公开(公告)号：US08611125B2

公开(公告)日：2013-12-17

申请号：US13675703

申请日：2012-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： YoungSeok Hong

IPC: G11C5/02 ,  H01L23/52

CPC classification number: G11C5/06 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/049 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A packaged integrated circuit device includes a substrate, and a conductive pad and a chip stack on the substrate. A primary conductive line electrically connects the pad on the substrate to a conductive pad on one of the chips in the chip stack. Secondary conductive lines electrically connect the pad on the one of the chips to respective conductive pads on ones of the chips above and below the one of the chips in the chip stack. The primary conductive line may be configured to transmit a signal from the pad on the substrate to the pad on the one of the chips in the chip stack, and the secondary conductive lines may be configured to transmit the signal from the one of the chips to the ones of the chips thereabove and therebelow at a same time.

Abstract translation: 封装的集成电路器件包括衬底，以及衬底上的导电焊盘和芯片堆叠。 主导线将衬底上的焊盘电连接到芯片堆叠中的一个芯片上的导电焊盘。 次级导电线将芯片之一上的焊盘电连接到芯片堆叠中的一个芯片之上和之下的芯片上的相应导电焊盘。 主导线可以被配置为将信号从衬底上的焊盘发送到芯片堆叠中的一个芯片上的焊盘，并且次级导线可以被配置为将信号从芯片之一传输到 在上面和下面的芯片在同一时间。

公开(公告)号：US20130062784A1

公开(公告)日：2013-03-14

申请号：US13675703

申请日：2012-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： YoungSeok Hong

IPC: H01L25/065

CPC classification number: G11C5/06 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/049 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A packaged integrated circuit device includes a substrate, and a conductive pad and a chip stack on the substrate. A primary conductive line electrically connects the pad on the substrate to a conductive pad on one of the chips in the chip stack. Secondary conductive lines electrically connect the pad on the one of the chips to respective conductive pads on ones of the chips above and below the one of the chips in the chip stack. The primary conductive line may be configured to transmit a signal from the pad on the substrate to the pad on the one of the chips in the chip stack, and the secondary conductive lines may be configured to transmit the signal from the one of the chips to the ones of the chips thereabove and therebelow at a same time.

Abstract translation: 封装的集成电路器件包括衬底，以及衬底上的导电焊盘和芯片堆叠。 主导线将衬底上的焊盘电连接到芯片堆叠中的一个芯片上的导电焊盘。 次级导电线将芯片之一上的焊盘电连接到芯片堆叠中的一个芯片之上和之下的芯片上的相应导电焊盘。 主导线可以被配置为将信号从衬底上的焊盘发送到芯片堆叠中的一个芯片上的焊盘，并且次级导线可以被配置为将信号从芯片之一传输到 在上面和下面的芯片在同一时间。