公开(公告)号：US20150024545A1

公开(公告)日：2015-01-22

申请号：US14504972

申请日：2014-10-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hoon KIM ,  Hee-Seok LEE ,  Seong-Ho SHIN ,  Se-Ho YOU ,  Yun-Hee LEE

IPC: H01L25/00 ,  H01L23/522 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract translation: 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。