-
公开(公告)号：US20120008805A1
公开(公告)日：2012-01-12
申请号：US13207548
申请日：2011-08-11
IPC分类号： H04R1/00
CPC分类号： H04R1/04 , B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2924/1461 , H01L2924/3025 , H04R17/02 , H04R19/016 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An acoustic transducer unit that includes (a) an acoustic transducer having an acoustic transducer portion that converts sound into an electrical signal or converts an electrical signal into sound, and (b) packages that accommodate the acoustic transducer. The packages include a cylindrical conductive portion formed of a conductive material and having an inner space with both end apertures. At least the acoustic transducer portion of the acoustic transducer is located in the inner space of the conductive portion such as to be spaced from the apertures.
摘要翻译： 声学换能器单元，其包括：（a）具有将声音转换为电信号或将电信号转换为声音的声学换能器部分的声学换能器，以及（b）容纳所述声学换能器的包装。 包装件包括由导电材料形成并具有两个端部孔的内部空间的圆柱形导电部分。 至少声学换能器的声换能器部分位于导电部分的内部空间中，以便与孔间隔开。
-
公开(公告)号：US08385569B2
公开(公告)日：2013-02-26
申请号：US12557911
申请日：2009-09-11
申请人： Satoru Hachinohe , Takahiro Oguchi
发明人： Satoru Hachinohe , Takahiro Oguchi
IPC分类号： H04R5/02
CPC分类号： H04R31/00 , B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2207/096 , H01L2224/48091 , H01L2924/3025 , H04R1/06 , H04R1/22 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An acoustic transducer unit includes a first member having a recess, and a plate-like second member having main surfaces. The second member is bonded to the first member so as to cover the recess and form a housing. A microphone element, which is an acoustic transducer, is accommodated in an internal space of the housing, and an acoustic path is provided between the internal space and an external space of the housing. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. An electromagnetic shield layer of the second member is electrically connected to the electromagnetic-shielding member.
摘要翻译： 声换能器单元包括具有凹部的第一构件和具有主表面的板状第二构件。 第二构件被结合到第一构件以覆盖凹部并形成壳体。 作为声学换能器的麦克风元件容纳在壳体的内部空间中，并且在内部空间和壳体的外部空间之间设置声学路径。 用于电连接麦克风元件和外部电路的导电电磁屏蔽构件和端子构件通过嵌入成型嵌入第一构件的树脂体中。 第二构件的电磁屏蔽层电连接到电磁屏蔽构件。
-
公开(公告)号：US20100067732A1
公开(公告)日：2010-03-18
申请号：US12557911
申请日：2009-09-11
申请人： Satoru Hachinohe , Takahiro Oguchi
发明人： Satoru Hachinohe , Takahiro Oguchi
IPC分类号： H04R1/02
CPC分类号： H04R31/00 , B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2207/096 , H01L2224/48091 , H01L2924/3025 , H04R1/06 , H04R1/22 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要： An acoustic transducer unit includes a first member having a recess, and a plate-like second member having main surfaces. The second member is bonded to the first member so as to cover the recess and form a housing. A microphone element, which is an acoustic transducer, is accommodated in an internal space of the housing, and an acoustic path is provided between the internal space and an external space of the housing. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. An electromagnetic shield layer of the second member is electrically connected to the electromagnetic-shielding member.
摘要翻译： 声换能器单元包括具有凹部的第一构件和具有主表面的板状第二构件。 第二构件被结合到第一构件以覆盖凹部并形成壳体。 作为声学换能器的麦克风元件容纳在壳体的内部空间中，并且在内部空间和壳体的外部空间之间设置声学路径。 用于电连接麦克风元件和外部电路的导电电磁屏蔽构件和端子构件通过嵌入成型嵌入第一构件的树脂体中。 第二构件的电磁屏蔽层电连接到电磁屏蔽构件。
-
公开(公告)号：US6005330A
公开(公告)日：1999-12-21
申请号：US923197
申请日：1997-09-04
申请人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
发明人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
CPC分类号： H03H9/56 , H01L41/29 , H03H9/0514 , Y10T29/42
摘要： A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.
摘要翻译： 压电元件防止在压电元件的分开的电极之间发生短路并且提供高水平的连接可靠性。 压电元件包括利用纵向振荡模式并安装在安装基板上的压电元件。 压电元件的一个主表面上具有第一电极和第二电极，所述第一电极和第二电极通过纵向延伸的线性沟槽分割电极材料而形成，而在另一个主表面上形成第三电极。 导电支撑构件被固定到第一和第二电极的节点部分，以便相对于压电基片的纵向尺寸互相间隔开。 支撑构件通过导电粘合剂粘附并固定到安装基板的图案电极。
-
5.发明申请公开(公告)号：US20120267831A1
公开(公告)日：2012-10-25
申请号：US13539711
申请日：2012-07-02
CPC分类号： H01L21/67098 , G02B1/02 , H01L21/67092 , H01L21/67103
摘要： A semiconductor crystal body processing method includes providing a semiconductor crystal body, sandwiching the semiconductor crystal body between a pair of conductive pressurizing tools, applying a pulse-like current between the pair of pressurizing tools to heat the semiconductor crystal body to a target temperature equal to or higher than a temperature at which the semiconductor crystal body is plastically deformed by pressurization and lower than its melting point, and applying pressure and a pulse-like current between the pair of pressurizing tools to thereby maintain the temperature of the semiconductor crystal body at the target temperature and mold the semiconductor crystal body into a target shape by plastic deformation.
摘要翻译： 半导体晶体处理方法包括：提供半导体晶体，将半导体晶体体夹在一对导电加压工具之间，在一对加压工具之间施加脉冲状电流，将半导体晶体加热至等于 或高于半导体晶体通过加压塑性变形而低于其熔点的温度，并且在一对加压工具之间施加压力和脉冲状电流，从而将半导体晶体的温度保持在 目标温度并通过塑性变形将半导体晶体体模塑成目标形状。
-
公开(公告)号：US6158098A
公开(公告)日：2000-12-12
申请号：US116176
申请日：1998-07-15
申请人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
发明人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
CPC分类号： H03H9/1014 , H03H3/02 , H03H9/0514 , Y10T29/42
摘要： A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.
摘要翻译： 压电元件防止在单独电极之间发生短路，并提供高水平的连接可靠性。 利用纵向振荡模式的压电元件包括：压电基板，其一个主表面上具有第一电极和由纵向延伸的直线槽隔开的第二电极，在另一个主表面上具有第三电极。 导电支撑构件被固定到第一和第二电极的节点部分，以便相对于压电基片的纵向尺寸互相间隔开。
-
公开(公告)号：US5859488A
公开(公告)日：1999-01-12
申请号：US923196
申请日：1997-09-04
申请人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
发明人： Motoyuki Okeshi , Yasuo Otowaki , Koichi Nitta , Satoru Hachinohe , Takashi Hashimoto , Makoto Irie
CPC分类号： H03H9/1014 , H03H3/02 , H03H9/0514 , Y10T29/42
摘要： A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.
摘要翻译： 压电元件防止在单独电极之间发生短路，并提供高水平的连接可靠性。 利用纵向振荡模式的压电元件包括：压电基板，其一个主表面上具有第一电极和由纵向延伸的直线槽隔开的第二电极，在另一个主表面上具有第三电极。 导电支撑构件被固定到第一和第二电极的节点部分，以便相对于压电基片的纵向尺寸互相间隔开。
-
公开(公告)号：US07022554B2
公开(公告)日：2006-04-04
申请号：US10705823
申请日：2003-11-13
申请人： Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
发明人： Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
CPC分类号： H01L24/28 , H01L21/563 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2224/0401
摘要： A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
摘要翻译： 一种电路模块的制造方法，其特征在于，包括以芯片构成的芯片部件与芯片部件的基板之间的间隙以树脂填充的方式填充。 该方法使用简化的设备，并最大限度地减少不必要的树脂扩散。 树脂被供应在分配针的侧壁和芯片部件的侧壁之间。 由于毛细作用，形成树脂池，然后用树脂池的树脂自发填充芯片部件和基板之间的间隙。
-
公开(公告)号：US6047603A
公开(公告)日：2000-04-11
申请号：US226393
申请日：1999-01-06
CPC分类号： G10K9/122
摘要： An ultrasonic sensor includes: a floored cylindrical case, a piezoelectric vibration element and input-output terminals. The floored cylindrical case has a separately prepared cylinder part and a separately prepared vibration part, and the cylinder part and the vibration part are adhered together with an adhesive material having an elastic modulus in the range from 100 through 20,000 kgf/mm.sup.2 at a temperature range from 25 through 125.degree. C. The piezoelectric vibration element is disposed on the inner bottom floor of the floored cylindrical case. The input-output terminals are electrically connected to the piezoelectric vibration element and are adapted for electrical connection to outside of the floored cylindrical case.
摘要翻译： 超声波传感器包括：底盘圆筒形壳体，压电振动元件和输入 - 输出端子。 该圆筒形筒体具有单独制备的圆筒部分和单独制备的振动部分，并且气缸部分和振动部分用温度范围为100至20,000kgf / mm 2的弹性模量的粘合剂材料粘合在一起 25至125℃。压电振动元件设置在地板圆筒形壳体的内底层。 输入输出端子电连接到压电振动元件，并且适于与地面圆柱形壳体的外部电连接。
-
10.发明授权公开(公告)号：US09496156B2
公开(公告)日：2016-11-15
申请号：US13539711
申请日：2012-07-02
CPC分类号： H01L21/67098 , G02B1/02 , H01L21/67092 , H01L21/67103
摘要： A semiconductor crystal body processing method includes providing a semiconductor crystal body, sandwiching the semiconductor crystal body between a pair of conductive pressurizing tools, applying a pulse-like current between the pair of pressurizing tools to heat the semiconductor crystal body to a target temperature equal to or higher than a temperature at which the semiconductor crystal body is plastically deformed by pressurization and lower than its melting point, and applying pressure and a pulse-like current between the pair of pressurizing tools to thereby maintain the temperature of the semiconductor crystal body at the target temperature and mold the semiconductor crystal body into a target shape by plastic deformation.
摘要翻译： 半导体晶体处理方法包括：提供半导体晶体，将半导体晶体体夹在一对导电加压工具之间，在一对加压工具之间施加脉冲状电流，将半导体晶体加热至等于 或高于半导体晶体通过加压塑性变形而低于其熔点的温度，并且在一对加压工具之间施加压力和脉冲状电流，从而将半导体晶体的温度保持在 目标温度并通过塑性变形将半导体晶体体模塑成目标形状。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.033 秒)
