公开(公告)号：US20150176819A1

公开(公告)日：2015-06-25

申请号：US14472092

申请日：2014-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kyung KIM ,  Jae Wook KWON ,  Seog Ho LIM ,  Seok Chan HONG

IPC: F21V19/00 ,  H05K3/00 ,  F21V29/89 ,  H05K1/05 ,  F21V21/00 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K1/05 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/056 ,  H05K1/183 ,  H05K3/44 ,  H05K2201/10106 ,  H05K2203/049 ,  Y10T156/10 ,  Y10T428/24331 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A metal copper clad laminate (MCCL) includes a metal base, an insulating layer and a copper foil. The metal base has at least one recess defined in one surface thereof. The insulating layer is laminated on the one surface of the metal base and has a first opening exposing the at least one recess. The copper foil is laminated on the insulating layer and has a second opening exposing the at least one recess and the first opening.

Abstract translation: 金属覆铜层压板（MCCL）包括金属基底，绝缘层和铜箔。 金属基底具有在其一个表面中限定的至少一个凹部。 绝缘层层叠在金属基底的一个表面上，并且具有暴露至少一个凹部的第一开口。 铜箔层压在绝缘层上，并具有暴露至少一个凹部和第一开口的第二开口。

公开(公告)号：US20140098544A1

公开(公告)日：2014-04-10

申请号：US13905977

申请日：2013-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Ho SHIN ,  Seok Chan HONG ,  Sung Oh AHN

IPC: F21K99/00

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Abstract translation: 发光模块包括电路板，其具有沿一个方向布置的多个反射部分和连接多个反射部分的连接部分，安装在多个反射部分上的发光器件以及设置成覆盖发光器件内部的透镜单元 在其上安装有发光装置的多个反射部分中的表面的边界。 每个连接部分在垂直于其一个方向的另一个方向上的宽度小于每个透镜单元的直径，从而减少了暗部分的产生。

公开(公告)号：US20160230963A1

公开(公告)日：2016-08-11

申请号：US15132243

申请日：2016-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Ho SHIN ,  Seok Chan HONG ,  Sung Oh AHN

IPC: F21V13/04 ,  G02F1/1335 ,  F21V5/04 ,  F21K99/00 ,  F21V7/05

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Abstract translation: 发光模块包括电路板，其具有沿一个方向布置的多个反射部分和连接多个反射部分的连接部分，安装在多个反射部分上的发光器件以及设置成覆盖发光器件内部的透镜单元 在其上安装有发光装置的多个反射部分中的表面的边界。 每个连接部分在垂直于其一个方向的另一个方向上的宽度小于每个透镜单元的直径，从而减少了暗部分的产生。

公开(公告)号：US20140217456A1

公开(公告)日：2014-08-07

申请号：US14042123

申请日：2013-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Oh AHN ,  Jin Se KIM ,  Chang Ho SHIN ,  Seok Chan HONG

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H05K1/111 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The present application provides an electronic apparatus including a substrate including a first electrode pad, a second electrode pad and an intermediate pad each disposed on one surface of the substrate and separated from one another. An electronic device is disposed on the substrate and including a first electrode unit and a second electrode unit. The first electrode unit has an adhesion surface facing the first electrode pad and the intermediate pad. The second electrode unit has an adhesion surface facing the second electrode pad.

Abstract translation: 本申请提供了一种电子设备，包括：衬底，其包括第一电极焊盘，第二电极焊盘和中间焊盘，每个衬垫设置在衬底的一个表面上并彼此分离。 电子设备设置在基板上并且包括第一电极单元和第二电极单元。 第一电极单元具有面向第一电极焊盘和中间焊盘的粘合表面。 第二电极单元具有面向第二电极焊盘的粘附表面。