公开(公告)号：US20180143780A1

公开(公告)日：2018-05-24

申请号：US15815040

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-kug CHO ,  Byoung-young AHN ,  Eun-jin YUN ,  Yang-seok KI ,  Sil-wan CHANG ,  Seok-chan LEE

IPC: G06F3/06 ,  G06F17/30

CPC classification number: G06F3/0641 ,  G06F3/0608 ,  G06F3/0679 ,  G06F3/0688 ,  G06F16/134 ,  G06F16/1748 ,  H04L67/1097

Abstract: A storage system performing data deduplication includes a storage device configured to store data received from a host, and a controller configured to receive the data and an index associated with the data received from the host. The controller includes a memory configured to store mapping information and a reference count, the mapping information associating the index received from the host with a physical address of the storage system, the reference count associated with the index received from the host. The controller determines whether the data received from the host corresponds to a duplicate of data previously stored in the storage device by reading, from the memory, the mapping information and the reference count, the reading based on the index received from the host. The controller performs a deduplication process by updating the reference count if the data received from the host corresponds to the duplicate of data previously stored.

公开(公告)号：US20160049977A1

公开(公告)日：2016-02-18

申请号：US14827244

申请日：2015-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-bum LEE ,  Ki-sun KIM ,  Jong-rak SOHN ,  Seok-chan LEE ,  Dong-min KIM ,  Ju-seok LEE

IPC: H04B1/3818 ,  H01R12/70

CPC classification number: H04B1/3818 ,  G06K19/07741 ,  G06K19/07745 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2442

Abstract: Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Abstract translation: 公开了一种卡插座装置和包括该插座装置的电子设备。 卡插座装置包括配置成接收可附接卡的座部; 以及一个或多个连接端子部分，其形成在所述座部中并且被配置为与形成在所述可附接卡的底表面中的一个或多个连接垫形成电连接，其中所述座部构造成使得容纳所述可附接卡的空间为 向上打开

公开(公告)号：US20150115438A1

公开(公告)日：2015-04-30

申请号：US14520317

申请日：2014-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok-chan LEE ,  Sung-hoon CHUN

IPC: H01L25/10 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A semiconductor package comprising: a base substrate; a first semiconductor chip unit attached to the base substrate and including at least one first semiconductor chip; a second semiconductor chip unit stacked on the first semiconductor chip unit and including at least one second semiconductor chip; at least one third semiconductor chip disposed between the first semiconductor chip unit and the second semiconductor chip unit and having an area smaller than that of the at least one first semiconductor chip and that of the at least one second semiconductor chip; and an insulating material layer disposed between the first semiconductor chip unit and the second semiconductor chip unit to surround at least a portion of the at least one third semiconductor chip and having a thickness larger than that of the third semiconductor chip.

Abstract translation: 一种半导体封装，包括：基底; 第一半导体芯片单元，其附接到所述基底基板并且包括至少一个第一半导体芯片; 第二半导体芯片单元，堆叠在第一半导体芯片单元上并且包括至少一个第二半导体芯片; 设置在所述第一半导体芯片单元和所述第二半导体芯片单元之间并且具有比所述至少一个第一半导体芯片和所述至少一个第二半导体芯片的面积小的面积的至少一个第三半导体芯片; 以及绝缘材料层，设置在所述第一半导体芯片单元和所述第二半导体芯片单元之间，以围绕所述至少一个第三半导体芯片的至少一部分，并且具有比所述第三半导体芯片的厚度更大的厚度。