ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20210055059A1

    公开(公告)日:2021-02-25

    申请号:US17094293

    申请日:2020-11-10

    摘要: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20210341229A1

    公开(公告)日:2021-11-04

    申请号:US17375626

    申请日:2021-07-14

    摘要: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    METHOD FOR MANAGING POWER OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREOF
    4.
    发明申请
    METHOD FOR MANAGING POWER OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREOF 审中-公开
    用于管理电子设备的功率的方法及其电子设备

    公开(公告)号:US20150241519A1

    公开(公告)日:2015-08-27

    申请号:US14625438

    申请日:2015-02-18

    IPC分类号: G01R31/36

    摘要: A method for managing power of an electronic device and the electronic device thereof are provided. An operation method of the electronic device includes detecting a remaining battery capacity, calculating and storing a reduced ratio per unit time of the remaining battery capacity and, based on the reduced ratio, predicting a remaining operating time of the battery.

    摘要翻译: 提供一种用于管理电子设备及其电子设备的电源的方法。 电子设备的操作方法包括检测剩余电池容量,计算和存储每单位时间剩余电池容量的减小比例,并且基于减小的比率来预测电池的剩余操作时间。

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20190364695A1

    公开(公告)日:2019-11-28

    申请号:US16515275

    申请日:2019-07-18

    IPC分类号: H05K7/20 F28D15/02

    摘要: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.