Source side boron implant and drain side MDD implant for deep sub 0.18 micron flash memory
    1.
    发明授权
    Source side boron implant and drain side MDD implant for deep sub 0.18 micron flash memory 有权
    源极硼注入和漏极侧MDD植入物用于深亚0.18微米闪存

    公开(公告)号:US06653189B1

    公开(公告)日:2003-11-25

    申请号:US09699711

    申请日:2000-10-30

    IPC分类号: H01L21336

    CPC分类号: H01L29/66825 H01L29/66833

    摘要: One aspect of the present invention relates to a method of making a flash memory cell, involving the steps of providing a substrate having a flash memory cell thereon; forming a self-aligned source mask over the substrate, the self aligned source mask having openings corresponding to source lines; implanting a source dopant of a first type in the substrate through the openings in the self-aligned source mask corresponding to source lines; removing the self-aligned source mask from the substrate; forming a MDD mask over the substrate, the MDD mask covering the source lines and having openings corresponding to drain lines; and implanting a medium dosage drain implant of a second type to form a drain region in the substrate adjacent the flash memory cell.

    摘要翻译: 本发明的一个方面涉及一种制造闪存单元的方法,包括以下步骤:在其上提供闪存单元; 在衬底上形成自对准源掩模,所述自对准源掩模具有对应于源极线的开口; 通过对应于源极线的自对准源掩模中的开口将衬底中的第一类型源掺杂剂注入到衬底中; 从衬底去除自对准源掩模; 在衬底上形成MDD掩模,MDD掩模覆盖源极线并具有对应于漏极线的开口; 以及植入第二类型的介质剂量漏极注入,以在与所述闪存单元相邻的所述衬底中形成漏极区域。

    Method for reading a non-volatile memory cell
    6.
    发明授权
    Method for reading a non-volatile memory cell 失效
    读取非易失性存储单元的方法

    公开(公告)号:US06795357B1

    公开(公告)日:2004-09-21

    申请号:US10283590

    申请日:2002-10-30

    IPC分类号: G11C700

    摘要: A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises applying a source voltage to a first bit line that is the source of the selected memory cell and applying a drain voltage to a second bit line that forms a drain junction with the channel region. The source voltage may be a small positive voltage and the drain voltage may be greater than the source voltage. A read voltage is applied to a selected one of the word lines that forms a gate over the charge storage region and a bias voltage is applied to non-selected word lines in the array. The bias voltage may be a negative voltage.

    摘要翻译: 检测存储在双位介质存储器单元阵列内的第一双位介质存储单元的电荷存储区域上的电荷的方法包括将源电压施加到作为所选存储单元的源的第一位线并施加 到与沟道区形成漏极结的第二位线的漏极电压。 源极电压可以是小的正电压,并且漏极电压可能大于源极电压。 将读取电压施加到在电荷存储区域上形成栅极的所选择的一条字线,并且将偏置电压施加到阵列中的未选择的字线。 偏置电压可以是负电压。

    Pre-charge method for reading a non-volatile memory cell
    7.
    发明授权
    Pre-charge method for reading a non-volatile memory cell 失效
    用于读取非易失性存储单元的预充电方法

    公开(公告)号:US06788583B2

    公开(公告)日:2004-09-07

    申请号:US10307749

    申请日:2002-12-02

    IPC分类号: G11C1606

    摘要: A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises grounding a first bit line that forms a source junction with a channel region of the first memory cell. A high voltage is applied to a gate of the first memory cell and to a second bit line that is the next bit line to the right of the first bit line and separated from the first bit line only by the channel region. A third bit line, that is the next bit line to the right of the second bit line, is isolated such that its potential is effected only by its junctions with the a second channel region and a third channel region on opposing sides of the third bit line. A high voltage is applied to a pre-charge bit line that is to the right of the third bit line and current flow is detected at the second bit line to determine the programmed status of a source bit of the memory cell.

    摘要翻译: 一种检测存储在双位介质存储器单元阵列内的第一双位介质存储单元的电荷存储区域上的电荷的方法包括使与第一存储单元的沟道区形成源极结的第一位线接地。 高电压被施加到第一存储单元的栅极和第二位线,第二位线是第一位线右侧的下一个位线,并且仅与通道区域从第一位线分离。 位于第二位线右侧的下一个位线的第三位线是隔离的,使得其电位仅由其与第二通道区域的结和仅在第三位的相对侧上的第三通道区域 线。 将高电压施加到位于第三位线右侧的预充电位线,并且在第二位线处检测电流以确定存储器单元的源位的编程状态。

    Method of protecting a memory array from charge damage during fabrication
    10.
    发明授权
    Method of protecting a memory array from charge damage during fabrication 有权
    在制造期间保护存储器阵列免受电荷损伤的方法

    公开(公告)号:US06897110B1

    公开(公告)日:2005-05-24

    申请号:US10305750

    申请日:2002-11-26

    摘要: A method of fabricating a memory array, while protecting it from charge damage. Bitlines that may have source/drain regions of memory cells are formed in a substrate. Wordlines are formed above the bitlines and may have gate regions. Next, a first metal region that is coupled to one of the bitlines is formed above the bitlines. A second metal region that is not electrically coupled to the first metal region is formed. Then, the first metal region is electrically coupled to the second metal region. Charge damage is reduced by keeping the antenna ratio between the first metal region and the bitline low. For further protection, a diode or fuse may also be formed between the substrate and the portion of the metal region that is coupled to the bitline. Also, fuse may be formed between a bitline and a wordline to protect the wordline.

    摘要翻译: 一种制造存储器阵列的方法,同时保护其免受电荷损坏。 可以在衬底中形成可能具有存储器单元的源极/漏极区的位线。 字线形成在位线之上,并且可以具有栅极区域。 接下来,在位线之上形成耦合到位线之一的第一金属区域。 形成不与第一金属区电耦合的第二金属区域。 然后,第一金属区域电耦合到第二金属区域。 通过保持第一金属区域和位线之间的天线比率降低来减少电荷损坏。 为了进一步的保护,还可以在衬底和耦合到位线的金属区域的部分之间形成二极管或保险丝。 此外,可以在位线和字线之间形成保险丝,以保护字线。