公开(公告)号：US20230223405A1

公开(公告)日：2023-07-13

申请号：US18122253

申请日：2023-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minhee CHOI ,  Keunhwi CHO ,  Myunggil KANG ,  Seokhoon KIM ,  Dongwon KIM ,  Pankwi PARK ,  Dongsuk SHIN

IPC: H01L29/08 ,  H01L29/06 ,  H01L29/161 ,  H01L29/167 ,  H01L29/423 ,  H01L29/775 ,  H01L21/02 ,  H01L29/66

CPC classification number: H01L29/0847 ,  H01L29/0673 ,  H01L29/161 ,  H01L29/167 ,  H01L29/42392 ,  H01L29/775 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L29/66439

Abstract: An integrated circuit device includes a fin-type active area along a first horizontal direction on a substrate, a device isolation layer on opposite sidewalls of the fin-type active area, a gate structure along a second horizontal direction crossing the first horizontal direction, the gate structure being on the fin-type active area and on the device isolation layer, and a source/drain area on the fin-type active area, the source/drain area being adjacent to the gate structure, and including an outer blocking layer, an inner blocking layer, and a main body layer sequentially stacked on the fin-type active area, and each of the outer blocking layer and the main body layer including a Si1-xGex layer, where x≠0, and the inner blocking layer including a Si layer.

公开(公告)号：US20250167113A1

公开(公告)日：2025-05-22

申请号：US18754295

申请日：2024-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeewoong KIM ,  Jinkyu KIM ,  Yunsuk NAM ,  Yoonbeom PARK ,  Keunhwi CHO

IPC: H01L23/528 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

Abstract: Provided is an integrated circuit device including first and second power lines each overlapping a first cell region, an inter-cell separation region, and a second cell region on a substrate in a vertical direction to the substrate, a first power tap cell penetrating through the substrate and receiving a first voltage from the first power line, a second power tap cell penetrating through the substrate and receiving, from the second power line, a second voltage different from the first voltage, and a dummy gate insulating bridge including first and second dummy gate insulating lines, which are apart from each other with the first and second power tap cells therebetween, and defining a vacuum space, and connected to the first and second dummy gate insulating lines.

公开(公告)号：US20240153954A1

公开(公告)日：2024-05-09

申请号：US18414039

申请日：2024-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minhee CHOI ,  Keunhwi CHO ,  Myunggil KANG ,  Seokhoon KIM ,  Dongwon KIM ,  Pankwi PARK ,  Dongsuk SHIN

IPC: H01L27/092 ,  H01L21/02 ,  H01L29/06 ,  H01L29/08 ,  H01L29/161 ,  H01L29/167 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/78

CPC classification number: H01L27/0924 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/161 ,  H01L29/167 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/7851

Abstract: An integrated circuit device includes a fin-type active area along a first horizontal direction on a substrate, a device isolation layer on opposite sidewalls of the fin-type active area, a gate structure along a second horizontal direction crossing the first horizontal direction, the gate structure being on the fin-type active area and on the device isolation layer, and a source/drain area on the fin-type active area, the source/drain area being adjacent to the gate structure, and including an outer blocking layer, an inner blocking layer, and a main body layer sequentially stacked on the fin-type active area, and each of the outer blocking layer and the main body layer including a Si1-xGex layer, where x≠0, and the inner blocking layer including a Si layer.

公开(公告)号：US20220208970A1

公开(公告)日：2022-06-30

申请号：US17694994

申请日：2022-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keunhwi CHO ,  Byounghak HONG ,  Myunggil KANG

IPC: H01L29/161 ,  H01L29/10 ,  H01L29/78

Abstract: A semiconductor device including an active structure on a substrate, the active structure including silicon germanium patterns and silicon patterns alternately and repeatedly stacked in a vertical direction perpendicular to an upper surface of the substrate; a semiconductor layer on sidewalls of the active structure that face in a first direction parallel to the upper surface of the substrate, the semiconductor layer being a source/drain region; and a gate structure on a surface of the active structure and the substrate, the gate structure extending in a second direction that is perpendicular to the first direction, wherein the silicon germanium patterns are silicon rich-silicon germanium.

公开(公告)号：US20210134958A1

公开(公告)日：2021-05-06

申请号：US15931964

申请日：2020-05-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keunhwi CHO ,  Byounghak HONG ,  Myunggil KANG

IPC: H01L29/161 ,  H01L29/78 ,  H01L29/10

Abstract: A semiconductor device including an active structure on a substrate, the active structure including silicon germanium patterns and silicon patterns alternately and repeatedly stacked in a vertical direction perpendicular to an upper surface of the substrate; a semiconductor layer on sidewalls of the active structure that face in a first direction parallel to the upper surface of the substrate, the semiconductor layer being a source/drain region; and a gate structure on a surface of the active structure and the substrate, the gate structure extending in a second direction that is perpendicular to the first direction, wherein the silicon germanium patterns are silicon rich-silicon germanium.