公开(公告)号：US12230555B2

公开(公告)日：2025-02-18

申请号：US18395122

申请日：2023-12-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US11894290B2

公开(公告)日：2024-02-06

申请号：US18150511

申请日：2023-01-05

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49537 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/49 ,  H01L2924/181

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US11562950B2

公开(公告)日：2023-01-24

申请号：US17227030

申请日：2021-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L23/28 ,  H01L21/00 ,  H05K7/20 ,  H05K7/18 ,  H01L23/31 ,  H01L23/00

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US10964627B2

公开(公告)日：2021-03-30

申请号：US16696698

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

公开(公告)号：US10535587B2

公开(公告)日：2020-01-14

申请号：US14961586

申请日：2015-12-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

公开(公告)号：US09570380B2

公开(公告)日：2017-02-14

申请号：US14870721

申请日：2015-09-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Vito Coppone ,  Agatino Minotti ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84 ,  H01L2924/00

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract translation: 一种电子设备，包括：集成电子部件的半导体管芯; 引线框架，其容纳半导体管芯; 保护体，其横向地和顶部包围半导体管芯，并且至少部分地围绕引线框架结构，限定电子器件的顶表面，底表面和厚度; 以及电连接到半导体管芯的导电引线。 导电引线被模制成能够延伸到保护体的整个厚度上，以形成从电子器件的顶表面可接近的前电接触，以及可从电子器件的底表面接近的后电接触。