摘要:
A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.
摘要:
A frequency converter includes a radiating section having a base and fins for radiating heat from a power semiconductor, a circuit substrate being provided at an opposite side of the fins with respect to the base, a housing that covers the circuit substrate, a guide for flowing air between the housing and the circuit substrate toward a downstream side of the fins, and a fan. The fan flows the air flown to the downstream side of the fins by the guide toward an upstream side of the fins.
摘要:
A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiating section, and a guide provided on the housing to direct gases around the circuit substrate toward the intake face.
摘要:
A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiating section, and a guide provided on the housing to direct gases around the circuit substrate toward the intake face.
摘要:
Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing.In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat. By providing the guide on the housing, an existing fan can radiate heat from the substrate that generates much heat, the substrate that generates comparatively less heat, etc., thereby enabling reduction in temperature rise.
摘要:
Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing. In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat. By providing the guide on the housing, an existing fan can radiate heat from the substrate that generates much heat, the substrate that generates comparatively less heat, etc., thereby enabling reduction in temperature rise.
摘要:
In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.
摘要:
In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.
摘要:
In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost.In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.
摘要:
A method for producing a silver halide emulsion in which grains having an aspect ratio of from 1.5 to 100 occupy from 75 to 100% of the total projected area of all grains comprising at least nucleation, ripening and grain growth processes in a dispersion medium solution containing water and a dispersion medium, wherein the dispersion medium solution contains low molecular weight gelatin having a molecular weight of from 1,000 to 70,000 at least during a nucleation process and chemically modified gelatin having a chemical modification rate of the amino group of from 15% to 100% at least during a grain growth process.