公开(公告)号：US20160049977A1

公开(公告)日：2016-02-18

申请号：US14827244

申请日：2015-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-bum LEE ,  Ki-sun KIM ,  Jong-rak SOHN ,  Seok-chan LEE ,  Dong-min KIM ,  Ju-seok LEE

IPC: H04B1/3818 ,  H01R12/70

CPC classification number: H04B1/3818 ,  G06K19/07741 ,  G06K19/07745 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2442

Abstract: Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Abstract translation: 公开了一种卡插座装置和包括该插座装置的电子设备。 卡插座装置包括配置成接收可附接卡的座部; 以及一个或多个连接端子部分，其形成在所述座部中并且被配置为与形成在所述可附接卡的底表面中的一个或多个连接垫形成电连接，其中所述座部构造成使得容纳所述可附接卡的空间为 向上打开

公开(公告)号：US20140256071A1

公开(公告)日：2014-09-11

申请号：US14203191

申请日：2014-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-woo PARK ,  Jong-rak SOHN

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/46 ,  H01L24/32 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/502 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of manufacturing a light-emitting diode package is illustrated. A light-emitting diode chip is manufactured. A material layer is formed on side surfaces and a rear surface of the light-emitting diode chip. The material layer is then oxidized to convert the material layer into an oxidized layer to form a reflective layer on the side surfaces and the rear surface of the light-emitting diode chip. The light-emitting diode chip is packaged.

Abstract translation: 示出了制造发光二极管封装的方法。 制造发光二极管芯片。 在发光二极管芯片的侧表面和后表面上形成材料层。 然后将材料层氧化，将材料层转变为氧化层，以在发光二极管芯片的侧表面和后表面上形成反射层。 发光二极管芯片被封装。