公开(公告)号：US09583688B2

公开(公告)日：2017-02-28

申请号：US15015246

申请日：2016-02-04

申请人： NICHIA CORPORATION

发明人： Ryohei Yamashita ,  Ryoichi Yoshimoto

IPC分类号： H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L23/495 ,  H01L23/00 ,  H01L33/52

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.

摘要翻译： 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极和负极引线端子中的每一个包括第一主表面，第二主表面和端表面。 端面设置在第一主表面和第二主表面之间。 端面包括第一凹陷表面区域和第二凹入表面区域。 第一凹陷表面区域从第一主表面的第一点在横截面上延伸。 第二凹入表面区域从第二主表面的第二点以横截面延伸。 第一和第二凹入表面区域限定向外突出的突出部分。 树脂部分至少位于正引线端子的端面和负引线端子的端面之间。

公开(公告)号：US20120104613A1

公开(公告)日：2012-05-03

申请号：US13349155

申请日：2012-01-12

申请人： Tomohiro Uno ,  Keiichi Kimura ,  Shinichi Terashima ,  Takashi Yamada ,  Akihito Nishibayashi

发明人： Tomohiro Uno ,  Keiichi Kimura ,  Shinichi Terashima ,  Takashi Yamada ,  Akihito Nishibayashi

IPC分类号： H01L23/532

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.

摘要翻译： 本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄 用于细间距连接。 接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同 。 外层的厚度为0.021〜0.12μm。

公开(公告)号：US20190027667A1

公开(公告)日：2019-01-24

申请号：US16143383

申请日：2018-09-26

申请人： NICHIA CORPORATION

发明人： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/00 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/095 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20752 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light emitting apparatus includes a positive lead terminal and a negative lead terminal, each of which includes a first main surface, a second main surface, and an end surface including a first recessed surface area extending from a first point of the first main surface in cross section, and a second recessed surface area extending from a second point of the second main surface in cross section. A distance between a first part of the end surface of the positive lead terminal and a second part of the end surface of the negative lead terminal than a first distance between the first points of the positive lead terminal and the negative lead terminal and a second distance between the second points of the positive lead terminal and the negative lead terminal. The first part and the second part are separated from the first point and the second point.

公开(公告)号：US20160155917A1

公开(公告)日：2016-06-02

申请号：US15015246

申请日：2016-02-04

申请人： NICHIA CORPORATION

发明人： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC分类号： H01L33/62 ,  H01L23/495 ,  H01L33/52

CPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

摘要： A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.

摘要翻译： 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极和负极引线端子中的每一个包括第一主表面，第二主表面和端表面。 端面设置在第一主表面和第二主表面之间。 端面包括第一凹陷表面区域和第二凹入表面区域。 第一凹陷表面区域从第一主表面的第一点在横截面上延伸。 第二凹入表面区域从第二主表面的第二点以横截面延伸。 第一和第二凹入表面区域限定向外突出的突出部分。 树脂部分至少位于正引线端子的端面和负引线端子的端面之间。

公开(公告)号：US08692118B2

公开(公告)日：2014-04-08

申请号：US13168675

申请日：2011-06-24

申请人： Cyprian Uzoh ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Craig Mitchell

IPC分类号： H01B5/00

CPC分类号： H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

摘要： A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

摘要翻译： 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US20240105668A1

公开(公告)日：2024-03-28

申请号：US18275584

申请日：2022-01-31

申请人： NIPPON MICROMETAL CORPORATION ,  NIPPON STEEL Chemical & Material Co., Ltd.

发明人： Yuto KURIHARA ,  Daizo ODA ,  Motoki ETO ,  Ryo OISHI ,  Tetsuya OYAMADA ,  Tomohiro UNO

IPC分类号： H01L23/00

CPC分类号： H01L24/45 ,  H01L2224/45005 ,  H01L2224/45124 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45638 ,  H01L2224/45639 ,  H01L2224/45647 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/45679 ,  H01L2224/4568 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01039 ,  H01L2924/01072 ,  H01L2924/0132 ,  H01L2924/2076

摘要： There is provided a novel Al wiring material that achieves both of a suppression of chip damage and a thermal shock resistance. In aspect 1, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2≤H1h/H1s where H1h is a Vickers hardness of the Al core material (Hv) and H1s is a Vickers hardness of the Al coating layer (Hv). In aspect 2, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2≤H2h/H2s where H2s is a Vickers hardness of the Al core material (Hv) and H2h is a Vickers hardness of the Al coating layer (Hv).

公开(公告)号：US20170338169A1

公开(公告)日：2017-11-23

申请号：US15600857

申请日：2017-05-22

申请人： Infineon Technologies AG

发明人： Joachim Mahler ,  Michael Bauer ,  Jochen Dangelmaier ,  Reimund Engl ,  Johann Gatterbauer ,  Frank Hille ,  Michael Huettinger ,  Werner Kanert ,  Heinrich Koerner ,  Brigitte Ruehle ,  Francisco Javier Santos Rodriguez ,  Antonio Vellei

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/29 ,  H01L21/02 ,  H01L23/00

CPC分类号： H01L24/48 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02266 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02288 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0346 ,  H01L2224/03826 ,  H01L2224/03827 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48507 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/01046 ,  H01L2224/45669 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01056 ,  H01L2924/00 ,  H01L2224/43848

摘要： In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

公开(公告)号：US20120325517A1

公开(公告)日：2012-12-27

申请号：US13168675

申请日：2011-06-24

申请人： Cyprian Uzoh ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Craig Mitchell

IPC分类号： H01B5/00 ,  H01B13/00

CPC分类号： H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

摘要： A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

摘要翻译： 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US20230245902A1

公开(公告)日：2023-08-03

申请号：US18132650

申请日：2023-04-10

申请人： Samsung Electronics Co., Ltd.

发明人： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-yeon Kim

IPC分类号： H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L21/563 ,  H01L25/0657 ,  H01L25/50 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/105 ,  H01L2225/06517 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L23/49811 ,  H01L2224/131 ,  H01L2924/1436 ,  H01L2224/16227 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L25/0655 ,  H01L2224/45671 ,  H01L2924/1533 ,  H01L2224/45664 ,  H01L2224/13111 ,  H01L2224/48091 ,  H01L2224/4568 ,  H01L2224/45139 ,  H01L2224/45678 ,  H01L2224/32225 ,  H01L2224/92125 ,  H01L24/13 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2924/15321 ,  H01L24/73 ,  H01L2924/1438 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/45147 ,  H01L2224/45684 ,  H01L2924/1434 ,  H01L2924/1432 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L24/48 ,  H01L24/92 ,  H01L2224/45144 ,  H01L2225/1058

摘要： A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.

公开(公告)号：US11651975B2

公开(公告)日：2023-05-16

申请号：US16999481

申请日：2020-08-21

申请人： Samsung Electronics Co., Ltd.

发明人： Jae-in Won ,  Jong-kak Jang ,  Dong-woo Kang ,  Do-Yeon Kim

IPC分类号： H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/4568 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45678 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/0652 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2224/45144 ,  H01L2924/01022 ,  H01L2224/45144 ,  H01L2924/01077 ,  H01L2224/45144 ,  H01L2924/01074 ,  H01L2224/45144 ,  H01L2924/01078 ,  H01L2224/45144 ,  H01L2924/01039 ,  H01L2224/45144 ,  H01L2924/01058 ,  H01L2224/45144 ,  H01L2924/0102 ,  H01L2224/45144 ,  H01L2924/01057 ,  H01L2224/45144 ,  H01L2924/01024 ,  H01L2224/45144 ,  H01L2924/01025 ,  H01L2224/45144 ,  H01L2924/01027 ,  H01L2224/45139 ,  H01L2924/01004 ,  H01L2224/45139 ,  H01L2924/01046 ,  H01L2224/45139 ,  H01L2924/01022 ,  H01L2224/45139 ,  H01L2924/01077 ,  H01L2224/45139 ,  H01L2924/01074 ,  H01L2224/45139 ,  H01L2924/01078 ,  H01L2224/45139 ,  H01L2924/01039 ,  H01L2224/45139 ,  H01L2924/01058 ,  H01L2224/45139 ,  H01L2924/0102 ,  H01L2224/45139 ,  H01L2924/01057 ,  H01L2224/45139 ,  H01L2924/01024 ,  H01L2224/45139 ,  H01L2924/01025 ,  H01L2224/45139 ,  H01L2924/01027 ,  H01L2224/45147 ,  H01L2924/01004 ,  H01L2224/45147 ,  H01L2924/01046 ,  H01L2224/45147 ,  H01L2924/01022 ,  H01L2224/45147 ,  H01L2924/01077 ,  H01L2224/45147 ,  H01L2924/01074 ,  H01L2224/45147 ,  H01L2924/01078 ,  H01L2224/45147 ,  H01L2924/01039 ,  H01L2224/45147 ,  H01L2924/01058 ,  H01L2224/45147 ,  H01L2924/0102 ,  H01L2224/45147 ,  H01L2924/01057 ,  H01L2224/45147 ,  H01L2924/01024 ,  H01L2224/45147 ,  H01L2924/01025 ,  H01L2224/45147 ,  H01L2924/01027

摘要： A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.