Method for fabricating array substrate and fabrication apparatus used therefor
    2.
    发明授权
    Method for fabricating array substrate and fabrication apparatus used therefor 有权
    制造阵列基板的方法及其制造装置

    公开(公告)号:US09070715B2

    公开(公告)日:2015-06-30

    申请号:US13716972

    申请日:2012-12-17

    Abstract: Provided is a method for fabricating an array substrate. The method for fabricating the array substrate includes forming a semiconductor layer on a substrate, forming a gate electrode which is insulated from the semiconductor layer, forming source and drain electrodes which are insulated from the gate electrode and connected to the semiconductor layer, and forming a pixel electrode connected to the drain electrode. Here, at least one of the forming of the gate electrode, the forming of the source and drain electrodes, and the forming of the pixel electrode includes forming a conductive layer on the substrate, cooling the substrate on which the conductive layer is formed to a temperature of no greater than about 0° C., heating the cooled substrate, and patterning the conductive layer.

    Abstract translation: 提供了一种制造阵列基板的方法。 制造阵列基板的方法包括在基板上形成半导体层,形成与半导体层绝缘的栅电极,形成与栅电极绝缘并连接到半导体层的源电极和漏电极,并形成 像素电极连接到漏电极。 这里,形成栅电极,形成源电极和漏电极以及形成像素电极中的至少一个包括在衬底上形成导电层,将形成有导电层的衬底冷却到 温度不大于约0℃,加热冷却的基底,并图形化导电层。

    Display apparatus and method of manufacturing the same

    公开(公告)号:US11088356B2

    公开(公告)日:2021-08-10

    申请号:US16707818

    申请日:2019-12-09

    Abstract: In a method of manufacturing a display apparatus, the method includes: providing a first mother substrate; forming, on the first mother substrate, a pixel layer comprising a light-emitting device; providing a second mother substrate; forming, on the second mother substrate, a diffraction pattern layer configured to diffract light emitted from the light-emitting device; forming a bonded substrate structure by bonding the first mother substrate, on which the pixel layer is formed, and the second mother substrate, on which the diffraction pattern layer is formed; forming, by cutting the bonded substrate structure, a plurality of unit substrate structures each comprising a first substrate on which the pixel layer is formed and a second substrate on which the diffraction pattern layer is formed; forming a protection member on the diffraction pattern layer; and removing a foreign material on the diffraction pattern layer with the protection member.

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