Flexible semiconductor device and method of manufacturing the same
    3.
    发明授权
    Flexible semiconductor device and method of manufacturing the same 有权
    柔性半导体器件及其制造方法

    公开(公告)号:US08889442B2

    公开(公告)日:2014-11-18

    申请号:US13919460

    申请日:2013-06-17

    Abstract: Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.

    Abstract translation: 提供了将形成在非柔性基板上的半导体元件转移到柔性基板的方法。 此外,提供了一种基于半导体元件的传输方法制造柔性半导体器件的方法。 在保持半导体元件的配置的同时,可以在衬底上生长或形成的半导体元件被有效地转移到树脂层。 此外,树脂层用作支撑垂直半导体元件的柔性基板。

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