公开(公告)号：US09633997B2

公开(公告)日：2017-04-25

申请号：US15114201

申请日：2014-09-08

申请人： Satoru Kameyama ,  Shinya Iwasaki ,  Yuki Horiuchi ,  Shuhei Oki

发明人： Satoru Kameyama ,  Shinya Iwasaki ,  Yuki Horiuchi ,  Shuhei Oki

IPC分类号： H01L29/76 ,  H01L27/06 ,  H01L21/02 ,  H01L21/8222 ,  H01L21/265 ,  H01L21/324 ,  H01L29/10 ,  H01L29/06 ,  H01L29/739 ,  H01L29/861 ,  H01L29/08 ,  H01L21/425

CPC分类号： H01L27/0664 ,  H01L21/02675 ,  H01L21/265 ,  H01L21/26513 ,  H01L21/268 ,  H01L21/324 ,  H01L21/425 ,  H01L21/8222 ,  H01L27/0629 ,  H01L29/0684 ,  H01L29/0821 ,  H01L29/0839 ,  H01L29/0847 ,  H01L29/1095 ,  H01L29/36 ,  H01L29/66348 ,  H01L29/7397 ,  H01L29/78 ,  H01L29/8611

摘要： A semiconductor device, in which, in a density distribution of first conductivity type impurities in the first conductivity type region measured along a thickness direction of the semiconductor substrate, a local maximum value N1, a local minimum value N2, a local maximum value N3, and a density N4 are formed in this order from front surface side, a relationship of N1>N3>N2>N4 is satisfied, a relationship of N3/10>N2 is satisfied, and a distance “a” from the surface to the depth having the local maximum value N1 is larger than twice a distance “b” from the depth having the local maximum value N1 to the depth having the local minimum N2.

公开(公告)号：US09960165B2

公开(公告)日：2018-05-01

申请号：US15027846

申请日：2013-11-05

申请人： Yuki Horiuchi ,  Satoru Kameyama

发明人： Yuki Horiuchi ,  Satoru Kameyama

IPC分类号： H01L29/66 ,  H01L27/105 ,  H01L29/78 ,  H01L29/40 ,  H01L29/739 ,  H01L29/06 ,  H01L29/08

CPC分类号： H01L27/105 ,  H01L29/0696 ,  H01L29/0821 ,  H01L29/0834 ,  H01L29/0839 ,  H01L29/407 ,  H01L29/7391 ,  H01L29/7397 ,  H01L29/78 ,  H01L29/8613

摘要： Provided is a technology for further reducing a loss in a semiconductor device including a semiconductor substrate in which an IGBT region and a diode region are provided. This semiconductor device includes a semiconductor substrate in which at least one IGBT region and at least one diode region are provided. The IGBT region and the diode region are adjacent to each other in a predetermined direction in a plan view of the semiconductor substrate. In the plan view of the semiconductor substrate, a first boundary plane where the collector region and the cathode region are adjacent is shifted from a second boundary plane where the IGBT region and the diode region are adjacent on the front surface side of the semiconductor substrate either in a direction from the cathode region toward the collector region or in a direction from the collector region toward the cathode region.

公开(公告)号：US08658898B2

公开(公告)日：2014-02-25

申请号：US13254051

申请日：2010-04-13

申请人： Yuki Horiuchi

发明人： Yuki Horiuchi

IPC分类号： H01B7/00

CPC分类号： C08L23/02 ,  C08K3/016 ,  C08K5/49 ,  C08K5/52 ,  C08L9/06 ,  C08L23/00 ,  C08L23/10 ,  C08L25/04 ,  C08L71/12 ,  C08L2205/03 ,  H01B3/28 ,  H01B3/441 ,  H01B7/292 ,  H01B7/295 ,  C08L2666/02 ,  C08L2666/04

摘要： A resin composition for heat-resistant electrical wires is configured of 100 parts by weight of base resin ingredients and 5-20 parts by weight of a phosphorus-based flame retardant, the base resin ingredients comprising 30-55 parts by weight of a polymer having a glass transition temperature or melting point of 180° C. or higher, 15-49 parts by weight of polyolefin, and 21-30 parts by weight of a styrene-based elastomer ingredient, the styrene-based elastomer ingredient having a content of the styrene unit represented by chemical formula (I) of 30% by weight or less.

摘要翻译： 用于耐热电线的树脂组合物由100重量份的基础树脂成分和5-20重量份的磷系阻燃剂构成，所述基础树脂成分包含30-55重量份的具有 玻璃化转变温度或熔点为180℃以上，聚合物为15〜49重量份，苯乙烯系弹性体成分为21-30重量份，苯乙烯系弹性体成分的含量为 由化学式（I）表示的苯乙烯单元为30重量％以下。

公开(公告)号：US20110315425A1

公开(公告)日：2011-12-29

申请号：US13254051

申请日：2010-04-13

申请人： Yuki Horiuchi

发明人： Yuki Horiuchi

IPC分类号： H01B7/295 ,  C08L71/12 ,  C08L25/04 ,  C08L23/02 ,  C08K3/32

CPC分类号： C08L23/02 ,  C08K3/016 ,  C08K5/49 ,  C08K5/52 ,  C08L9/06 ,  C08L23/00 ,  C08L23/10 ,  C08L25/04 ,  C08L71/12 ,  C08L2205/03 ,  H01B3/28 ,  H01B3/441 ,  H01B7/292 ,  H01B7/295 ,  C08L2666/02 ,  C08L2666/04

摘要： Provided is a resin composition for heat-resistant electrical wires which has high heat resistance and flame retardancy and combines excellent heat aging resistance and compatibility with PVC. The resin composition for heat-resistant electrical wires is configured of 100 parts by weight of base resin ingredients and 5-20 parts by weight of a phosphorus-based flame retardant, the base resin ingredients comprising 30-55 parts by weight of a polymer having a glass transition temperature or melting point of 180° C. or higher, 15-49 parts by weight of a polyolefin, and 21-30 parts by weight of a styrene-based elastomer ingredient, the styrene-based elastomer ingredient having a content of the styrene unit represented by chemical formula (I) of 30% by weight or less.

摘要翻译： 本发明提供耐热性和阻燃性高的耐热电线用树脂组合物，并且具有优异的耐热老化性和与PVC的相容性。 耐热电线用树脂组合物由100重量份的基础树脂成分和5-20重量份的磷系阻燃剂构成，所述基础树脂成分包含30-55重量份的具有 玻璃化转变温度或熔点为180℃以上，15〜49重量份聚烯烃，和21-30重量份苯乙烯系弹性体成分，苯乙烯系弹性体成分的含量为 由化学式（I）表示的苯乙烯单元为30重量％以下。