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公开(公告)号：US20210335680A1
公开(公告)日：2021-10-28
申请号：US17367903
申请日：2021-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyuek Jae LEE , Tae Hun Kim , Ji Hwan Hwang , Ji Hoon Kim , Ji Seok Hong
IPC: H01L21/66 , H01L23/528 , H01L23/00
Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.
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公开(公告)号：US20210118791A1
公开(公告)日：2021-04-22
申请号：US17113284
申请日：2020-12-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sun Ho Kim , Ji Hoon Kim , Ha Young Ahn , Shang Hoon Seo , Seung Yeop Kook , Sung Won Jeong
IPC: H01L23/498 , H01L23/00 , H01L23/538 , H01L23/31
Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.
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公开(公告)号：US12300594B2
公开(公告)日：2025-05-13
申请号：US18186618
申请日：2023-03-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sun Ho Kim , Ji Hoon Kim , Ha Young Ahn , Shang Hoon Seo , Seung Yeop Kook , Sung Won Jeong
IPC: H01L23/498 , H01L23/00 , H01L23/31 , H01L23/538 , H01L23/13
Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer, and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. At least a portion of a first wall of a first trench of the first insulating layer and at least a portion of a second wall of a second trench of the second insulating layer overlap each other vertically. At least a portion of the second wall of the second trench and at least a portion of a third wall of a third trench of the third insulating layer overlap each other vertically.
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公开(公告)号：US11088038B2
公开(公告)日：2021-08-10
申请号：US16508498
申请日：2019-07-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyuek Jae Lee , Tae Hun Kim , Ji Hwan Hwang , Ji Hoon Kim , Ji Seok Hong
IPC: H01L23/528 , H01L21/66 , H01L23/00
Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.
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公开(公告)号：US09656219B2
公开(公告)日：2017-05-23
申请号：US14532244
申请日：2014-11-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung Tae Ko , Seung Wan Kang , Jung Yeob Kim , Ji Hoon Kim , Byung Mo Yu , Sung Ho Cho , Yong Soo Kyong
CPC classification number: B01F3/04808 , A23L2/54 , B01F3/04106 , B01F3/04815 , B01F15/00253 , B67D1/0871 , B67D1/0884 , B67D1/1252 , B67D2001/1259 , F25D23/126 , Y10S261/07 , Y10T137/0385
Abstract: A refrigerator includes a carbonated water tank in which carbonated water is stored; a water level sensor sensing a water level of carbonated water stored in the carbonated water tank; a water tank supplying filtered water to the carbonated water tank; a carbon dioxide cylinder supplying carbon dioxide to the carbonated water tank; and a controller, if the water level of carbonated water sensed by the water level sensor is less than or equal to a predetermined minimum water level, supplying the filtered water to the carbonated water tank, and if supply of the filtered water is completed, supplying the carbon dioxide to the carbonated water tank so as to produce the carbonated water. If the carbonated water is discharged, the controller controls the water level sensor to sense the water lever of the carbonated water stored in the carbonated water tank.
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Patent Agency Ranking
公开(公告)号：US09319806B2
公开(公告)日：2016-04-19
申请号：US14156982
申请日：2014-01-16
Applicant: SAMSUNG ELECTRONICS CO., LTD. , The Industry & Academic Cooperation in Chungnam National University (IAC)
Inventor： Yun Seo Ku , Jong Jin Kim , Jun Il Sohn , Jong Hee Han , Dong Wook Kim , Ji Hoon Kim
IPC: H04R25/00
CPC classification number: H04R25/552 , H04R25/305 , H04R25/55 , H04R25/554 , H04R2225/31 , H04R2460/03
Abstract: Provided is a method and apparatus for low power operation of a binaural hearing aid, the method including determining whether a residual battery exceeds a predetermined threshold level, collecting an external audio signal, in response to whether the residual battery exceeds the predetermined threshold level, and transmitting the collected audio signal to a second hearing aid.
Abstract translation: 提供一种用于双耳助听器的低功率操作的方法和装置，所述方法包括：响应于所述剩余电池是否超过所述预定阈值电平，确定剩余电池是否超过预定阈值电平，收集外部音频信号;以及 将收集的音频信号发送到第二助听器。
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公开(公告)号：US08905383B2
公开(公告)日：2014-12-09
申请号：US14189184
申请日：2014-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Tae Ko , Seung Wan Kang , Jung Yeob Kim , Ji Hoon Kim , Byung Mo Yu , Sung Ho Cho , Yong Soo Kyong
CPC classification number: B01F3/04808 , A23L2/54 , B01F3/04106 , B01F3/04815 , B01F15/00253 , B67D1/0871 , B67D1/0884 , B67D1/1252 , B67D2001/1259 , F25D23/126 , Y10S261/07 , Y10T137/0385
Abstract: A refrigerator includes a carbonated water tank in which carbonated water is stored; a water level sensor sensing a water level of carbonated water stored in the carbonated water tank; a water tank supplying filtered water to the carbonated water tank; a carbon dioxide cylinder supplying carbon dioxide to the carbonated water tank; and a controller, if the water level of carbonated water sensed by the water level sensor is less than or equal to a predetermined minimum water level, supplying the filtered water to the carbonated water tank, and if supply of the filtered water is completed, supplying the carbon dioxide to the carbonated water tank so as to produce the carbonated water. If the carbonated water is discharged, the controller controls the water level sensor to sense the water lever of the carbonated water stored in the carbonated water tank.
Abstract translation: 冰箱包括储存有碳酸水的碳酸水箱; 感测储存在碳酸水箱中的碳酸水的水位的水位传感器; 将过滤水供应到碳酸水箱的水箱; 向碳酸水箱供应二氧化碳的二氧化碳气瓶; 以及控制器，如果由水位传感器感测到的碳酸水的水位小于或等于预定的最小水位，则将过滤的水供应到碳酸水箱，并且如果过滤水的供应完成， 将二氧化碳输送到碳酸水箱中以产生碳酸水。 如果碳酸水被排放，控制器控制水位传感器以感测储存在碳酸水箱中的碳酸水的水位。
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公开(公告)号：US11887968B2
公开(公告)日：2024-01-30
申请号：US17493975
申请日：2021-10-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Hwan Hwang , Ji Hoon Kim , Ji Seok Hong , Tae Hun Kim , Hyuek Jae Lee
IPC: H01L25/065 , H01L23/48 , H01L21/768 , H01L25/00 , H01L23/00
CPC classification number: H01L25/0657 , H01L21/76898 , H01L23/481 , H01L24/08 , H01L24/80 , H01L25/50 , H01L2224/08146 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2225/06541 , H01L2225/06586
Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.
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公开(公告)号：US11711624B2
公开(公告)日：2023-07-25
申请号：US17579887
申请日：2022-01-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung Hwan Moon , Ji Hoon Kim , Young Jun Lee
IPC: H04N25/46 , H01L27/146 , H04N25/11 , H04N25/75
CPC classification number: H04N25/46 , H01L27/1463 , H01L27/1464 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14645 , H04N25/11 , H04N25/75
Abstract: An image sensor includes a pixel defining pattern in a mesh form. A first division pattern divides a pixel area into two halves. A second division pattern divides the pixel area into two halves. A first diagonal division pattern divides the pixel area into two halves. A second diagonal division pattern divides the pixel area into two halves. First through eighth photodiodes are arranged in the pixel area.
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公开(公告)号：US11283151B2
公开(公告)日：2022-03-22
申请号：US16202596
申请日：2018-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Hoon Kim , Ji Yong Kim , Jong In Lee , Yeon Jeong Kim , Yong Jun An , Hyo Seok Na
IPC: H01Q1/24 , H01Q1/22 , H01Q23/00 , H01Q21/00 , H01Q9/04 , H01L23/66 , H01P5/18 , H01Q5/335 , H01Q21/06
Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
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