公开(公告)号：US20160068711A1

公开(公告)日：2016-03-10

申请号：US14785014

申请日：2014-04-17

Applicant: Samsung SDI Co., Ltd.

Inventor： Jung Min CHOI ,  Haruki NOJO ,  Yong Soon PARK ,  Yong Sik YOO ,  Dong Hun KANG ,  Go Un KIM ,  Tae Wan KIM

IPC: C09G1/02

CPC classification number: C09G1/02 ,  B24B1/00 ,  B24B37/044 ,  C09G1/00 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1454 ,  C09K3/1463 ,  C09K3/1472 ,  C09K13/06 ,  H01L21/30625 ,  H01L21/31058 ,  H01L21/3212

Abstract: The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.

Abstract translation: 本发明涉及一种用于研磨包括极性溶剂或非极性溶剂和金属氧化物磨料中的至少一种的有机膜的有机膜CMP浆料组合物，其为酸性，并且碳含量为约50〜 95atm％，以及使用其的抛光方法。

公开(公告)号：US20180362807A1

公开(公告)日：2018-12-20

申请号：US16100561

申请日：2018-08-10

Applicant: Samsung SDI Co., Ltd.

Inventor： Jung Min CHOI ,  Haruki NOJO ,  Yong Soon PARK ,  Yong Sik YOO ,  Dong Hun KANG ,  Go Un KIM ,  Tae Wan KIM

IPC: C09G1/02 ,  B24B37/04 ,  B24B1/00 ,  C09K3/14 ,  C09K13/06 ,  C09G1/00 ,  H01L21/306 ,  H01L21/3105 ,  C09G1/06 ,  C09G1/04 ,  H01L21/321

Abstract: The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.