a controller for controlling the magnetic arrangement. An agitator is disposed within the processing chamber. The agitator comprises a magnetically responsive element which is responsive to changes in the magnetic field of the magnetic arrangement so as to provide a reciprocating motion to the agitator.

公开(公告)号：US20200325588A1

公开(公告)日：2020-10-15

申请号：US16845487

申请日：2020-04-10

Applicant: SPTS Technologies Limited

Inventor： Martin Ayres ,  John MacNeil ,  Trevor Thomas

IPC: C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12

Abstract: An apparatus for electrochemically processing a semiconductor substrate includes a processing chamber of the type that is sealable to a peripheral portion of a semiconductor substrate so as to define a covered processing volume. The semiconductor substrate is supported by a substrate support. A magnetic arrangement is disposed outside of the processing chamber and produces a magnetic field. The magnetic field is changed using a controller for controlling the magnetic arrangement. An agitator is disposed within the processing chamber. The agitator comprises a magnetically responsive element which is responsive to changes in the magnetic field of the magnetic arrangement so as to provide a reciprocating motion to the agitator.