INTEGRATED CIRCUIT INCLUDING MEMORY CELL AND METHOD OF DESIGNING THE SAME

    公开(公告)号:US20220037339A1

    公开(公告)日:2022-02-03

    申请号:US17371522

    申请日:2021-07-09

    Abstract: An integrated circuit includes: a first wiring layer on which a first bit line pattern and a positive power supply pattern, a first power supply line landing pad, and a first word line landing pad are formed; a second wiring layer on which a first negative power supply pattern connected to the first power supply line landing pad, and a first word line pattern connected to the first word line landing pad are formed; a third wiring layer on which a second negative power supply pattern connected to the first negative power supply pattern, and a second word line landing pad connected to the first word line pattern are formed; and a fourth wiring layer on which a second word line pattern, connected to the second word line landing pad, are formed.

    MEMORY DEVICE
    4.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20230162784A1

    公开(公告)日:2023-05-25

    申请号:US17881187

    申请日:2022-08-04

    CPC classification number: G11C11/4096 G11C11/4094 G11C11/4074

    Abstract: A memory device includes a bit cell array including a plurality of bit cells connected to a first auxiliary line to which a cell power voltage is supplied; a write driver configured to apply a bit line voltage corresponding to write data to a bit line extending in a column direction of the bit cell array during a write operation; and a write auxiliary circuit connected to the first auxiliary line and a second auxiliary line extending in parallel to the first auxiliary line, and configured to lower a cell power voltage for a first bit cell spaced apart from the write driver during the write operation, wherein the cell power voltage is supplied to the first auxiliary line through the second auxiliary line, and in sequence from the first bit cell to a second bit cell adjacent to the write driver through the first auxiliary line.

    STATIC RANDOM ACCESS MEMORY DEVICE

    公开(公告)号:US20220351772A1

    公开(公告)日:2022-11-03

    申请号:US17577198

    申请日:2022-01-17

    Abstract: Disclosed is a static random access memory (SRAM) device. According to example embodiments of the present disclosure, a control logic of the SRAM device may include a tracking circuit connected with metal lines for tracking the number of columns of a memory cell array and the number of rows of the memory cell array. By the tracking circuit, a length of word lines of the memory cell array and a length of bit lines of the memory cell array may be tracked. The control logic of the SRAM device may generate control pulses optimized for the size of the memory cell array, based on a tracking result(s) of the tracking circuit. Accordingly, a power and a time necessary for a write operation and a read operation may be reduced.

    MEMORY CELL ARRAY INCLUDING PARTITIONED DUAL LINE STRUCTURE AND DESIGN METHOD THEREOF

    公开(公告)号:US20230144938A1

    公开(公告)日:2023-05-11

    申请号:US18052412

    申请日:2022-11-03

    CPC classification number: G11C5/06 H01L23/5226 G11C11/412 H01L23/5283

    Abstract: An integrated circuit includes is provided. The integrated circuit includes: a plurality of bit lines spaced apart from each other along a first direction and extending in a second direction perpendicular to the first direction through a first sub-array and a second sub-array neighboring the first sub-array in the second direction. Each of the plurality of bit lines includes: a first metal wiring extending in the second direction, the first metal wiring including a first portion and a second portion that is separated from the first portion by a first cutting portion; a third metal wiring extending in the second direction, and at least partially overlapping the first metal wiring along a third direction perpendicular to the first direction and the second direction; and two bridges electrically connecting the first metal wiring to the third metal wiring.

Patent Agency Ranking