公开(公告)号：US20130127754A1

公开(公告)日：2013-05-23

申请号：US13677386

申请日：2012-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin KWON ,  Yong-joo LEE ,  Jin-ho CHOI ,  Jea-hun HYUN ,  Seok-won HONG

IPC: G06F3/0488

CPC classification number: G06F3/0488 ,  G06F3/0484

Abstract: A display apparatus includes: an image processing unit which processes an image signal; a display unit which displays a picture or an image based on the image signal; a user input unit which includes a touch pad to receive a touch input from a user; and a controller which, according to a user's first touch input received in one of four edge regions of the touch pad corresponding to four edge regions of the picture, respectively, displays, on the picture, a first UI of a function of a category corresponding to the edge region in which the user's first touch input is received, of function categories allocated for the four edge regions of the picture, and performs the function according to the user's first touch input.

Abstract translation: 显示装置包括：处理图像信号的图像处理单元; 显示单元，其基于图像信号显示图像或图像; 用户输入单元，其包括用于从用户接收触摸输入的触摸板; 以及控制器，分别根据在所述图片的四个边缘区域中分别接收在所述触摸板的四个边缘区域中的一个中接收的用户的第一触摸输入，在所述图片上显示对应于类别的类别的功能的第一UI 到达用户的第一触摸输入的边缘区域，分配给图像的四个边缘区域的功能类别，并且根据用户的第一触摸输入执行功能。

公开(公告)号：US20180165023A1

公开(公告)日：2018-06-14

申请号：US15433870

申请日：2017-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-hun OH ,  Sang-hune PARK ,  Jin-ho CHOI ,  Jong-ryun CHOI ,  Dae-ro KIM

IPC: G06F3/06 ,  G11C11/4096 ,  G11C11/4091

CPC classification number: G06F13/1689 ,  G06F13/16 ,  G11C7/1093

Abstract: A memory controller for receiving a differential data strobe signal and an application processor having the memory controller are disclosed. The memory controller includes a strobe signal receiver configured to receive first and second strobe signals from a memory device as differential data strobe signal and output a first detection signal based on a level of each of the first and second strobe signals, a comparator configured to receive the second strobe signal and a reference voltage and compare a level of the second strobe signal with a level of the reference voltage to output a second detection signal, and a gate signal generator configured to generate a gate signal masking a portion of a period corresponding to the differential data strobe signal using the first detection signal and the second detection signal.

公开(公告)号：US20160220223A1

公开(公告)日：2016-08-04

申请号：US14868612

申请日：2015-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-soo KIM ,  Han-ju NAM ,  Young-jun LEE ,  Jin-ho CHOI

IPC: A61B6/00 ,  A61B6/06

Abstract: An X-ray apparatus includes an X-ray source configured to radiate X-rays, a collimator configured to adjust a radiation field of the X-rays and rotate on an optical axis direction of the X-rays, a ring-shaped first rotation transfer unit centered on an optical axis of the X-rays in the X-ray source, a second rotation transfer unit interlocked with the ring-shaped first rotation transfer unit and configured to rotate as the collimator rotates, a rotation sensor configured to sense an amount of rotation of the second rotation transfer unit, and a detector comprising a receiving surface on which the X-rays radiated from the collimator are incident.

Abstract translation: X射线装置包括被配置为照射X射线的X射线源，配置成调整X射线的照射场并沿着X射线的光轴方向旋转的准直仪，环状的第一旋转 传送单元，其以X射线源中的X射线的光轴为中心;第二旋转传送单元，与所述环形的第一旋转传送单元互锁并且被构造为当准直仪旋转时旋转;旋转传感器，被配置为感测 第二旋转传送单元的旋转量，以及包括从准直仪辐射的X射线入射的接收面的检测器。

公开(公告)号：US20130256876A1

公开(公告)日：2013-10-03

申请号：US13733446

申请日：2013-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ui-hyoung LEE ,  Moon-gi CHO ,  Mi-seok PARK ,  Sun-hee PARK ,  Hwan-sik LIM ,  Jin-ho CHOI ,  Fujisaki ATSUSHI

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/06102 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/17517 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01006 ,  H01L2224/05552

Abstract: A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion.

Abstract translation: 半导体封装包括其表面上具有多个接触焊盘的半导体芯片，分别在接触焊盘上的多个主凸块。 多个主凸块中的每一个包括在一个接触焊盘上的第一柱层和第一柱层上的第一焊料层，并且第一焊料层包括具有突出部分的上部。