公开(公告)号：US20170327640A1

公开(公告)日：2017-11-16

申请号：US15668159

申请日：2017-08-03

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yun-Jun KIM ,  Hwan-Sung CHEON ,  Youn-Jin CHO ,  Yong-Woon YOON ,  Chung-Heon LEE ,  Hyo-Young KWON ,  Yoo-Jeong CHOI

IPC: C08G65/26 ,  H01L21/02

Abstract: Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern using the same. In Chemical Formula 1, A, A′, L and n are the same as in the detailed description.

公开(公告)号：US20150337168A1

公开(公告)日：2015-11-26

申请号：US14561996

申请日：2014-12-05

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Jin-Hee BAE ,  Taek-Soo KWAK ,  Han-Song LEE ,  Youn-Jin CHO ,  Byeong-Gyu HWANG ,  Bo-Sun KIM ,  Sae-Mi PARK ,  Eun-Su PARK ,  Jin-Woo SEO ,  Wan-Hee LIM ,  Jun-Young JANG ,  Kwen-Woo HAN

IPC: C09D183/04 ,  B05D1/00 ,  B05D3/00 ,  C09D183/16

CPC classification number: C09D183/04 ,  C08G77/12 ,  C08G77/26 ,  C08G77/54 ,  C08G77/60 ,  C09D183/02 ,  C09D183/16 ,  C23C18/1212 ,  C23C18/122 ,  C23C18/1275 ,  C23C18/1283 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02326 ,  H01L21/02337 ,  H01L28/90

Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 μm to about 1 μm is less than or equal to about 10/ml.

Abstract translation: 用于形成二氧化硅基层的组合物和二氧化硅基层的制造方法，该组合物包含含硅化合物，含有氢化聚硅氮烷部分的含硅化合物，氢化聚硅氧烷部分或其组合，以及 溶剂，其中所述组合物中的多个含硅化合物的颗粒的粒径为约0.2μm至约1μm，小于或等于约10 / ml。

公开(公告)号：US20150093545A1

公开(公告)日：2015-04-02

申请号：US14488440

申请日：2014-09-17

Applicant: Samsung SDI Co., Ltd.

Inventor： Kwen-Woo HAN ,  Taek-Soo KWAK ,  Bo-Sun KIM ,  Eun-Su PARK ,  Jin-Hee BAE ,  Jin-Woo SEO ,  Han-Song LEE ,  Wan-Hee LIM ,  Byeong-Gyu HWANG ,  Sang-Kyun KIM ,  Youn-Jin CHO

IPC: C09D183/16 ,  C01B33/12 ,  B05D3/02

CPC classification number: C09D183/16 ,  B05D3/0254 ,  B05D2518/10 ,  C01B33/126 ,  C08G77/54 ,  C08G77/62 ,  C09D183/14 ,  Y10T428/24479

Abstract: A composition for a silica based layer, a silica based layer, and a method of manufacturing a silica based layer, the composition including a solvent; and a silicon-containing polymer, the silicon-containing polymer having a weight average molecular weight of about 20,000 to about 160,000.

Abstract translation: 一种二氧化硅基层组合物，二氧化硅基层和二氧化硅基层的制造方法，该组合物含有溶剂; 和含硅聚合物，所述含硅聚合物的重均分子量为约20,000至约160,000。