Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same
    5.
    发明授权
    Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same 失效
    具有三维结构的铁电电容器,具有相同的非易失性存储器件及其制造方法

    公开(公告)号:US07910967B2

    公开(公告)日:2011-03-22

    申请号:US11515024

    申请日:2006-09-05

    CPC分类号: H01L27/11502 H01L27/11507

    摘要: A ferroelectric capacitor having a three-dimensional structure, a nonvolatile memory device having the same, and a method of fabricating the same are provided. The ferroelectric capacitor may include a trench-type lower electrode, at least one layer formed around the lower electrode, a ferroelectric layer (PZT layer) formed on the lower electrode and the at least one layer and an upper electrode formed on the ferroelectric layer. The at least one layer may be at least one insulating interlayer and the at least one layer may also be at least one diffusion barrier layer. The at least one layer may be formed of an insulating material excluding SiO2 or may have a perovskite crystal structure excluding Pb.

    摘要翻译: 提供具有三维结构的铁电电容器,具有其的非易失性存储器件及其制造方法。 铁电电容器可以包括沟槽型下电极,形成在下电极周围的至少一层,形成在下电极和至少一层上的铁电层(PZT层)和形成在铁电层上的上电极。 所述至少一个层可以是至少一个绝缘夹层,并且所述至少一个层也可以是至少一个扩散阻挡层。 所述至少一层可以由除了SiO2之外的绝缘材料形成,或者可以具有不包括Pb的钙钛矿晶体结构。

    Duplex chemical vapor deposition system and pulsed processing method using the same
    7.
    发明申请
    Duplex chemical vapor deposition system and pulsed processing method using the same 审中-公开
    双相化学气相沉积系统和使用其的脉冲处理方法

    公开(公告)号:US20060090702A1

    公开(公告)日:2006-05-04

    申请号:US11185689

    申请日:2005-07-21

    IPC分类号: C23C16/00

    CPC分类号: C23C16/409 C23C16/44

    摘要: Embodiments are provided of a duplex chemical vapor deposition (CVD) system and pulsed processing method using the same. The duplex CVD system may include first and second process chambers, one or more reactive sources, and reactive source suppliers that correspond to the reactive sources, respectively. The reactive source suppliers may include a first conduit portion connected to the respective reactive sources, a second conduit portion having one terminal connected to the first conduit portion and the other terminal connected to the first process chamber, and a third conduit portion having one terminal connected to the first conduit portion and the other terminal connected to the second process chamber.

    摘要翻译: 提供了双相化学气相沉积(CVD)系统和使用其的脉冲处理方法的实施例。 双相CVD系统可以分别包括对应于无源电源的第一和第二处理室,一个或多个无源电源和无源电源供应器。 反应源供应商可以包括连接到各个反应源的第一管道部分,具有连接到第一管道部分的一个端子和连接到第一处理室的另一个端子的第二管道部分,以及一个端子连接的第三管道部分 连接到第二处理室的第一管道部分和另一个端子。