公开(公告)号：US08884421B2

公开(公告)日：2014-11-11

申请号：US14143178

申请日：2013-12-30

Applicant: Samsung Electronics Co., Ltd

Inventor： Un-Byoung Kang ,  Jong-Joo Lee ,  Yong-Hoon Kim ,  Tae-Hong Min

IPC: H01L23/02 ,  H01L23/367 ,  H01L25/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311

Abstract: A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.

公开(公告)号：US09400950B2

公开(公告)日：2016-07-26

申请号：US14808111

申请日：2015-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Joo Lee ,  Seok-Jae Han

IPC: H01R24/00 ,  G06K19/00 ,  H01R12/50

CPC classification number: G06K19/00 ,  G06K7/0021 ,  H01R23/7068

Abstract: An integrated circuit (IC) card socket includes a frame having a fixing portion and a connector. The connector includes a first portion fixed by the fixing portion, a second portion connected to one end of the first portion to contact a motherboard, and a third portion connected to another end of the first portion. The third portion has a shape of at least a portion of a loop, and a portion of the third portion contacts an IC card moving toward the third portion.

Abstract translation: 集成电路（IC）卡插座包括具有固定部分和连接器的框架。 连接器包括由固定部固定的第一部分，连接到第一部分的一端以接触主板的第二部分，以及连接到第一部分的另一端的第三部分。 第三部分具有环的至少一部分的形状，并且第三部分的一部分接触朝向第三部分移动的IC卡。

公开(公告)号：US10461033B2

公开(公告)日：2019-10-29

申请号：US16044719

申请日：2018-07-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-Joo Lee ,  Hee-woo An

IPC: H01L23/52 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor memory package is provided. The package includes a base substrate, and chip connection pads and external connection pads respectively arranged on upper and lower surfaces of the base substrate; and two semiconductor memory chips mounted on the base substrate each having chip pads electrically connected to the chip connection pads. A first electrical path extends from an external connection pad to a first chip pad of one of the chips and a second electrical path extends from the external connection pad to a second chip pad of another chip, the first and second electrical paths have a common line, and the first electrical path has a first branch line and the second electrical path has a second branch line. The base substrate includes an open stub extending from the common line and having an end which is open without being connected to another electrical path.

公开(公告)号：US10381334B2

公开(公告)日：2019-08-13

申请号：US15787434

申请日：2017-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Won Kang ,  Jong-Joo Lee

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/50 ,  H01L23/58 ,  H01L25/16 ,  H01L25/18 ,  H01L25/065 ,  H01L29/92 ,  H01L25/00 ,  H01L21/00 ,  H01L27/08 ,  H01L29/94

Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.

公开(公告)号：US10971486B2

公开(公告)日：2021-04-06

申请号：US16506309

申请日：2019-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Won Kang ,  Jong-Joo Lee

IPC: H01L25/00 ,  H01L25/16 ,  H01L25/18 ,  H01L25/065 ,  H01L23/00 ,  H01L27/08 ,  H01L29/94

Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.

公开(公告)号：US20160036144A1

公开(公告)日：2016-02-04

申请号：US14808111

申请日：2015-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Joo Lee ,  Seok-Jae Han

IPC: H01R12/70

CPC classification number: G06K19/00 ,  G06K7/0021 ,  H01R23/7068

Abstract: An integrated circuit (IC) card socket includes a frame having a fixing portion and a connector. The connector includes a first portion fixed by the fixing portion, a second portion connected to one end of the first portion to contact a motherboard, and a third portion connected to another end of the first portion. The third portion has a shape of at least a portion of a loop, and a portion of the third portion contacts an IC card moving toward the third portion.

Abstract translation: 集成电路（IC）卡插座包括具有固定部分和连接器的框架。 连接器包括由固定部固定的第一部分，连接到第一部分的一端以接触主板的第二部分，以及连接到第一部分的另一端的第三部分。 第三部分具有环的至少一部分的形状，并且第三部分的一部分接触朝向第三部分移动的IC卡。