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公开(公告)号:US11587974B2
公开(公告)日:2023-02-21
申请号:US16861728
申请日:2020-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byungchul Kim , Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
Abstract: A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.
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公开(公告)号:US11715729B2
公开(公告)日:2023-08-01
申请号:US17244471
申请日:2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk Lee , Eunhye Kim , Sangmoo Park , Dongyeob Lee
CPC classification number: H01L25/167 , H01L24/26 , H01L24/32 , H01L24/83 , H01L24/05 , H01L24/29 , H01L33/40 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/08501 , H01L2224/26145 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32501 , H01L2224/83203
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.
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公开(公告)号:US20240088329A1
公开(公告)日:2024-03-14
申请号:US17941695
申请日:2022-09-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhye KIM , Sangmoo Park , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/40 , H01L25/075 , H01L33/62
CPC classification number: H01L33/40 , H01L25/0753 , H01L33/62
Abstract: A display module includes a thin film transistor (TFT) substrate including a glass substrate, a TFT layer provided at a front surface of the glass substrate and comprising a TFT electrode pad, and a driving circuit provided at a rear surface of the glass substrate and configured to drive the TFT layer, at least one light-emitting diode (LED) comprising at least one LED electrode pad, and a junction structure provided between the at least one LED electrode pad and the TFT electrode pad. The junction structure is formed in a metallically bonded state.
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公开(公告)号:US11695092B2
公开(公告)日:2023-07-04
申请号:US17674520
申请日:2022-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
CPC classification number: H01L33/0095 , H01L33/62
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号:US11387384B2
公开(公告)日:2022-07-12
申请号:US16850645
申请日:2020-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangmoo Park , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/00 , H01L33/24 , H01L25/075
Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
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公开(公告)号:US20210057401A1
公开(公告)日:2021-02-25
申请号:US16998118
申请日:2020-08-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongyeob Lee , Doyoung Kwag , Sangmoo Park , Seona Yang , Yoonsuk Lee
IPC: H01L25/16
Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.
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公开(公告)号:US12149991B2
公开(公告)日:2024-11-19
申请号:US17452718
申请日:2021-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chihyun Cho , Heejung Kim , Dongyeob Lee , Junho Lee
IPC: H04W4/50 , H04W8/20 , H04W12/06 , H04W28/086 , H04W36/00 , H04W36/22 , H04W56/00 , H04W84/02 , H04W88/14 , H04W92/02 , H04W92/24
Abstract: Provided is a method, performed by a source edge data network, of providing a service in a wireless communication system includes identifying a target edge data network and a handover terminal handed over to the target edge data network among a plurality of terminals provided with the service from the source edge data network; transmitting information about the identified target edge data network to a server; synchronizing status information of an application for providing the service with the target edge data network; and synchronizing user information for each of the plurality of terminals with the target edge data network.
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公开(公告)号:US11791322B2
公开(公告)日:2023-10-17
申请号:US17677182
申请日:2022-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung Kwag , Byungchul Kim , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
CPC classification number: H01L25/13 , H01L33/005
Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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公开(公告)号:US11437356B2
公开(公告)日:2022-09-06
申请号:US16998118
申请日:2020-08-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongyeob Lee , Doyoung Kwag , Sangmoo Park , Seona Yang , Yoonsuk Lee
IPC: H01L31/036 , H01L29/15 , H01L29/04 , H01L27/14 , H01L25/16
Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.
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公开(公告)号:US20220173270A1
公开(公告)日:2022-06-02
申请号:US17674520
申请日:2022-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk LEE , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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