Package substrate and semiconductor package including the same

    公开(公告)号:US11342283B2

    公开(公告)日:2022-05-24

    申请号:US16810091

    申请日:2020-03-05

    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

    公开(公告)号:US20230130436A1

    公开(公告)日:2023-04-27

    申请号:US17743971

    申请日:2022-05-13

    Abstract: A semiconductor package includes a package substrate having a first surface and a second surface opposite to the first surface, and including a plurality of bonding pads exposed to the first surface and a plurality of solder bumps respectively disposed on the bonding pads, and at least one semiconductor device arranged on the package substrate. Each of the solder bumps includes a bump body disposed on the bonding pad, a plurality of bonding particles provided inside the bump body to be adjacent to the bonding pad, and a first metal compound layer provided to surround the bonding particles and having a protrusion structure for strengthening adhesion with the bonding pad.

    Electronic device and method for controlling application and component

    公开(公告)号:US10470133B2

    公开(公告)日:2019-11-05

    申请号:US15432477

    申请日:2017-02-14

    Abstract: An electronic device and an operating method thereof for monitoring, identifying and controlling an application and a component which excessively consume battery power are provided. The electronic device monitors an operation of an application installed therein or an operation of a component embedded therein. The electronic device checks the amount of power consumed for the operation of the application or the operation of the component at regular intervals, and based on the checked amount of power, determines whether the operation of the application or the operation of the component is an abnormal operation. If the operation of the application or the operation of the component is an abnormal operation, the electronic device identifies a policy corresponding to the abnormal operation and based on the identified policy, controls the operation of the application or the operation of the component to eliminate the abnormal operation.

    Method of controlling charging of battery and electronic device to which the method is applied

    公开(公告)号:US11495986B2

    公开(公告)日:2022-11-08

    申请号:US16774203

    申请日:2020-01-28

    Abstract: An electronic device is provided. The electronic device includes a housing, a power interface exposed through at least a portion of the housing to be connected to an external power source in a wired manner or disposed inside the housing to be connected to the external power source in a wireless manner, at least one battery disposed inside the housing and electrically connected to the power interface, a processor disposed inside the housing and operatively connected to the power interface, and a memory disposed inside the housing and operatively connected to the processor. The memory stores instructions that, when executed, causes the processor to, in a state in which an external power is supplied through the power interface, when a voltage of the battery reaches a first voltage value, lower the voltage of the battery to a second voltage value lower than the first voltage value by discharging the battery after a first time has elapsed from a time point at which the voltage of the battery reaches the first voltage value.

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