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公开(公告)号:US20180087828A1
公开(公告)日:2018-03-29
申请号:US15714439
申请日:2017-09-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyoung-Sun PARK , Eun HEO , Ji Yong PARK , Sang Gyu JUNG , In-Sung HWANG
CPC classification number: F25D25/02 , A47B96/061 , A47B96/062 , F25D17/04 , F25D17/062 , F25D23/067 , F25D25/024 , F25D2317/0672 , F25D2325/021 , F25D2325/022
Abstract: Disclosed is a refrigerator having a shelf assembly in a storage compartment. The refrigerator includes a body provided with a storage compartment, a shelf configured to load goods stored in the storage compartment, a panel configured to form one surface of the storage compartment and provided with a plurality of support guides, and a frame configured to support the shelf and configured to be movable in a transverse direction along the plurality of support guides by being detachably coupled to the panel.
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公开(公告)号:US20220034579A1
公开(公告)日:2022-02-03
申请号:US17278809
申请日:2019-08-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ji Yong PARK , Yong Man SEO , Myoung Jin JANG
IPC: F25D23/06
Abstract: Disclosed is a refrigerator having an improved structure to improve space utilization of a storage container.
Provided is a refrigerator including a refrigerator including: a main body; a storage chamber provided inside the main body and having an open front surface; a door provided to open and close the open front surface of the storage chamber; and a storage container having a storage space and provided to be withdrawn in the storage chamber, wherein the storage container may include a plurality of guide rails installed to face each other on an inner wall of the storage container; and a divider provided to be movable along the plurality of guide rails to divide the storage space into a plurality of storage spaces.-
公开(公告)号:US20190095167A1
公开(公告)日:2019-03-28
申请号:US16139448
申请日:2018-09-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Yong PARK , Hye Rin CHOI , Sang Kyun IM , Young-Hoon CHO
CPC classification number: G06F3/1446 , G06F3/0304 , G06F3/048 , G06F3/1438 , G06F21/552 , G06F21/554 , G06F21/70 , G06F21/84 , G06F21/86 , G06T1/60 , G08B13/08 , G09G2300/026 , G09G2370/16
Abstract: A display apparatus includes a cabinet; a display panel provided on the cabinet; a door provided on the cabinet and configured to be opened and closed; a first detector configured to detect opening of the door and output a first signal in response to the door being opened; an image data receiver configured to receive content data from an image source device; and a first controller configured to control the display panel to display a first image corresponding to the content data received from the image source device and control the display panel to display a second image different from the first image in response to receiving the first signal.
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公开(公告)号:US20170289475A1
公开(公告)日:2017-10-05
申请号:US15438060
申请日:2017-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Hoon HA , Ji Yong PARK , Kwang Hyun LEE
IPC: H04N5/357 , H04N5/378 , H04N5/365 , H04N5/3745 , H01L27/146 , H04N5/363
CPC classification number: H04N5/3575 , H01L27/14634 , H01L27/14645 , H04N5/363 , H04N5/3658 , H04N5/374 , H04N5/37455 , H04N5/378
Abstract: A correlated double sampling (CDS) circuit includes a comparator and a first circuit. The comparator including, a first input terminal, a second input terminal, at least one output terminal, and a plurality of first transistors operably coupled between the at least one output terminal and the first and second input terminals. The first circuit includes at least one second transistor, the at least one second transistor operably coupled to the at least one output terminal and one of the first input terminal and the second input terminal, the at least one second transistor having at least one of (i) a different number of layers than the first transistors, and (ii) a different dimension than the first transistors.
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公开(公告)号:US20240105567A1
公开(公告)日:2024-03-28
申请号:US18454464
申请日:2023-08-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Choong Bin YIM , Ji Yong PARK , Jong Bo SHIM
CPC classification number: H01L23/49816 , H01L21/4853 , H01L21/565 , H01L23/3107 , H01L23/49838 , H01L24/16 , H01L25/105 , H10B80/00 , H01L2224/1601 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/1433 , H01L2924/3511
Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.
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