公开(公告)号：US20160343301A1

公开(公告)日：2016-11-24

申请号：US15155154

申请日：2016-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hwan CHOI ,  Eung Seo SHIN ,  Young Bae JANG

IPC: G09G3/3233 ,  G09G3/20

CPC classification number: G09G3/3208 ,  G09G2320/0285 ,  G09G2320/041 ,  G09G2320/046 ,  G09G2320/048 ,  G09G2340/10

Abstract: An electronic device is provided, including a display configured to display an image by a plurality of pixels. A nonvolatile memory is configured to store accumulated stress values for respective subpixels that are included in the plurality of pixels, and a processor is configured to change brightness of at least one peripheral subpixel arranged adjacent a corresponding subpixel if the accumulated stress value of at least one subpixel is over a threshold value.

Abstract translation: 提供一种电子设备，包括被配置为通过多个像素显示图像的显示器。 非易失性存储器被配置为存储包括在多个像素中的各个子像素的累积应力值，并且处理器被配置为如果至少一个像素的累积应力值，则改变与相应子像素相邻排列的至少一个外围子像素的亮度 子像素超过阈值。

公开(公告)号：US20160190074A1

公开(公告)日：2016-06-30

申请号：US14971183

申请日：2015-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Hwan CHOI

IPC: H01L23/62 ,  H01L25/16 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L25/167 ,  H01L23/10 ,  H01L23/5256 ,  H01L23/62 ,  H01L24/05 ,  H01L33/62 ,  H01L2924/19107

Abstract: A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a portion of the first lead frame and at least a portion of the second lead frame, a wire fuse mounted on the first lead frame and the second lead frame, and configured to electrically connect the two lead frames, and an encapsulator configured to cover the wire fuse.

Abstract translation: 保险丝封装可以包括第一引线框架，与第一引线框架间隔开的第二引线框架，封装体构造成覆盖第一引线框架的至少一部分和第二引线框架的至少一部分， 保险丝安装在第一引线框架和第二引线框架上，并且被配置为电连接两个引线框架，以及封装器，其被配置为覆盖电线保险丝。

公开(公告)号：US20170244012A1

公开(公告)日：2017-08-24

申请号：US15400217

申请日：2017-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Hwan CHOI ,  Ho Young SONG

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16245 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A lead frame includes a bonding part to bond to a semiconductor chip, a first trench in the bonding part along a first central axis, the first central axis dividing the bonding part into two parts, and second trenches in the bonding part along a second central axis, the second central axis dividing the bonding part into two parts, and the first and second central axes vertically intersecting each other.

公开(公告)号：US20200249750A1

公开(公告)日：2020-08-06

申请号：US16652089

申请日：2018-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Hwan CHOI ,  Hyunjin KIM ,  Da-Hye PARK ,  Jaeyoung LEE ,  Say JANG ,  Sang-Woong HWANG

IPC: G06F3/01 ,  G06F3/0481 ,  H04N21/422

Abstract: Various embodiments of the present disclosure relate to an electronic device and a method for executing content by using sight-line information thereof, the electronic device comprising: a display; a sight-line tracking module; a memory storing at least one command; and at least one processor operatively coupled with the display, the sight-line tracking module and the memory. The at least one processor is configured to: on the basis of execution of the at least one command, control the display to display at least one content, and identify one content that a user stares at among the at least one content, based on user's sight-line information tracked through the sight-line tracking module, and in response to a sight-line movement on the identified content being sensed, display, on the display, a dynamic user interface (UI) that is dynamically varied according to the sight-line movement, and in response to a path of the user's sight-line movement satisfying a pre-selected condition, execute the identified content. Other various embodiments are also possible.

公开(公告)号：US20190324279A1

公开(公告)日：2019-10-24

申请号：US16465239

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Woong HWANG ,  Young Ah SEONG ,  Say JANG ,  Seung Hwan CHOI

IPC: G02B27/01 ,  G06F3/16 ,  H04N21/41 ,  G06F3/01

Abstract: An electronic device is disclosed. The electronic device comprises a first camera and a second camera, a microphone, a display, and a processor electrically connected to the first camera, the second camera, the microphone, and the display, wherein the processor can be set to display, on the display, a user interface (UI) including a plurality of objects, acquire user gaze information from the first camera, activate, among the plurality of objects, a first object corresponding to the gaze information, determine at least one method of input, corresponding to a type of the activated first object, between a gesture input acquired from the second camera and a voice input acquired by the microphone, and execute the function corresponding to the input for the first object While an activated state of the first object is maintained, if the input of the determined method is applicable to the first object. In addition, various embodiments identified through the specification are possible.

公开(公告)号：US20140213003A1

公开(公告)日：2014-07-31

申请号：US14228967

申请日：2014-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kun Yoo KO ,  Young June JEONG ,  Seung Hwan CHOI ,  Seong Ah JOO ,  Jung Kyu PARK

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/32

CPC classification number: H01L33/0075 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16

Abstract: The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device.

Abstract translation: 本发明涉及GaN型LED器件及其制造方法。 更具体地，提供了包括LED芯片的GaN型LED器件; 以及通过粘合剂层与LED芯片共晶结合的底座，其中，所述粘合层通过焊接多个金属层构成，其中第一金属层和第二金属层依次层叠，并且形成所述第二金属层 以糊状形式。 此外，本发明提供一种制造GaN型LED器件的方法。