公开(公告)号：US20150274894A1

公开(公告)日：2015-10-01

申请号：US14401920

申请日：2013-05-20

Applicant: SUMITOMO OSAKA CEMENT CO., LTD

Inventor： Yoichi Sato ,  Yasuyuki Kuriono ,  Takeshi Otsuka ,  Takeru Yamaguchi ,  Kenji Harada

IPC: C08G77/38 ,  G02F1/1335 ,  C07F7/00 ,  H01L33/56 ,  C07F7/28

CPC classification number: G02F1/1336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K3/22 ,  C08K5/56 ,  C08K9/06 ,  C08K2003/2244 ,  C08K2201/008 ,  C08K2201/011 ,  C08L83/00 ,  C08L83/04 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/2982

Abstract: By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

Abstract translation: 通过使用通过使用至少具有苯基的表面改性材料和平均一次粒径为3nm以上且10nm以下的金属氧化物粒子进行表面改性而得到的表面改性金属氧化物粒子材料， 能够与有机硅树脂形成组分中的官能团发生交联反应的基团，表面改性的金属氧化物颗粒材料，其具有高耐热性，并且当用于光学用密封材料时可以进一步显示高透明性和阻气性 半导体发光元件等，分别含有表面改性金属氧化物粒子材料的分散液，有机硅树脂组合物和有机硅树脂复合体，以及光半导体发光元件，灯具 还提供了使用有机硅树脂复合材料的液晶成像装置。

公开(公告)号：US09651821B2

公开(公告)日：2017-05-16

申请号：US14401920

申请日：2013-05-20

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yoichi Sato ,  Yasuyuki Kurino ,  Takeshi Otsuka ,  Takeru Yamaguchi ,  Kenji Harada

IPC: C08G77/12 ,  G02F1/1335 ,  H01L33/56 ,  C08G77/20 ,  C08K9/06 ,  C08G77/00 ,  C09D183/04 ,  C08K5/56 ,  C08L83/04 ,  C08K3/22

CPC classification number: G02F1/1336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K3/22 ,  C08K5/56 ,  C08K9/06 ,  C08K2003/2244 ,  C08K2201/008 ,  C08K2201/011 ,  C08L83/00 ,  C08L83/04 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/2982

Abstract: By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

公开(公告)号：US20150221836A1

公开(公告)日：2015-08-06

申请号：US14424957

申请日：2013-08-26

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/50 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L33/501 ,  H01L33/58 ,  H01L2933/0091

Abstract: An optical semiconductor light emitting device which emits white light, includes: an optical semiconductor light emitting element; and an optical conversion layer containing phosphor particles, in which a specific light scattering composition is contained in the optical conversion layer or a light scattering layer containing a specific light scattering composition is provided on the optical conversion layer. An illumination apparatus and a display apparatus including the same are also provided.

Abstract translation: 发射白光的光半导体发光器件包括：光半导体发光元件; 并且在光转换层上设置有光转换层中含有特定光散射组合物的光转换层或含有特定光散射组合物的光散射层。 还提供了一种照明装置和包括该照明装置的显示装置。

公开(公告)号：US10269670B2

公开(公告)日：2019-04-23

申请号：US15739748

申请日：2016-06-22

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Takeru Yamaguchi ,  Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Kenji Harada

IPC: H01L23/29 ,  H01L23/28 ,  H01L33/56 ,  H01L23/06 ,  H01L23/08 ,  H01L33/52 ,  C08K9/04 ,  H01L23/31 ,  B32B27/28 ,  C08L83/04

Abstract: A curable silicone resin composition is provided, including (A) a curable silicone resin-forming component of which a viscosity is 0.02 Pa·s or greater and 100 Pa·s or less, (B) surface-modified metal oxide particles which are surface-modified by a surface-modifying material having a reactive functional group and have an average primary particle diameter of 3 nm or more and 10 nm or less, and (C) a silicone compound having a reactive functional group of which a viscosity is less than the viscosity of the (A) component and is 0.01 Pa·s or greater and 1.0 Pa·s or less and having a content of 0.1% by mass or more and 15% by mass or less based on a total amount of the composition, in which a viscosity is 1.0 Pa·s or greater and 100 Pa·s or less.

公开(公告)号：US09972757B2

公开(公告)日：2018-05-15

申请号：US14383244

申请日：2013-03-08

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/56 ,  C01G25/02 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/053 ,  C09C1/36 ,  C09C1/04 ,  C09C1/30 ,  C08G77/398 ,  H01L33/50 ,  C09D183/04 ,  H01L23/29 ,  C08G77/20 ,  C08K3/22 ,  B82Y20/00

CPC classification number: H01L33/56 ,  B82Y20/00 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/0536 ,  C01G25/02 ,  C01P2004/64 ,  C01P2006/22 ,  C08G77/20 ,  C08G77/398 ,  C08K2003/2241 ,  C08K2003/2244 ,  C09C1/043 ,  C09C1/3081 ,  C09C1/3684 ,  C09D183/04 ,  H01L23/293 ,  H01L33/501 ,  H01L33/507 ,  H01L2924/0002 ,  Y10T428/2982 ,  C08K3/22 ,  H01L2924/00

Abstract: There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C. is 1000 Pa·s or less, and transmittance of light at a wavelength of 400 nm to 800 nm and a thickness of 1 mm is 60% or greater, a composition for sealing optical semiconductor element, and an optical semiconductor device using the same.

公开(公告)号：US20150021643A1

公开(公告)日：2015-01-22

申请号：US14383244

申请日：2013-03-08

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/56 ,  C08G77/398 ,  H01L33/50

CPC classification number: H01L33/56 ,  B82Y20/00 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/0536 ,  C01G25/02 ,  C01P2004/64 ,  C01P2006/22 ,  C08G77/20 ,  C08G77/398 ,  C08K2003/2241 ,  C08K2003/2244 ,  C09C1/043 ,  C09C1/3081 ,  C09C1/3684 ,  C09D183/04 ,  H01L23/293 ,  H01L33/501 ,  H01L33/507 ,  H01L2924/0002 ,  Y10T428/2982 ,  C08K3/22 ,  H01L2924/00

Abstract: There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C. is 1000 Pa·s or less, and transmittance of light at a wavelength of 400 nm to 800 nm and a thickness of 1 mm is 60% or greater, a composition for sealing optical semiconductor element, and an optical semiconductor device using the same.

Abstract translation: 提供了表面改性金属氧化物颗粒材料，其包括通过用表面改性材料对金属氧化物颗粒进行表面改性获得的表面改性金属氧化物颗粒，其中表面改性材料包括预定的 硅化合物，金属氧化物粒子的平均一次粒径为3nm〜nm，25℃下的粘度为1000Pa·s以下，波长400nm〜800nm的光的透过率和厚度 1mm为60％以上，用于密封光半导体元件的组合物和使用其的光学半导体器件。