SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请

    公开(公告)号:US20210257369A1

    公开(公告)日:2021-08-19

    申请号:US17313570

    申请日:2021-05-06

    IPC分类号: H01L27/108 G11C11/402

    摘要: A semiconductor device includes a substrate, a peripheral circuit layer, a first active pattern, a gate electrode, a first insulating layer, a conductive contact, and a second active pattern. The peripheral circuit layer is disposed on the substrate, and the peripheral circuit layer includes logic transistors and an interconnection layer that is disposed on the logic transistors. The first active pattern is disposed on the peripheral circuit layer. The gate electrode is disposed on a channel region of the first active pattern. The first insulating layer is disposed on the first active pattern and the gate electrode. The conductive contact is disposed in the first insulating layer and is electrically connected to a first source/drain region of the first active pattern, and the second active pattern is disposed on the first insulating layer. The channel region of the second active pattern vertically overlaps with the conductive contact.