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1.发明授权公开(公告)号：US11889624B2
公开(公告)日：2024-01-30
申请号：US17126339
申请日：2020-12-18
发明人： Yoshio Oka , Koji Nitta , Shoichiro Sakai , Yasushi Mochida , Tadahiro Kaibuki , Junichi Okaue
CPC分类号： H05K1/118 , H05K3/40 , H05K2203/068 , H05K2203/0723
摘要： A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.
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公开(公告)号：US11672082B2
公开(公告)日：2023-06-06
申请号：US17658710
申请日：2022-04-11
发明人： Junichi Motomura , Koji Nitta , Shoichiro Sakai , Kenji Takahashi , Maki Ikebe , Kousuke Miura , Masahiro Itoh
CPC分类号： H05K3/18 , C25D5/022 , C25D7/00 , C25D17/008 , H05K3/108 , H05K2203/0723
摘要： A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.
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3.发明授权公开(公告)号：US11659662B2
公开(公告)日：2023-05-23
申请号：US17126306
申请日：2020-12-18
发明人： Koji Nitta , Yasushi Mochida , Yoshio Oka , Shoichiro Sakai , Tadahiro Kaibuki , Junichi Okaue
CPC分类号： H05K1/118 , H05K1/0265 , H05K1/0298 , H05K3/241 , H05K3/361 , H05K2201/0338 , H05K2201/094 , H05K2201/09236 , H05K2201/09736 , H05K2203/0723
摘要： A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.
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公开(公告)号：US10952321B2
公开(公告)日：2021-03-16
申请号：US16621022
申请日：2018-08-06
发明人： Kenji Takahashi , Koji Nitta , Shoichiro Sakai , Junichi Okaue
摘要： A printed circuit board according to one aspect of the present invention includes an insulating layer having a through-hole, a conductive layer laminated on an inner circumferential surface of the through-hole, and metal plating layers laminated on a surface of the conductive layer facing opposite the insulating layer and laminated on both surfaces of the insulating layer, wherein an average thickness of the insulating layer is greater than or equal to 5 μm and less than or equal to 50 μm, wherein an average thickness of the metal plating layers is greater than or equal to 3 μm and less than or equal to 50 μm, wherein a hole diameter of the through-hole gradually increases from a first end of the through-hole at one surface of the insulating layer to a second end of the through-hole at another surface of the insulating layer, wherein the hole diameter of the through-hole at the first end is greater than or equal to 1.5 times, and less than or equal to 2.5 times, the average thickness of the metal plating layers, and wherein the hole diameter of the through-hole at the second end is greater than or equal to 1.1 times, and less than or equal to 2 times, the hole diameter of the through-hole at the first end thereof.
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公开(公告)号：US10917967B2
公开(公告)日：2021-02-09
申请号：US16977586
申请日：2019-03-06
发明人： Kenji Takahashi , Eiko Imazaki , Koji Nitta , Shoichiro Sakai , Kousuke Miura , Masahiro Matsumoto , Hirohisa Saito
摘要： A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 μm or greater and 35 μm or less at the first surface, and is 3 μm or greater and 15 μm or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 μm or greater and 12 μm or less.
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公开(公告)号：US09352966B2
公开(公告)日：2016-05-31
申请号：US14352175
申请日：2012-09-25
发明人： Atsushi Fukunaga , Shinji Inazawa , Koji Nitta , Shoichiro Sakai
IPC分类号： C01B21/086 , C01D13/00
CPC分类号： C01B21/086 , C01D13/00
摘要： A mixture of sulphamic acid, a halogenated sulphonic acid and thionyl chloride is heated to allow the reaction to proceed, to thereby produce first intermediate products. The first intermediate products are then subjected to reaction with an alkali metal fluoride MF to produce second intermediate products. The second intermediate products is then subjected to reaction with the alkali metal fluoride MF in a polar solvent to obtain a desired product MN(SO2F)2 (where M is an alkali metal).
摘要翻译： 将氨基磺酸，卤代磺酸和亚硫酰氯的混合物加热以使反应进行，从而产生第一中间产物。 然后将第一中间产物与碱金属氟化物MF反应以产生第二中间产物。 然后将第二中间产物在极性溶剂中与碱金属氟化物MF反应，得到所需产物MN（SO2F）2（其中M为碱金属）。
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公开(公告)号：US20160079632A1
公开(公告)日：2016-03-17
申请号：US14784885
申请日：2014-03-03
发明人： Atsushi Fukunaga , Shinji Inazawa , Koji Nitta , Shoichiro Sakai , Eiko Imazaki , Koma Numata
IPC分类号： H01M10/39
CPC分类号： H01M10/399 , H01M10/054 , H01M10/0569 , H01M2300/0045 , H01M2300/0048
摘要： Provided are a molten-salt electrolyte having good charge-discharge cycle characteristics and a sodium molten-salt battery using the same. The molten-salt electrolyte contains an ionic liquid whose ultraviolet-visible absorption spectrum does not have an absorption peak attributable to impurities in a wavelength range of 200 to 500 nm, and a sodium salt. The sodium molten-salt battery includes a positive electrode that contains a positive electrode active material, a negative electrode that contains a negative electrode active material, and the molten-salt electrolyte. The ionic liquid is preferably a salt of an organic onium cation and a bis(sulfonyl)imide anion.
摘要翻译： 提供了具有良好的充放电循环特性的熔盐电解质和使用该熔融盐电解质的钠熔盐电池。 熔盐电解质含有其紫外可见吸收光谱不具有归属于200〜500nm波长范围的杂质的吸收峰的离子液体和钠盐。 钠熔融盐电池包括含有正极活性物质的正极，含有负极活性物质的负极和熔融盐电解质。 离子液体优选为有机鎓阳离子和双（磺酰基）酰亚胺阴离子的盐。
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公开(公告)号：US11979983B2
公开(公告)日：2024-05-07
申请号：US17595942
申请日：2019-07-04
发明人： Maki Ikebe , Koji Nitta , Shoichiro Sakai
摘要： A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 μm or greater and 20 μm or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IR220 of an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less,
IR220=I220/(I111+I220+I311) (1)
(where I111, I200, I220, I311 are respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).-
公开(公告)号：US20170324086A1
公开(公告)日：2017-11-09
申请号：US15526707
申请日：2015-11-12
发明人： Koji Nitta , Shoichiro Sakai , Atsushi Fukunaga , Eiko Imazaki , Koma Numata , Hideaki Ito , Hitoshi Kobayashi , Toshiaki Yamashita
IPC分类号： H01M4/38 , H01M10/0564
CPC分类号： H01M4/381 , H01G11/04 , H01G11/30 , H01G11/62 , H01G11/86 , H01M4/0459 , H01M4/134 , H01M4/1395 , H01M4/362 , H01M10/054 , H01M10/0564 , H01M10/0566 , Y02E60/13
摘要： Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.
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10.发明申请公开(公告)号：US20170309958A1
公开(公告)日：2017-10-26
申请号：US15517456
申请日：2015-10-05
发明人： Shoichiro Sakai , Koji Nitta , Atsushi Fukunaga , Eiko Imazaki , Masahiro Aoki
IPC分类号： H01M10/0566 , H01M10/0561 , H01M4/36
CPC分类号： H01M10/0566 , H01M4/36 , H01M10/054 , H01M10/0561 , H01M10/0569
摘要： Provided are an electrolytic solution for sodium-ion secondary battery, the solution having sodium-ion conductivity, and including a sodium salt and a non-aqueous solvent, wherein the non-aqueous solvent includes a fluorophosphate ester and propylene carbonate, and a content of the fluorophosphate ester in the non-aqueous solvent is 5 to 50 mass %; and a sodium-ion secondary battery including the same.
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