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30 条记录 (耗时 0.017 秒)

    METHOD OF OPERATING A SYSTEM INCLUDING A PARAMETER MONITORING CIRCUIT
    1.
    发明申请
    METHOD OF OPERATING A SYSTEM INCLUDING A PARAMETER MONITORING CIRCUIT 有权

    公开(公告)号：US20210226613A1

    公开(公告)日：2021-07-22

    申请号：US17222033

    申请日：2021-04-05

    申请人： Samsung Electronics Co., Ltd.

    发明人： Dongho SHIN ,  Kyungtae KANG ,  Junha LEE ,  Tongsung KIM ,  Jangwoo LEE ,  Jeongdon IHM ,  Byunghoon JEONG

    IPC分类号： H03K3/017 ,  H03K19/21 ,  H03K5/24

    摘要： A method of operating a system including a parameter monitoring circuit and a host, includes generating a first parameter applying a first code to a current parameter, wherein a first offset is applied to the first code; generating a first comparison result by comparing the first parameter with a reference parameter value; generating a second parameter applying a second code to the current parameter, wherein a second offset is applied to the second code; generating a second comparison result by comparing the second parameter with the reference parameter value; detecting an error in the current parameter, based on the first comparison result and the second comparison result; and providing a signal based on the error to the host.

    INTEGRATED CIRCUIT AND STORAGE DEVICE INCLUDING INTEGRATED CIRCUIT
    4.
    发明申请
    INTEGRATED CIRCUIT AND STORAGE DEVICE INCLUDING INTEGRATED CIRCUIT 有权
    集成电路和存储设备，包括集成电路

    公开(公告)号：US20160216319A1

    公开(公告)日：2016-07-28

    申请号：US14957987

    申请日：2015-12-03

    申请人： Samsung Electronics Co., Ltd.

    发明人： Daehoon NA ,  ChaeHoon KIM ,  HyunJin KIM ,  Jangwoo LEE ,  Jeongdon IHM

    IPC分类号： G01R31/28 ,  G01R31/3177

    CPC分类号： G01R31/31716 ,  G01R31/2884 ,  G01R31/3177

    摘要： An integrated circuit including first pads and second pads, a first receiver circuit and a first driver circuit respectively connected to the first pad, a second receiver circuit and a second driver circuit respectively connected to the second pad, and a first loopback circuit having a first input terminal electrically connected to the first receiver circuit, a first output terminal electrically connected to the first driver circuit, a second output terminal electrically connected to the second driver circuit, and a second input terminal electrically connected to the second receiver circuit may be provided. At a normal mode, the first loopback circuit electrically connects the first input terminal to the second output terminal and electrically connects the second input terminal to the first output terminal. At a test mode, the first loopback circuit electrically connects the first input terminal to the first output terminal.

    摘要翻译： 包括第一焊盘和第二焊盘的集成电路，分别连接到第一焊盘的第一接收器电路和第一驱动器电路，分别连接到第二焊盘的第二接收器电路和第二驱动器电路，以及第一回路电路， 电连接到第一接收器电路的输入端子，电连接到第一驱动器电路的第一输出端子，电连接到第二驱动器电路的第二输出端子和电连接到第二接收器电路的第二输入端子。 在正常模式下，第一回路电路将第一输入端子与第二输出端子电连接，并将第二输入端子电连接到第一输出端子。 在测试模式下，第一回路电路将第一输入端子与第一输出端子电连接。

    SEMICONDUCTOR PACKAGE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20230114274A1

    公开(公告)日：2023-04-13

    申请号：US17841155

    申请日：2022-06-15

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Jeonghyun LEE ,  Hwanpil PARK ,  Jongbo SHIM ,  Eunsu LEE ,  Jangwoo LEE

    IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L49/02

    摘要： A semiconductor package includes a redistribution structure having a first surface, an opposite second surface, and a redistribution layer between the first surface and the second surface. A semiconductor chip is on the first surface of the redistribution structure and is electrically connected to the redistribution layer. An encapsulant is on at least a portion of the semiconductor chip. A passive element is on the second surface of the redistribution structure. The passive element includes a connection surface facing the second surface, a connection terminal on the connection surface, a non-connection surface opposite to the connection surface, and a side surface extending from the connection surface to the non-connection surface. A connection bump is adjacent the passive element on the second surface and is electrically connected to the redistribution layer. A sealing material is on at least a portion of the connection surface, the non-connection surface, and the side surface of the passive element.

    SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
    7.
    发明申请
    SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE 有权

    公开(公告)号：US20220384291A1

    公开(公告)日：2022-12-01

    申请号：US17883726

    申请日：2022-08-09

    申请人： Samsung Electronics Co., Ltd.

    发明人： DONGHO KIM ,  Jongbo SHIM ,  Hwanpil PARK ,  Jangwoo LEE

    IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L25/065

    摘要： A semiconductor package is disclosed. The disclosed semiconductor package includes a substrate having bonding pads at an upper surface thereof, a lower semiconductor chip, at least one upper semiconductor chip disposed on the lower semiconductor chip, and a dam structure having a closed loop shape surrounding the lower semiconductor chip. The dam structure includes narrow and wide dams disposed between the lower semiconductor chip and the bonding pads. The wide dam has a greater inner width than the narrow dam. The semiconductor packages further includes an underfill disposed inside the dam structure and being filled between the substrate and the lower semiconductor chip.

    MEMORY DEVICE INCLUDING INTERFACE CIRCUIT AND METHOD OF OPERATING THE SAME
    8.
    发明申请
    MEMORY DEVICE INCLUDING INTERFACE CIRCUIT AND METHOD OF OPERATING THE SAME 有权

    公开(公告)号：US20210134336A1

    公开(公告)日：2021-05-06

    申请号：US17150307

    申请日：2021-01-15

    申请人： Samsung Electronics Co., Ltd.

    发明人： Daehoon NA ,  Jeongdon IHM ,  Jangwoo LEE ,  Byunghoon JEONG

    IPC分类号： G11C7/22 ,  G11C7/10 ,  G11C8/18

    摘要： A memory system includes a memory device including a plurality of non-volatile memories and an interface circuit connected to each of the plurality of non-volatile memories, and a memory controller connected to the interface circuit and configured to transmit/receive data according to a first clock, wherein the interface circuit is configured to divide the first clock into a second clock, according to the number of the plurality of non-volatile memories, and transmit/receive data to/from each of the plurality of non-volatile memories, according to the second clock.

    ELECTRONIC DEVICE AND SEARCH AND DISPLAY METHOD OF THE SAME
    9.
    发明申请
    ELECTRONIC DEVICE AND SEARCH AND DISPLAY METHOD OF THE SAME 审中-公开
    电子设备及其搜索和显示方法

    公开(公告)号：US20150127681A1

    公开(公告)日：2015-05-07

    申请号：US14458943

    申请日：2014-08-13

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jangwoo LEE ,  Songgeun KIM ,  Jaeho LEE ,  Hyesoon JEONG

    IPC分类号： G06F17/30 ,  G06F3/0488

    CPC分类号： G06F3/0488 ,  G06F3/04883

    摘要： A search and display method of an electronic device using handwriting is provided. The search and display method includes recognizing the handwriting, determining whether the recognized handwriting is a gesture or text, recognizing the gesture if it is determined that the recognized handwriting is the gesture, and registering gesture information about the gesture and function information about a function corresponding to the gesture information based on the recognized gesture.

    摘要翻译： 提供了使用笔迹的电子设备的搜索和显示方法。 搜索和显示方法包括识别手写，确定所识别的手写是手势还是文本，如果确定所识别的手写是手势，则识别手势，以及登记关于手势的手势信息和关于对应的功能的功能信息 基于所识别的手势的姿势信息。