公开(公告)号：US20150044110A1

公开(公告)日：2015-02-12

申请号：US14451805

申请日：2014-08-05

Applicant: STMicroelectronics S.r.l.

Inventor： Lorenzo Colombo ,  Marco Salina ,  Daria Doria

IPC: B01L3/00 ,  B32B37/18 ,  G03F7/20 ,  B05D3/06 ,  B32B38/00 ,  B32B37/24 ,  B05D1/00 ,  B05D3/10

CPC classification number: B01L3/5027 ,  B01J19/0093 ,  B01J2219/0084 ,  B01L3/5088 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/089 ,  B01L2300/0893 ,  B01L2300/12 ,  B01L2300/165 ,  B05D1/005 ,  B05D3/06 ,  B05D3/107 ,  B32B37/18 ,  B32B37/24 ,  B32B38/00 ,  B32B2037/243 ,  B32B2038/0076 ,  B32B2255/00 ,  B32B2307/728 ,  B32B2310/0806 ,  B81B2201/0214 ,  B81B2201/051 ,  B81C1/00206 ,  G03F7/20

Abstract: A microfluidic device includes a support body having a first surface and a second surface opposite to one another. The first surface is hydrophilic. A surface modification layer extends over the first surface of the support body. At least one opening is formed to extend through the surface modification layer and expose a portion of the first surface. The surface modification layer is hydrophobic. In particular, the surface modification layer is made of a photodefinible material chosen from among: an epoxy resin, a polyamide, and a photocurable siloxane-based polymer. The openings are functionalized using probe molecules designed to bind with specific target molecules to be detected.

Abstract translation: 微流体装置包括具有第一表面和彼此相对的第二表面的支撑体。 第一个表面是亲水的。 表面改性层在支撑体的第一表面上延伸。 形成至少一个开口以延伸穿过表面改性层并暴露第一表面的一部分。 表面改性层是疏水性的。 特别地，表面改性层由选自以下的光可固化材料制成：环氧树脂，聚酰胺和光固化性硅氧烷基聚合物。 使用设计成与要检测的特异性靶分子结合的探针分子来使开口功能化。

公开(公告)号：US11887948B2

公开(公告)日：2024-01-30

申请号：US17391192

申请日：2021-08-02

Applicant: STMicroelectronics S.r.l.

Inventor： Simone Dario Mariani ,  Elisabetta Pizzi ,  Daria Doria

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/05 ,  H01L21/56 ,  H01L24/03 ,  H01L24/13 ,  H01L24/45 ,  H01L2224/0219 ,  H01L2224/02181 ,  H01L2224/03019 ,  H01L2224/0382 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05647

Abstract: A back end of line (BEOL) structure for an integrated circuit chip includes a last metal structure providing a bonding pad. A passivation structure over the bonding pad includes a first opening extending exposing an upper surface of the bonding pad. A conformal nitride layer extends over the passivation structure and is placed in contact with the upper surface of the bonding pad. An insulator material layer covers the conformal nitride layer and includes a second opening that extends through both the insulator material layer and the conformal nitride layer. A foot portion of the conformal nitride layer on the upper surface of the bonding pad is self-aligned with the second opening.