公开(公告)号：US20220404150A1

公开(公告)日：2022-12-22

申请号：US17821724

申请日：2022-08-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Luca Giuseppe FALORNI ,  Claudia COMI ,  Valentina ZEGA

IPC: G01C19/5747 ,  G01C19/574 ,  G01C19/5769

Abstract: A frequency modulation MEMS triaxial gyroscope, having two mobile masses; a first and a second driving body coupled to the mobile masses through elastic elements rigid in a first direction and compliant in a second direction transverse to the first direction; and a third and a fourth driving body coupled to the mobile masses through elastic elements rigid in the second direction and compliant in the first direction. A first and a second driving element are coupled to the first and second driving bodies for causing the mobile masses to translate in the first direction in phase opposition. A third and a fourth driving element are coupled to the third and fourth driving bodies for causing the mobile masses to translate in the second direction and in phase opposition. An out-of-plane driving element is coupled to the first and second mobile masses for causing a translation in a third direction, in phase opposition. Movement-sensing electrodes generate frequency signals as a function of external angular velocities.

公开(公告)号：US20190064205A1

公开(公告)日：2019-02-28

申请号：US16116467

申请日：2018-08-29

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro TOCCHIO ,  Francesco RIZZINI ,  Carlo VALZASINA ,  Giacomo LANGFELDER ,  Cristiano Rocco MARRA

IPC: G01P15/125 ,  G01C19/5719 ,  G01P15/08

Abstract: An inertial sensor for sensing an external acceleration includes: a first and a second proof mass; a first and a second capacitor formed between first and second fixed electrodes and the first proof mass; a third and a fourth capacitor formed between third and fourth fixed electrodes and the second proof mass; a driving assembly configured to cause an antiphase oscillation of the first and second proof masses; a biasing circuit configured to bias the first and third capacitors, thus generating first variation of the oscillation frequency in a first time interval, and to bias the second and fourth capacitors, thus generating first variation of the oscillation frequency in a second time interval; a sensing assembly, configured to generate an differential output signal which is a function of a difference between a value of the oscillating frequency during the first time interval and a value of the oscillating frequency during the second time interval. Such differential output signal can be correlated to the value and direction of the external acceleration.

公开(公告)号：US20230314469A1

公开(公告)日：2023-10-05

申请号：US18308543

申请日：2023-04-27

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro TOCCHIO ,  Francesco RIZZINI

IPC: G01P15/18 ,  G01P15/097 ,  G01P15/125

CPC classification number: G01P15/18 ,  G01P15/097 ,  G01P15/125 ,  G01P2015/0845

Abstract: A MEMS tri-axial accelerometer is provided with a sensing structure having: a single inertial mass, with a main extension in a horizontal plane defined by a first horizontal axis and a second horizontal axis and internally defining a first window that traverses it throughout a thickness thereof along a vertical axis orthogonal to the horizontal plane; and a suspension structure, arranged within the window for elastically coupling the inertial mass to a single anchorage element, which is fixed with respect to a substrate and arranged within the window, so that the inertial mass is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component. In particular, the suspension structure has at least one first decoupling element for decoupling at least one of the first, second, and third sensing movements from the remaining sensing movements.

公开(公告)号：US20210190814A1

公开(公告)日：2021-06-24

申请号：US17122793

申请日：2020-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： Jean Marie DARMANIN ,  Carlo VALZASINA ,  Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

公开(公告)号：US20210155472A1

公开(公告)日：2021-05-27

申请号：US17164546

申请日：2021-02-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Lorenzo CORSO

IPC: B81B7/00 ,  B81C1/00

Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.

公开(公告)号：US20230184806A1

公开(公告)日：2023-06-15

申请号：US18147629

申请日：2022-12-28

Applicant: STMicroelectronics S.r.l.

Inventor： Gabriele GATTERE ,  Francesco RIZZINI ,  Alessandro TOCCHIO

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P2015/0874

Abstract: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

公开(公告)号：US20170108530A1

公开(公告)日：2017-04-20

申请号：US15182317

申请日：2016-06-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Francesco RIZZINI ,  Luca GUERINONI

IPC: G01P15/125 ,  G01P1/00

CPC classification number: G01P15/125 ,  B81B3/0072 ,  G01C19/5755 ,  G01P1/00 ,  G01P2015/0814

Abstract: A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.

公开(公告)号：US20170088416A1

公开(公告)日：2017-03-30

申请号：US15083034

申请日：2016-03-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Carlo VALZASINA ,  Luca GUERINONI ,  Giorgio ALLEGATO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00325 ,  B81C2203/0792 ,  H01L23/055 ,  H01L23/13 ,  H01L23/16 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

公开(公告)号：US20230296643A1

公开(公告)日：2023-09-21

申请号：US18322488

申请日：2023-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Jean Marie DARMANIN ,  Carlo VALZASINA ,  Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

公开(公告)号：US20200174035A1

公开(公告)日：2020-06-04

申请号：US16781963

申请日：2020-02-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125 ,  B81B3/00

Abstract: A MEMS accelerometric sensor includes a bearing structure and a suspended region that is made of semiconductor material, mobile with respect to the bearing structure. At least one modulation electrode is fixed to the bearing structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency. At least one variable capacitor is formed by the suspended region and by the modulation electrode in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal. A sensing assembly generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal indicating the position of the suspended region with respect to the bearing structure and includes a frequency-modulated component that is a function of the acceleration and of the first frequency.