HIGH BANDWIDTH MEMORY SYSTEM USING MULTILEVEL SIGNALING

    公开(公告)号:US20220238146A1

    公开(公告)日:2022-07-28

    申请号:US17483010

    申请日:2021-09-23

    Abstract: A high bandwidth memory system includes a motherboard; and a semiconductor package coupled to the motherboard. The semiconductor package includes a package substrate mounted on the motherboard and including signal lines providing a plurality of channels; a first semiconductor device mounted on the package substrate and including a first physical layer (PHY) circuit; and a second semiconductor device mounted on the package substrate and including a second PHY circuit. The first semiconductor device and the second semiconductor device exchange a data signal with each other through the plurality of channels, the data signal is a multilevel signal having M levels, where M is a natural number greater than 2, and the first PHY circuit compensates for distortion of the channels and performs digital signal processing to compensate for a mismatch between the channels.

    Storage controller and storage device including the same

    公开(公告)号:US11194655B2

    公开(公告)日:2021-12-07

    申请号:US16775587

    申请日:2020-01-29

    Abstract: A storage device includes a non-volatile memory including a plurality of memory blocks and a storage controller configured to control a read operation of the non-volatile memory. The storage controller receives power-off time information indicating a power-off time point at which the storage device is powered off, and power-on time information indicating a power-on time point at which the storage device is powered on, when the storage device is switched from a power-off state to a power-on state. The storage controller stores a power-off time stamp corresponding to the power-off time point and a power-on time stamp corresponding to the power-on time point in the non-volatile memory.

    High bandwidth memory system using multilevel signaling

    公开(公告)号:US11631444B2

    公开(公告)日:2023-04-18

    申请号:US17483010

    申请日:2021-09-23

    Abstract: A high bandwidth memory system includes a motherboard; and a semiconductor package coupled to the motherboard. The semiconductor package includes a package substrate mounted on the motherboard and including signal lines providing a plurality of channels; a first semiconductor device mounted on the package substrate and including a first physical layer (PHY) circuit; and a second semiconductor device mounted on the package substrate and including a second PHY circuit. The first semiconductor device and the second semiconductor device exchange a data signal with each other through the plurality of channels, the data signal is a multilevel signal having M levels, where M is a natural number greater than 2, and the first PHY circuit compensates for distortion of the channels and performs digital signal processing to compensate for a mismatch between the channels.

    Memory device skipping refresh operation and operation method thereof

    公开(公告)号:US11610624B2

    公开(公告)日:2023-03-21

    申请号:US17474666

    申请日:2021-09-14

    Abstract: Provided are a memory device skipping a refresh operation and an operating method thereof. The memory device includes a memory cell array including N rows; a refresh controller configured to control a refresh operation for the N rows of the memory cell array based on a refresh command; and an access information storage circuit including a plurality of registers configured to store flag information corresponding to each of the N rows, wherein a first value indicates rows that have been accessed, and a second value indicates rows that have not been accessed. The refresh controller is further configured to control whether the refresh operation is performed for a first row of the N rows at a refresh timing for the first row based on the flag information corresponding to the first row.

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