公开(公告)号：US09651821B2

公开(公告)日：2017-05-16

申请号：US14401920

申请日：2013-05-20

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yoichi Sato ,  Yasuyuki Kurino ,  Takeshi Otsuka ,  Takeru Yamaguchi ,  Kenji Harada

IPC: C08G77/12 ,  G02F1/1335 ,  H01L33/56 ,  C08G77/20 ,  C08K9/06 ,  C08G77/00 ,  C09D183/04 ,  C08K5/56 ,  C08L83/04 ,  C08K3/22

CPC classification number: G02F1/1336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K3/22 ,  C08K5/56 ,  C08K9/06 ,  C08K2003/2244 ,  C08K2201/008 ,  C08K2201/011 ,  C08L83/00 ,  C08L83/04 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/2982

Abstract: By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

公开(公告)号：US09466518B2

公开(公告)日：2016-10-11

申请号：US14286898

申请日：2014-05-23

Applicant: Sumitomo Osaka Cement Co., Ltd.

Inventor： Shinichi Maeta ,  Mamoru Kosakai ,  Yukio Miura ,  Takeshi Otsuka

IPC: H05F3/00 ,  H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  G03F7/20 ,  H01J37/32

CPC classification number: H01L21/6831 ,  G03F7/707 ,  G03F7/70708 ,  H01J37/32715 ,  H01L21/67109 ,  H01L21/68735 ,  H01L21/6875

Abstract: An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced.In an electrostatic chuck device 1 provided with an electrostatic chuck section 2 which has a placement plate 11, an upper surface 11a of which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plate 12 integrated with the placement plate 11, and an internal electrode for electrostatic adsorption 13 and an insulating material layer 14 which are provided between the placement plate 11 and the support plate 12, an annular projection portion 21 is provided at a peripheral border portion on the upper surface 11a, a plurality of projection portions 22 having the same height as the height of the annular projection portion 21 are provided in an area surrounded by the annular projection portion 21 of the upper surface 11a, and an upper end portion of the annular projection portion 21 and an upper end portion of each of the plurality of projection portions 22 are located on a concave surface 23 with a central portion of the upper surface 11a as a basal plane.

Abstract translation: 在设置有具有放置板11的静电卡盘部2的静电卡盘装置1中，其上表面11a是放置有诸如半导体晶片的板状样品W的放置表面，支撑板12 与放置板11和设置在放置板11和支撑板12之间的静电吸附用内部电极13和绝缘材料层14一体化的环状突起部21设置在上部的周边边界部 表面11a，在由上表面11a的环形突出部分21围绕的区域中设置有与环形突出部分21的高度相同高度的多个突出部分22，并且环形突起部分的上端部分 21，并且多个突出部22中的每一个的上端部位于凹面23上，上表面的中心部分 11a作为基础飞机。

公开(公告)号：US09150698B2

公开(公告)日：2015-10-06

申请号：US14576945

申请日：2014-12-19

Applicant: SUMITOMO OSAKA CEMENT CO., LTD. ,  Kyoto University

Inventor： Takeshi Otsuka ,  Yoshiki Chujo

IPC: C08L83/04 ,  C08G77/44 ,  C08K9/06 ,  C09C3/10 ,  C08G77/398 ,  B82Y30/00 ,  C01G25/02 ,  C09C1/00 ,  C09C1/30 ,  C09C3/12 ,  C08L83/08 ,  C09D183/06 ,  C08G77/38 ,  C08G77/14

CPC classification number: C08G77/398 ,  B82Y30/00 ,  C01G25/02 ,  C01P2004/64 ,  C08G77/14 ,  C08G77/38 ,  C08L83/08 ,  C09C1/00 ,  C09C1/3063 ,  C09C1/3081 ,  C09C1/309 ,  C09C3/12 ,  C09D183/06

Abstract: A method of manufacturing a composite composition, having: bonding a dispersant to the surfaces of inorganic oxide particles to provide dispersibility in a hydrophobic solvent to the inorganic oxide particles, and then dispersing the inorganic oxide particles in a hydrophobic solvent; substituting the dispersant bonded to the surfaces of the inorganic oxide particles with a surface modifier, which is a polydimethylsiloxane-skeleton polymer having one functional group at one terminal end, in the hydrophobic solvent in which the organic oxide particles are dispersed to bond the functional group of the polydimethylsiloxane-skeleton polymer to the surfaces of the inorganic oxide particles; and conjugating a silicone resin and the inorganic oxide particles obtained in the previous step, wherein the surface thereof is modified by bonding the polydimethylsiloxane-skeleton polymer having one functional group at one terminal end thereof, to obtain a composite composition.

公开(公告)号：US20150221836A1

公开(公告)日：2015-08-06

申请号：US14424957

申请日：2013-08-26

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/50 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L33/501 ,  H01L33/58 ,  H01L2933/0091

Abstract: An optical semiconductor light emitting device which emits white light, includes: an optical semiconductor light emitting element; and an optical conversion layer containing phosphor particles, in which a specific light scattering composition is contained in the optical conversion layer or a light scattering layer containing a specific light scattering composition is provided on the optical conversion layer. An illumination apparatus and a display apparatus including the same are also provided.

Abstract translation: 发射白光的光半导体发光器件包括：光半导体发光元件; 并且在光转换层上设置有光转换层中含有特定光散射组合物的光转换层或含有特定光散射组合物的光散射层。 还提供了一种照明装置和包括该照明装置的显示装置。

公开(公告)号：US10269670B2

公开(公告)日：2019-04-23

申请号：US15739748

申请日：2016-06-22

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Takeru Yamaguchi ,  Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Kenji Harada

IPC: H01L23/29 ,  H01L23/28 ,  H01L33/56 ,  H01L23/06 ,  H01L23/08 ,  H01L33/52 ,  C08K9/04 ,  H01L23/31 ,  B32B27/28 ,  C08L83/04

Abstract: A curable silicone resin composition is provided, including (A) a curable silicone resin-forming component of which a viscosity is 0.02 Pa·s or greater and 100 Pa·s or less, (B) surface-modified metal oxide particles which are surface-modified by a surface-modifying material having a reactive functional group and have an average primary particle diameter of 3 nm or more and 10 nm or less, and (C) a silicone compound having a reactive functional group of which a viscosity is less than the viscosity of the (A) component and is 0.01 Pa·s or greater and 1.0 Pa·s or less and having a content of 0.1% by mass or more and 15% by mass or less based on a total amount of the composition, in which a viscosity is 1.0 Pa·s or greater and 100 Pa·s or less.

公开(公告)号：US09972757B2

公开(公告)日：2018-05-15

申请号：US14383244

申请日：2013-03-08

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/56 ,  C01G25/02 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/053 ,  C09C1/36 ,  C09C1/04 ,  C09C1/30 ,  C08G77/398 ,  H01L33/50 ,  C09D183/04 ,  H01L23/29 ,  C08G77/20 ,  C08K3/22 ,  B82Y20/00

CPC classification number: H01L33/56 ,  B82Y20/00 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/0536 ,  C01G25/02 ,  C01P2004/64 ,  C01P2006/22 ,  C08G77/20 ,  C08G77/398 ,  C08K2003/2241 ,  C08K2003/2244 ,  C09C1/043 ,  C09C1/3081 ,  C09C1/3684 ,  C09D183/04 ,  H01L23/293 ,  H01L33/501 ,  H01L33/507 ,  H01L2924/0002 ,  Y10T428/2982 ,  C08K3/22 ,  H01L2924/00

Abstract: There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C. is 1000 Pa·s or less, and transmittance of light at a wavelength of 400 nm to 800 nm and a thickness of 1 mm is 60% or greater, a composition for sealing optical semiconductor element, and an optical semiconductor device using the same.

公开(公告)号：US20150021643A1

公开(公告)日：2015-01-22

申请号：US14383244

申请日：2013-03-08

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yasuyuki Kurino ,  Takeshi Otsuka ,  Yoichi Sato ,  Takeru Yamaguchi ,  Kenji Harada

IPC: H01L33/56 ,  C08G77/398 ,  H01L33/50

CPC classification number: H01L33/56 ,  B82Y20/00 ,  B82Y30/00 ,  C01G9/02 ,  C01G23/0536 ,  C01G25/02 ,  C01P2004/64 ,  C01P2006/22 ,  C08G77/20 ,  C08G77/398 ,  C08K2003/2241 ,  C08K2003/2244 ,  C09C1/043 ,  C09C1/3081 ,  C09C1/3684 ,  C09D183/04 ,  H01L23/293 ,  H01L33/501 ,  H01L33/507 ,  H01L2924/0002 ,  Y10T428/2982 ,  C08K3/22 ,  H01L2924/00

Abstract: There is provided a surface-modified-metal-oxide-particle material including surface-modified-metal-oxide-particles obtained by performing surface modification on metal oxide particles with a surface-modifying material, in which the surface-modifying material includes a predetermined silicone compound, an average primary particle diameter of the metal oxide particles is 3 nm to nm, viscosity at 25° C. is 1000 Pa·s or less, and transmittance of light at a wavelength of 400 nm to 800 nm and a thickness of 1 mm is 60% or greater, a composition for sealing optical semiconductor element, and an optical semiconductor device using the same.

Abstract translation: 提供了表面改性金属氧化物颗粒材料，其包括通过用表面改性材料对金属氧化物颗粒进行表面改性获得的表面改性金属氧化物颗粒，其中表面改性材料包括预定的 硅化合物，金属氧化物粒子的平均一次粒径为3nm〜nm，25℃下的粘度为1000Pa·s以下，波长400nm〜800nm的光的透过率和厚度 1mm为60％以上，用于密封光半导体元件的组合物和使用其的光学半导体器件。

公开(公告)号：US11692080B2

公开(公告)日：2023-07-04

申请号：US16626329

申请日：2018-08-01

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Kenji Harada ,  Takeshi Otsuka

IPC: C08K9/06 ,  C09C3/10 ,  H01L33/56

CPC classification number: C08K9/06 ,  C09C3/10 ,  H01L33/56

Abstract: Provided is a dispersion liquid for sealing a light-emitting element containing metal oxide particles having a refractive index of 1.7 or higher and a surface-modifying material at least partially attached to the metal oxide particles, in which a particle diameter D50 of the metal oxide particles when a cumulative percentage of a scattering intensity distribution obtained by a dynamic light scattering method is 50% is 30 nm or more and 100 nm or less, and a content of the surface-modifying material not attached to the metal oxide particles is 60% by mass or less with respect to a total content of the metal oxide particles and the surface-modifying material.

公开(公告)号：US11359072B2

公开(公告)日：2022-06-14

申请号：US16626335

申请日：2018-08-01

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Kenji Harada ,  Takeshi Otsuka

IPC: C08K9/06 ,  C09C3/10 ,  H01L33/56

Abstract: Provided is a dispersion liquid for sealing a light-emitting element containing metal oxide particles having a refractive index of 1.7 or higher and a surface-modifying material at least partially attached to the metal oxide particles, in which a particle diameter D50 of the metal oxide particles when a cumulative percentage of a scattering intensity distribution obtained by a dynamic light scattering method is 50% is 30 nm or more and 100 nm or less, and a value D50/D90 obtained by dividing the particle diameter D50 of the metal oxide particles when the cumulative percentage of the scattering intensity distribution is 50% by a particle diameter D90 of the metal oxide particles when the cumulative percentage of the scattering intensity distribution is 90% is 0.20 or more.

公开(公告)号：US20140355169A1

公开(公告)日：2014-12-04

申请号：US14286898

申请日：2014-05-23

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Shinichi Maeta ,  Mamoru Kosakai ,  Yukio Miura ,  Takeshi Otsuka

IPC: H01L21/683

CPC classification number: H01L21/6831 ,  G03F7/707 ,  G03F7/70708 ,  H01J37/32715 ,  H01L21/67109 ,  H01L21/68735 ,  H01L21/6875

Abstract: An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced.In an electrostatic chuck device 1 provided with an electrostatic chuck section 2 which has a placement plate 11, an upper surface 11a of which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plate 12 integrated with the placement plate 11, and an internal electrode for electrostatic adsorption 13 and an insulating material layer 14 which are provided between the placement plate 11 and the support plate 12, an annular projection portion 21 is provided at a peripheral border portion on the upper surface 11a, a plurality of projection portions 22 having the same height as the height of the annular projection portion 21 are provided in an area surrounded by the annular projection portion 21 of the upper surface 11a, and an upper end portion of the annular projection portion 21 and an upper end portion of each of the plurality of projection portions 22 are located on a concave surface 23 with a central portion of the upper surface 11a as a basal plane.

Abstract translation: 提供了一种静电卡盘装置，其中不考虑板状样品在吸附板状样品时可能变形，或者当分离板状样品时，板状样品的温度均匀化，颗粒的颗粒 不容易生产。 在设置有具有放置板11的静电卡盘部2的静电卡盘装置1中，其上表面11a是放置有诸如半导体晶片的板状样品W的放置表面，支撑板12 与放置板11和设置在放置板11和支撑板12之间的静电吸附用内部电极13和绝缘材料层14一体化的环状突起部21设置在上部的周边边界部 表面11a，在由上表面11a的环形突出部分21围绕的区域中设置有与环形突出部分21的高度相同高度的多个突出部分22，并且环形突起部分的上端部分 21，并且多个突出部22中的每一个的上端部位于凹面23上，上表面的中心部分 11a作为基础飞机。