公开(公告)号：US20150318226A1

公开(公告)日：2015-11-05

申请号：US14573134

申请日：2014-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bo-Na BAEK ,  Seok-Won LEE ,  Eun-Seok CHO ,  Dong-Han KIM ,  Kyoung-Sei CHOI ,  Sa-Yoon KANG

IPC: H01L23/14 ,  H01L25/10 ,  H01L23/522

CPC classification number: H01L23/5389 ,  H01L23/14 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.

Abstract translation: 提供半导体封装，包括半导体芯片; 半导体芯片上的上部结构，上部结构具有第一热膨胀系数; 以及在所述半导体芯片下方的下部结构，所述下部结构具有小于或等于所述第一热膨胀系数的第二热膨胀系数。

公开(公告)号：US20140239300A1

公开(公告)日：2014-08-28

申请号：US14068091

申请日：2013-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Na CHOI ,  Ji-Chul KIM ,  Se-Ran BAE ,  Eun-Seok CHO ,  Hee-Jung HWANG

IPC: H01L21/66

CPC classification number: H01L23/345 ,  G01R31/2875 ,  H01L22/34 ,  H01L23/34 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract translation: 可以提供半导体测试装置及其制造方法。 半导体测试装置可以包括第一热测试倒装芯片单元，其包括第一加热器和第一传感器，以及形成在第一热测试倒装芯片单元下的测试基板。 第一热测试倒装芯片单元可以包括布置在第一热测试倒装芯片单元的底表面上的多个第一凸块，并且被配置为电连接到第一加热器和第一传感器。 测试基板可以包括在第一方向上布置在测试基板的底表面上的第一球阵列，并且被配置为电连接到电连接到第一加热器和第一传感器的多个第一凸块。