公开(公告)号：US20150282001A1

公开(公告)日：2015-10-01

申请号：US14671105

申请日：2015-03-27

Applicant: Samsung Electronics Co., Ltd. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Se-Min KWAK ,  Yong-Hoon KIM ,  Hee-Seong YANG ,  Sang-Hyouk CHOI ,  Joo-Hwan CHUN

IPC: H04W28/02 ,  H04B7/06

CPC classification number: H04B7/0617 ,  H04B7/0695

Abstract: A beamforming method is provided. The beamforming method includes determining different beams for pieces of user equipment based on channel information fed back from the pieces of user equipment, predicting beam qualities of the pieces of user equipment for the beams, determining whether the beam qualities satisfy Quality of Service (QoS) for the pieces of user equipment, generating a wide nulling beam by applying wide nulling to a second beam having a side lobe acting as interference against one first beam, when the beam quality of the first beam does not satisfy the QoS; predicting beam qualities for the beams including the wide nulling beam instead of the second beam, and simultaneously communicating with the user equipment through the beams including the wide nulling beam instead of the second beam, when the beam qualities for the beams including the wide nulling beam instead of the second beam satisfy the QoS.

Abstract translation: 提供了波束成形方法。 波束成形方法包括基于从用户设备反馈的信道信息来确定用户设备的不同波束，预测用于波束的用户设备的波束质量，确定波束质量是否满足服务质量（QoS） 对于所述用户设备，当所述第一波束的波束质量不满足所述QoS时，通过对具有用于作为对一个第一波束的干扰的侧波瓣的第二波束应用宽零位来产生宽的归零波束; 预测包括宽零位光束而不是第二光束的光束的光束质量，并且当包括宽零位光束的光束的光束质量时，同时通过包括宽零位光束的光束而不是第二光束与用户设备通信 而不是第二个波束满足QoS。

公开(公告)号：US20150024545A1

公开(公告)日：2015-01-22

申请号：US14504972

申请日：2014-10-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hoon KIM ,  Hee-Seok LEE ,  Seong-Ho SHIN ,  Se-Ho YOU ,  Yun-Hee LEE

IPC: H01L25/00 ,  H01L23/522 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

Abstract translation: 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。

公开(公告)号：US20130165059A1

公开(公告)日：2013-06-27

申请号：US13727377

申请日：2012-12-26

Applicant: Samsung Electronics Co. Ltd. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KAIST)

Inventor： Mi-Hyun SON ,  Yong-Hoon KIM ,  Byung-Tae YOON ,  Jong-Wook ZEONG ,  Dong-Geun LEE ,  Jeong-Seon LEE ,  Sang-Gug LEE

IPC: H04B7/04

CPC classification number: H04B7/043 ,  H04B7/0848

Abstract: Provided is a beamforming apparatus in a receiver in a mobile communication system. The beamforming apparatus includes a Local Oscillator (LO) signal generator for generating an LO signal; a phase shifter for generating a predetermined number of phase-shifted LO signals with respect to the generated LO signal; a switching network for mapping the phase-shifted LO signals to RF signals received via a plurality of receive paths; and a mixer for mixing the RF signals with the mapped LO signals to down-convert a frequency of the RF signals.

Abstract translation: 提供了一种在移动通信系统中的接收机中的波束成形装置。 波束形成装置包括用于产生LO信号的本地振荡器（LO）信号发生器; 移相器，用于相对于所生成的LO信号产生预定数量的相移LO信号; 切换网络，用于将相移的LO信号映射到经由多个接收路径接收的RF信号; 以及用于将RF信号与所映射的LO信号混合以对RF信号的频率进行下变频的混频器。

公开(公告)号：US20130163696A1

公开(公告)日：2013-06-27

申请号：US13726901

申请日：2012-12-26

Applicant: Samsung Electronics Co., Ltd. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KAIST)

Inventor： Mi-Hyun SON ,  Yong-Hoon KIM ,  Byung-Tae YOON ,  Jong-Wook ZEONG ,  Dong-Geun LEE ,  Jae-Hun LEE ,  Song-Cheol HONG

IPC: H03F1/32 ,  H04B1/04

CPC classification number: H03F1/3241 ,  H03F1/3247 ,  H03F1/3294 ,  H03F3/24 ,  H03F3/68 ,  H03F2200/102 ,  H03F2200/336 ,  H04B1/0475 ,  H04B2001/0425

Abstract: Provided is a method in which a Digital Pre-Distorter (DPD) performs digital pre-distortion on a received In-phase (I) signal, a received Quadrature-phase (Q) signal, a feedback I signal, and a feedback Q signal; a mixer mixes a signal output from the DPD with a frequency signal output from an oscillator; each of n phase shifters phase-shifts a signal output from the mixer according to a preset beamforming pattern; each of n Power Amplifiers (PAs) amplifies a signal output from an associated phase shifter according to a gain, the PAs connected to the associated phase shifter on a one-to-one basis; each of n envelope detectors detects an envelope signal from a signal output from an associated PA, the envelope detector connected to the associated PA on a one-to-one basis; and a control unit determines whether the n PAs operate normally, using the envelope signals output from the n envelope detectors.

Abstract translation: 提供了一种数字预失真器（DPD）对接收到的同相（I）信号，接收的正交相（Q）信号，反馈I信号和反馈Q信号进行数字预失真的方法 ; 混频器将从DPD输出的信号与从振荡器输出的频率信号混合; 每个n个移相器根据预设的波束形成模式将从混频器输出的信号相移; n个功率放大器（PA）中的每一个根据增益放大来自相关移相器的信号，一对一连接到相关联的移相器的PA; n个包络检测器中的每一个检测从相关联的PA输出的信号的包络信号，包络检测器以一对一的方式连接到相关联的PA; 并且控制单元使用从n个包络检测器输出的包络信号确定n个PA是否正常工作。

公开(公告)号：US20140110831A1

公开(公告)日：2014-04-24

申请号：US14143178

申请日：2013-12-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Jong-Joo LEE ,  Yong-Hoon KIM ,  Tae-Hong MIN

IPC: H01L23/498 ,  H01L23/367

CPC classification number: H01L23/49827 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311

Abstract: A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.

Abstract translation: 多芯片封装可以包括封装衬底，插入器芯片，第一半导体芯片，散热结构和第二半导体芯片。 插入器芯片可以安装在封装衬底上。 第一半导体芯片可以安装在插入器芯片上。 第一半导体芯片的尺寸可以小于插入器芯片的尺寸。 散热结构可以布置在插入器芯片上以围绕第一半导体芯片。 散热结构可以将第一半导体芯片中的热量传递到插入器芯片。 第二半导体芯片可以安装在第一半导体芯片上。 因此，可以通过散热线将第一半导体芯片中的热量有效地传递到插入器芯片。

公开(公告)号：US20150255381A1

公开(公告)日：2015-09-10

申请号：US14562656

申请日：2014-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Hoon KIM

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49524 ,  H01L23/49589 ,  H01L23/50 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06145 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/24265 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A semiconductor package having a structure in which a decoupling capacitor is disposed to be adjacent with a semiconductor chip using a vertical chip interconnection (VCI) to improve power integrity. The semiconductor package includes a semiconductor substrate including a first finger pad and a second finger pad, a semiconductor chip mounted on the semiconductor substrate and including a first chip pad and a second chip pad, a bonding tape electrically connecting the first finger pad and the first chip pad, and a bonding wire electrically connecting the second finger pad and the second chip pad. Here, the bonding tape is formed to make contact with a sidewall of the semiconductor chip in a vertical direction of the semiconductor chip.

Abstract translation: 具有这样的结构的半导体封装，其中使用垂直芯片互连（VCI）将去耦电容器设置为与半导体芯片相邻以提高电力完整性。 半导体封装包括：包括第一指状焊盘和第二指状焊盘的半导体衬底;安装在半导体衬底上的半导体芯片，包括第一芯片焊盘和第二芯片焊盘;电连接第一指状焊盘和第一指状焊盘 以及将第二指垫与第二芯片焊盘电连接的接合线。 这里，接合带形成为在半导体芯片的垂直方向上与半导体芯片的侧壁接触。

公开(公告)号：US20130200509A1

公开(公告)日：2013-08-08

申请号：US13660317

申请日：2012-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Hoon KIM

IPC: H01L23/488

CPC classification number: H01L23/36 ,  H01L23/31 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/014

Abstract: A semiconductor package includes a substrate including a mounting surface having a plurality of ground pads, a semiconductor chip disposed on the mounting surface, a conductive connection part connected to at least one of the plurality of ground pads and having a greater width at a center than at an end, a molding member exposing a top surface of the conductive connection part while wrapping the mounting surface, the conductive connection part and the semiconductor chip, and a heat slug disposed on the molding member and connected to the top surface of the conductive connection part.

Abstract translation: 半导体封装包括：衬底，其包括具有多个接地焊盘的安装表面;设置在所述安装表面上的半导体芯片;连接到所述多个接地焊盘中的至少一个的导电连接部分， 在端部，在包裹安装表面，导电连接部分和半导体芯片的同时露出导电连接部分的顶表面的模制构件以及设置在模制构件上并连接到导电连接件的顶表面的散热块 部分。