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公开(公告)号：US09520334B2
公开(公告)日：2016-12-13
申请号：US14155007
申请日：2014-01-14
Inventor： Laurent-Luc Chapelon , Pascal Ancey , Sandrine Lhostis
IPC: H01L23/34 , H01L23/36 , H01L23/427 , H01L23/433 , H01L25/065 , H01L23/31 , H01L23/48 , H01L29/06
CPC classification number: H01L23/36 , H01L23/3128 , H01L23/4275 , H01L23/4334 , H01L23/481 , H01L25/0657 , H01L29/0657 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06589
Abstract: An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Abstract translation: 集成结构包括支撑至少一个芯片的支撑件和附接到芯片的散热壳体。 壳体是导热的并具有与芯片兼容的热膨胀。 壳体还可以包括填充有相变材料的封闭空腔。
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公开(公告)号：US20150255705A1
公开(公告)日：2015-09-10
申请号：US14634454
申请日：2015-02-27
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： Emilie Trioux , Pascal Ancey , Stephane Monfray , Thomas Skotnicki , Skandar Basrour , Paul Muralt
CPC classification number: H01L41/27 , B32B15/01 , C22F1/00 , C23C4/10 , C23C4/134 , C23C10/12 , F03G7/06 , H01L41/0805 , H01L41/0815 , H01L41/33 , Y10T29/42 , Y10T29/49005 , Y10T29/49124
Abstract: A method of manufacturing bistable strips having different curvatures, each strip including a plurality of portion of layers of materials, wherein at least one specific layer portion is deposited by a plasma spraying method in conditions different for each of the strips.
Abstract translation: 制造具有不同曲率的双稳态条带的方法，每条条带包括多个材料层，其中至少一个特定层部分通过等离子体喷涂方法在对每个条带不同的条件下进行沉积。
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公开(公告)号：US09953895B2
公开(公告)日：2018-04-24
申请号：US14643837
申请日：2015-03-10
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： Pascal Ancey , Simon Gousseau , Olga Kokshagina
IPC: H01L21/768 , H01L23/34 , H01L23/48 , H05K7/20 , F28D15/04 , H01L23/427 , H01L23/473 , H01L21/48 , H01L21/3205 , H01L21/3065 , H01L21/02 , H01L23/367 , F28D15/02
CPC classification number: H01L23/427 , F28D15/04 , F28D15/046 , F28D2015/0225 , H01L21/02164 , H01L21/30655 , H01L21/32051 , H01L21/32056 , H01L21/4803 , H01L23/367 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
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Patent Agency Ranking
公开(公告)号：US20180076114A1
公开(公告)日：2018-03-15
申请号：US15816990
申请日：2017-11-17
Applicant: STMICROELECTRONICS SA , STMICROELECTRONICS (CROLLES 2) SAS
Inventor： Pascal Ancey , Simon Gousseau , Olga Kokshagina
IPC: H01L23/427 , H01L21/3205 , F28D15/04 , H01L23/473 , H01L23/367 , H01L21/48 , H01L21/3065 , H01L21/02 , F28D15/02
CPC classification number: H01L23/427 , F28D15/04 , F28D15/046 , F28D2015/0225 , H01L21/02164 , H01L21/30655 , H01L21/32051 , H01L21/32056 , H01L21/4803 , H01L23/367 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
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公开(公告)号：US20140210071A1
公开(公告)日：2014-07-31
申请号：US14155007
申请日：2014-01-14
Inventor： Laurent-Luc Chapelon , Pascal Ancey , Sandrine Lhostis
IPC: H01L23/36
CPC classification number: H01L23/36 , H01L23/3128 , H01L23/4275 , H01L23/4334 , H01L23/481 , H01L25/0657 , H01L29/0657 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06589
Abstract: An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Abstract translation: 集成结构包括支撑至少一个芯片的支撑件和附接到芯片的散热壳体。 壳体是导热的并具有与芯片兼容的热膨胀。 壳体还可以包括填充有相变材料的封闭空腔。
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公开(公告)号：US10312431B2
公开(公告)日：2019-06-04
申请号：US14634454
申请日：2015-02-27
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： Emilie Trioux , Pascal Ancey , Stephane Monfray , Thomas Skotnicki , Skandar Basrour , Paul Muralt
IPC: H01L41/27 , C23C4/134 , H01L41/08 , F03G7/06 , C23C4/10 , C23C10/12 , H01L41/33 , C22F1/00 , B32B15/01
Abstract: A method of manufacturing bistable strips having different curvatures, each strip including a plurality of portion of layers of materials, wherein at least one specific layer portion is deposited by a plasma spraying method in conditions different for each of the strips.
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公开(公告)号：US10186474B2
公开(公告)日：2019-01-22
申请号：US15816990
申请日：2017-11-17
Applicant: STMICROELECTRONICS SA , STMICROELECTRONICS (CROLLES 2) SAS
Inventor： Pascal Ancey , Simon Gousseau , Olga Kokshagina
IPC: H01L23/52 , H01L23/532 , H01L21/768 , H01L29/80 , H01L23/34 , H01L23/427 , H01L23/473 , H01L21/48 , H01L21/3205 , H01L21/3065 , H01L21/02 , H01L23/367 , F28D15/04 , F28D15/02
Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
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公开(公告)号：US20150262908A1
公开(公告)日：2015-09-17
申请号：US14643837
申请日：2015-03-10
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： Pascal Ancey , Simon Gousseau , Olga Kokshagina
IPC: H01L23/427 , H01L21/48 , F28D15/04 , H01L21/3065 , H01L21/02 , H01L23/367 , H01L23/473 , H01L21/3205
CPC classification number: H01L23/427 , F28D15/04 , F28D15/046 , F28D2015/0225 , H01L21/02164 , H01L21/30655 , H01L21/32051 , H01L21/32056 , H01L21/4803 , H01L23/367 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
Abstract translation: 一种制造热管的方法，包括以下步骤：在基板上形成圆柱形开口，所述圆柱形开口设置有围绕所述开口的中心轴线径向延伸的多个环状凹部; 在凹部中排列分离由催化碳纳米管生长的材料制成的环形条; 以及在所述环形条的开口中生长碳纳米管。
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