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1.发明授权公开(公告)号：US12204092B2
公开(公告)日：2025-01-21
申请号：US17480634
申请日：2021-09-21
Applicant: STMicroelectronics S.r.l.
Inventor： Marco Del Sarto , Alex Gritti , Amedeo Maierna , Luca Maggi
Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.
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公开(公告)号：US11945714B2
公开(公告)日：2024-04-02
申请号：US17390634
申请日：2021-07-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Alex Gritti , Marco Del Sarto
CPC classification number: B81B7/0038 , B81C1/00285 , B81B2207/015 , B81C2203/0109
Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.
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3.发明授权公开(公告)号：US11383971B2
公开(公告)日：2022-07-12
申请号：US16518865
申请日：2019-07-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Fabio Quaglia , Marco Ferrera , Marco Del Sarto
Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.
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4.发明授权公开(公告)号：US11891298B2
公开(公告)日：2024-02-06
申请号：US17839131
申请日：2022-06-13
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Fabio Quaglia , Marco Ferrera , Marco Del Sarto
CPC classification number: B81B7/007 , B81B7/008 , B81C1/0023 , B81C2203/035 , H01L29/66
Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.
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公开(公告)号：US20220033251A1
公开(公告)日：2022-02-03
申请号：US17390634
申请日：2021-07-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Alex Gritti , Marco Del Sarto
Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.
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Patent Agency Ranking
公开(公告)号：US11524892B2
公开(公告)日：2022-12-13
申请号：US16834042
申请日：2020-03-30
Applicant: STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
Inventor： Kevin Formosa , Marco Del Sarto
Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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7.发明授权公开(公告)号：US10676347B2
公开(公告)日：2020-06-09
申请号：US15866380
申请日：2018-01-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Marco Del Sarto , Mikel Azpeitia Urquia
Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.
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公开(公告)号：US20180180649A1
公开(公告)日：2018-06-28
申请号：US15586903
申请日：2017-05-04
Applicant: STMicroelectronics S.r.l.
Inventor： Dario Paci , Paolo Angelini , Marco Del Sarto
CPC classification number: G01R15/202 , G01R15/205 , G01R15/207 , G01R19/0092
Abstract: An integrated current sensor device includes a supporting structure of conductive material, arranged within a package, and an integrated circuit die including a first and second magnetic-field sensor elements that are arranged along a sensor axis. An electronic circuit operatively coupled to the first and second magnetic-field sensor elements performs a differential detection of electric current. The supporting structure defines a current path for the electric current. The current path includes: a first path portion extending at the first magnetic-field sensor element; a second path portion extending at the second magnetic-field sensor element; and a third path portion that connects the first and second path portions. The first path portion and the second path portion are arranged on opposite sides of the sensor axis, and the third path portion crosses the sensor axis along a transverse axis.
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公开(公告)号：US12017910B2
公开(公告)日：2024-06-25
申请号：US18079704
申请日：2022-12-12
Applicant: STMicroelectronics (MALTA) Ltd , STMicroelectronics S.r.l.
Inventor： Kevin Formosa , Marco Del Sarto
CPC classification number: B81C1/00333 , B81B7/0077 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2203/0154 , B81C2203/0792
Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US11873215B2
公开(公告)日：2024-01-16
申请号：US17684317
申请日：2022-03-01
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Marco Del Sarto , Lorenzo Baldo
CPC classification number: B81C1/00325 , B81B3/0018 , B81C99/0005 , B81C2201/112
Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.
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