公开(公告)号：US20210035913A1

公开(公告)日：2021-02-04

申请号：US16845890

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JONGHO PARK ,  Seung Hwan Kim ,  Jun Young Oh ,  Kyong Hwan Koh ,  Sangsoo Kim ,  Dong-Ju Jang

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/16 ,  H01L25/065

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

公开(公告)号：US11955359B2

公开(公告)日：2024-04-09

申请号：US17200981

申请日：2021-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Young Oh ,  Seung Hwan Kim ,  Jong Ho Park ,  Yong Kwan Lee ,  Jong Ho Lee

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67383 ,  H01L21/6732 ,  H01L21/67346 ,  H01L21/67379 ,  H01L21/02 ,  H01L21/67017

Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.

公开(公告)号：US11562965B2

公开(公告)日：2023-01-24

申请号：US17134602

申请日：2020-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Chul Kim ,  Sang Soo Kim ,  Yong Kwan Lee ,  Hyun Ki Kim ,  Seok Geun Ahn ,  Jun Young Oh

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.

公开(公告)号：US11610845B2

公开(公告)日：2023-03-21

申请号：US17392705

申请日：2021-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho Park ,  Seung Hwan Kim ,  Jun Young Oh ,  Kyong Hwan Koh ,  Sangsoo Kim ,  Dong-Ju Jang

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/16 ,  H01L23/31

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

公开(公告)号：US20210366834A1

公开(公告)日：2021-11-25

申请号：US17134602

申请日：2020-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Chul Kim ,  Sang Soo Kim ,  Yong Kwan Lee ,  Hyun Ki Kim ,  Seok Geun Ahn ,  Jun Young Oh

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.

公开(公告)号：US11107769B2

公开(公告)日：2021-08-31

申请号：US16845890

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho Park ,  Seung Hwan Kim ,  Jun Young Oh ,  Kyong Hwan Koh ,  Sangsoo Kim ,  Dong-Ju Jang

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/16 ,  H01L25/065

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

公开(公告)号：US11996365B2

公开(公告)日：2024-05-28

申请号：US18114358

申请日：2023-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho Park ,  Seung Hwan Kim ,  Jun Young Oh ,  Kyong Hwan Koh ,  Sangsoo Kim ,  Dong-Ju Jang

IPC: H01L23/538 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L23/16 ,  H01L23/31 ,  H01L23/5385 ,  H01L25/0652

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

公开(公告)号：US11538801B2

公开(公告)日：2022-12-27

申请号：US17220468

申请日：2021-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Seung Hwan Kim ,  Jun Young Oh ,  Jungjoo Kim ,  Yongkwan Lee ,  Dong-Ju Jang

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.