公开(公告)号：US20200381267A1

公开(公告)日：2020-12-03

申请号：US16999481

申请日：2020-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US20190088505A1

公开(公告)日：2019-03-21

申请号：US16135114

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US11929262B2

公开(公告)日：2024-03-12

申请号：US18132650

申请日：2023-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L21/563 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45678 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1533 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2224/45144 ,  H01L2924/01022 ,  H01L2224/45144 ,  H01L2924/01077 ,  H01L2224/45144 ,  H01L2924/01074 ,  H01L2224/45144 ,  H01L2924/01078 ,  H01L2224/45144 ,  H01L2924/01039 ,  H01L2224/45144 ,  H01L2924/01058 ,  H01L2224/45144 ,  H01L2924/0102 ,  H01L2224/45144 ,  H01L2924/01057 ,  H01L2224/45144 ,  H01L2924/01024 ,  H01L2224/45144 ,  H01L2924/01025 ,  H01L2224/45144 ,  H01L2924/01027 ,  H01L2224/45139 ,  H01L2924/01004 ,  H01L2224/45139 ,  H01L2924/01046 ,  H01L2224/45139 ,  H01L2924/01022 ,  H01L2224/45139 ,  H01L2924/01077 ,  H01L2224/45139 ,  H01L2924/01074 ,  H01L2224/45139 ,  H01L2924/01078 ,  H01L2224/45139 ,  H01L2924/01039 ,  H01L2224/45139 ,  H01L2924/01058 ,  H01L2224/45139 ,  H01L2924/0102 ,  H01L2224/45139 ,  H01L2924/01057 ,  H01L2224/45139 ,  H01L2924/01024 ,  H01L2224/45139 ,  H01L2924/01025 ,  H01L2224/45139 ,  H01L2924/01027 ,  H01L2224/45147 ,  H01L2924/01004 ,  H01L2224/45147 ,  H01L2924/01046 ,  H01L2224/45147 ,  H01L2924/01022 ,  H01L2224/45147 ,  H01L2924/01077 ,  H01L2224/45147 ,  H01L2924/01074 ,  H01L2224/45147 ,  H01L2924/01078 ,  H01L2224/45147 ,  H01L2924/01039 ,  H01L2224/45147 ,  H01L2924/01058 ,  H01L2224/45147 ,  H01L2924/0102 ,  H01L2224/45147 ,  H01L2924/01057 ,  H01L2224/45147 ,  H01L2924/01024 ,  H01L2224/45147 ,  H01L2924/01025 ,  H01L2224/45147 ,  H01L2924/01027

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US10770311B2

公开(公告)日：2020-09-08

申请号：US16135114

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US20230245902A1

公开(公告)日：2023-08-03

申请号：US18132650

申请日：2023-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L21/563 ,  H01L25/0657 ,  H01L25/50 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/105 ,  H01L2225/06517 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L23/49811 ,  H01L2224/131 ,  H01L2924/1436 ,  H01L2224/16227 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L25/0655 ,  H01L2224/45671 ,  H01L2924/1533 ,  H01L2224/45664 ,  H01L2224/13111 ,  H01L2224/48091 ,  H01L2224/4568 ,  H01L2224/45139 ,  H01L2224/45678 ,  H01L2224/32225 ,  H01L2224/92125 ,  H01L24/13 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2924/15321 ,  H01L24/73 ,  H01L2924/1438 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/45147 ,  H01L2224/45684 ,  H01L2924/1434 ,  H01L2924/1432 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L24/48 ,  H01L24/92 ,  H01L2224/45144 ,  H01L2225/1058

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US11651975B2

公开(公告)日：2023-05-16

申请号：US16999481

申请日：2020-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-Yeon Kim

IPC: H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L21/563 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/4568 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45678 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/0652 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2224/45144 ,  H01L2924/01022 ,  H01L2224/45144 ,  H01L2924/01077 ,  H01L2224/45144 ,  H01L2924/01074 ,  H01L2224/45144 ,  H01L2924/01078 ,  H01L2224/45144 ,  H01L2924/01039 ,  H01L2224/45144 ,  H01L2924/01058 ,  H01L2224/45144 ,  H01L2924/0102 ,  H01L2224/45144 ,  H01L2924/01057 ,  H01L2224/45144 ,  H01L2924/01024 ,  H01L2224/45144 ,  H01L2924/01025 ,  H01L2224/45144 ,  H01L2924/01027 ,  H01L2224/45139 ,  H01L2924/01004 ,  H01L2224/45139 ,  H01L2924/01046 ,  H01L2224/45139 ,  H01L2924/01022 ,  H01L2224/45139 ,  H01L2924/01077 ,  H01L2224/45139 ,  H01L2924/01074 ,  H01L2224/45139 ,  H01L2924/01078 ,  H01L2224/45139 ,  H01L2924/01039 ,  H01L2224/45139 ,  H01L2924/01058 ,  H01L2224/45139 ,  H01L2924/0102 ,  H01L2224/45139 ,  H01L2924/01057 ,  H01L2224/45139 ,  H01L2924/01024 ,  H01L2224/45139 ,  H01L2924/01025 ,  H01L2224/45139 ,  H01L2924/01027 ,  H01L2224/45147 ,  H01L2924/01004 ,  H01L2224/45147 ,  H01L2924/01046 ,  H01L2224/45147 ,  H01L2924/01022 ,  H01L2224/45147 ,  H01L2924/01077 ,  H01L2224/45147 ,  H01L2924/01074 ,  H01L2224/45147 ,  H01L2924/01078 ,  H01L2224/45147 ,  H01L2924/01039 ,  H01L2224/45147 ,  H01L2924/01058 ,  H01L2224/45147 ,  H01L2924/0102 ,  H01L2224/45147 ,  H01L2924/01057 ,  H01L2224/45147 ,  H01L2924/01024 ,  H01L2224/45147 ,  H01L2924/01025 ,  H01L2224/45147 ,  H01L2924/01027

Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.