公开(公告)号：US10747104B2

公开(公告)日：2020-08-18

申请号：US15690879

申请日：2017-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mun-Ja Kim ,  Ji-Beom Yoo ,  Soo-Young Kim ,  Hee-Bom Kim ,  Hwan-Chul Jeon ,  Seul-Gi Kim ,  Tae-Sung Kim ,  Dong-Wook Shin

IPC: G03F1/64

Abstract: A method of manufacturing a pellicle includes preparing a pellicle frame having an adhesive layer coated thereon, treating a pellicle membrane with vapor under vapor atmosphere, attaching the pellicle membrane onto the pellicle frame, and drying the pellicle membrane.

公开(公告)号：US09753367B2

公开(公告)日：2017-09-05

申请号：US14972258

申请日：2015-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Munja Kim ,  Ji-Beom Yoo ,  Sooyoung Kim ,  Taesung Kim ,  Dong-Wook Shin ,  Hwanchul Jeon ,  Seul-Gi Kim

IPC: G03F1/64 ,  G03F1/62 ,  C23C16/26

CPC classification number: G03F1/62 ,  C23C16/26

Abstract: The method includes forming a graphite layer on a substrate, forming a supporting layer on the graphite layer to form a stack of the graphite layer and the supporting layer, removing the substrate to separate the stack from the substrate, transferring the stack of the graphite layer and the supporting layer onto a frame, and removing the supporting layer from the frame.

公开(公告)号：US20220350240A1

公开(公告)日：2022-11-03

申请号：US17712161

申请日：2022-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mun Ja Kim ,  Ji-Beom Yoo ,  Qicheng Hu ,  Changyoung Jeong ,  Ki-Bong Nam ,  Jin-Ho Yeo

IPC: G03F1/64 ,  C23C16/26 ,  C23C16/02 ,  C23C16/50

Abstract: A method for manufacturing a pellicle according to the technical idea of the present invention includes preparing a support substrate, forming a catalyst layer including nickel (Ni) in which one selected from a (110) plane and a (100) plane is a dominant crystal plane, on the support substrate, and performing a chemical vapor deposition process on the catalyst layer at about 1050° C. or less to form a membrane having a graphite layer.

公开(公告)号：US10065402B2

公开(公告)日：2018-09-04

申请号：US15014054

申请日：2016-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mun Ja Kim ,  Byung-Gook Kim ,  Hwan Chul Jeon ,  Ji-Beom Yoo ,  Dong-Wook Shin ,  Taesung Kim ,  Sooyoung Kim

IPC: B32B37/14 ,  B32B38/18 ,  B32B37/00 ,  G03F1/62 ,  B32B37/10 ,  B32B38/10 ,  B32B37/12 ,  H01L21/00 ,  B32B38/16

Abstract: A method of manufacturing a pellicle assembly, the method including attaching a carbon-containing thin film onto a transfer membrane in a wet atmosphere; attaching the carbon-containing thin film to a pellicle frame in a dry atmosphere while the carbon-containing thin film is attached onto the transfer membrane; and separating the transfer membrane from the carbon-containing thin film while the carbon-containing thin film is attached to the pellicle frame.

公开(公告)号：US11067887B2

公开(公告)日：2021-07-20

申请号：US16918106

申请日：2020-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mun-Ja Kim ,  Ji-Beom Yoo ,  Soo-Young Kim ,  Hee-Bom Kim ,  Hwan-Chul Jeon ,  Seul-Gi Kim ,  Tae-Sung Kim ,  Dong-Wook Shin

IPC: G03F1/64

Abstract: A method of manufacturing a pellicle includes preparing a pellicle frame having an adhesive layer coated thereon, treating a pellicle membrane with vapor under vapor atmosphere, attaching the pellicle membrane onto the pellicle frame, and drying the pellicle membrane.

公开(公告)号：US09690190B2

公开(公告)日：2017-06-27

申请号：US14969645

申请日：2015-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mun-Ja Kim ,  Tae-Sung Kim ,  Ji-Beom Yoo ,  Byung-Gook Kim ,  Soo-Young Kim ,  Dong-Wook Shin ,  Jae-Hyuck Choi

IPC: G03F1/62 ,  C01B31/04 ,  C23C16/01 ,  C23C16/26 ,  C23F1/14 ,  C23C16/56 ,  C23F1/00 ,  G03F1/64 ,  C23F1/02

CPC classification number: G03F1/62 ,  C01B32/182 ,  C01B32/194 ,  C01B32/20 ,  C23C16/01 ,  C23C16/26 ,  C23C16/56 ,  C23F1/00 ,  C23F1/02 ,  C23F1/14 ,  G03F1/64

Abstract: A method of manufacturing a pellicle includes forming a membrane on a first surface of a substrate from a chemical reaction in which the substrate serves as a catalyst, forming a protective pattern on a second surface of the substrate, immersing the substrate in an etchant solution, such that a portion of the substrate exposed through the protective pattern is removed to form a frame, and replacing the etchant solution with a solvent.