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公开(公告)号：US10509320B2
公开(公告)日：2019-12-17
申请号：US11795520
申请日：2006-01-06
摘要： There is provided an underlayer coating forming composition for lithography that is used in lithography process of the manufacture of semiconductor devices and that has a high dry etching rate in comparison to photoresists, does not intermix with photoresists, and is capable of flattening the surface of a semi conductor substrate having holes of a high aspect ratio.The underlayer coating forming composition for lithography comprises, a compound having two or more protected carboxylic groups, a compound having two or more epoxy groups, and a solvent.
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2.发明申请公开(公告)号：US20080102649A1
公开(公告)日：2008-05-01
申请号：US11795520
申请日：2006-01-06
摘要： There is provided an underlayer coating forming composition for lithography that is used in lithography process of the manufacture of semiconductor devices and that has a high dry etching rate in comparison to photoresists, does not intermix with photoresists, and is capable of flattening the surface of a semi conductor substrate having holes of a high aspect ratio.The underlayer coating forming composition for lithography comprises, a compound having two or more protected carboxylic groups, a compound having two or more epoxy groups, and a solvent.
摘要翻译： 提供了用于光刻的底层涂层形成组合物，其用于制造半导体器件的光刻工艺中，并且与光致抗蚀剂相比具有高的干蚀刻速率，不与光致抗蚀剂混合，并且能够使 具有高纵横比的孔的半导体衬底。 用于光刻的下层涂层形成组合物包括具有两个或更多个保护的羧基的化合物，具有两个或更多个环氧基的化合物和溶剂。
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3.发明授权公开(公告)号：US07226721B2
公开(公告)日：2007-06-05
申请号：US10565968
申请日：2004-07-30
CPC分类号： G03F7/091 , Y10S430/106
摘要： There is provided an underlayer coating forming composition for lithography, and an underlayer coating having a high dry etching rate compared with photoresist, and causing no intermixing with the photoresist, which are used in lithography process of manufacture of semiconductor device. Concretely, it is an underlayer coating forming composition comprising a compound having a protected carboxyl group, a compound having a group capable of reacting with a carboxyl group and a solvent, and an underlayer coating forming composition comprising a compound having a group capable of reacting with a carboxyl group and a protected carboxyl group and a solvent.
摘要翻译： 提供了一种用于光刻的底层涂层形成组合物和与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，并且不与用于制造半导体器件的光刻工艺中的光致抗蚀剂混合。 具体地说，它是一种下层涂层形成组合物，它包括具有被保护的羧基的化合物，具有与羧基反应的基团的化合物和一种溶剂，以及一种下层涂层形成组合物，该组合物包含具有能够与 羧基和保护的羧基和溶剂。
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4.发明授权公开(公告)号：US08916327B2
公开(公告)日：2014-12-23
申请号：US10577854
申请日：2004-10-29
申请人： Satoshi Takei , Yasushi Sakaida , Tetsuya Shinjo
发明人： Satoshi Takei , Yasushi Sakaida , Tetsuya Shinjo
CPC分类号： G03F7/091
摘要： There is provided an underlayer coating forming composition for lithography, and an underlayer coating having a high dry etching rate compared with photoresist, and causing no intermixing with the photoresist, which are used in lithography process of manufacture of semiconductor device. Concretely, it is an underlayer coating forming composition for lithography comprising a dextrin ester compound that at least 50% of hydroxy groups in dextrin is converted into ester groups, a crosslinking compound, and an organic solvent.
摘要翻译： 提供了一种用于光刻的底层涂层形成组合物和与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，并且不与用于制造半导体器件的光刻工艺中的光致抗蚀剂混合。 具体地说，它是一种用于光刻的底层涂层形成组合物，其中含有糊精中至少50％的羟基转化成酯基的糊精酯化合物，交联化合物和有机溶剂。
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5.发明申请公开(公告)号：US20070135581A1
公开(公告)日：2007-06-14
申请号：US10577854
申请日：2004-10-29
申请人： Satoshi Takei , Yasushi Sakaida , Tetsuya Shinjo
发明人： Satoshi Takei , Yasushi Sakaida , Tetsuya Shinjo
IPC分类号： C08F120/02
CPC分类号： G03F7/091
摘要： There is provided an underlayer coating forming composition for lithography, and an underlayer coating having a high dry etching rate compared with photoresist, and causing no intermixing with the photoresist, which are used in lithography process of manufacture of semiconductor device. Concretely, it is an underlayer coating forming composition for lithography comprising a dextrin ester compound that at least 50% of hydroxy groups in dextrin is converted into ester groups, a crosslinking compound, and an organic solvent.
摘要翻译： 提供了一种用于光刻的底层涂层形成组合物和与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，并且不与用于制造半导体器件的光刻工艺中的光致抗蚀剂混合。 具体地说，它是一种用于光刻的底层涂层形成组合物，其中含有糊精中至少50％的羟基转化为酯基的糊精酯化合物，交联化合物和有机溶剂。
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6.发明申请Composition for forming lower layer film for lithography comprising compound having protected carboxyl group 有权用于形成用于光刻的下层膜的组合物，其包含具有保护的羧基的化合物公开(公告)号：US20060210915A1
公开(公告)日：2006-09-21
申请号：US10565968
申请日：2004-07-30
IPC分类号： G03C1/76
CPC分类号： G03F7/091 , Y10S430/106
摘要： There is provided an underlayer coating forming composition for lithography, and an underlayer coating having a high dry-etching rate compared with photoresist, and causing no intermixing with the photoresist, which are used in lithography process of manufacture of semiconductor device. Concretely it is an underlayer coating forming composition comprising a compound having a protected carboxyl group, a compound having a group capable of reacting with a carboxyl group and a solvent, and an underlayer coating forming composition comprising a compound having a group capable of reacting with a carboxyl group and a protected carboxyl group and a solvent.
摘要翻译： 提供了用于光刻的底层涂层形成组合物和与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，并且不与用于制造半导体器件的光刻工艺中的光致抗蚀剂混合。 具体地说，它是包含具有被保护的羧基的化合物，具有与羧基反应的基团的化合物和溶剂的底层涂层形成组合物，以及下层涂层形成组合物，其包含具有能够与羧基反应的基团的化合物 羧基和保护的羧基和溶剂。
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7.发明授权公开(公告)号：US07842620B2
公开(公告)日：2010-11-30
申请号：US12311742
申请日：2007-10-12
申请人： Satoshi Takei , Makoto Nakajima , Yasushi Sakaida , Hikaru Imamura , Keisuke Hashimoto , Takahiro Kishioka
发明人： Satoshi Takei , Makoto Nakajima , Yasushi Sakaida , Hikaru Imamura , Keisuke Hashimoto , Takahiro Kishioka
IPC分类号： H01L21/31
CPC分类号： H01L21/0332 , G03F7/0752 , G03F7/091 , G03F7/11 , H01L21/0274 , H01L21/31138 , H01L21/31144
摘要： There is provided a laminate used as an underlayer layer for a photoresist in a lithography process of a semiconductor device and a method for manufacturing a semiconductor device by using the laminate. The method comprising: laminating each layer of an organic underlayer film (layer A), a silicon-containing hard mask (layer B), an organic antireflective film (layer C) and a photoresist film (layer D) in this order on a semiconductor substrate. The method also comprises: forming a resist pattern in the photoresist film (layer D); etching the organic antireflective film (layer C) with the resist pattern; etching the silicon-containing hard mask (layer B) with the patterned organic antireflective film (layer C); etching the organic underlayer film (layer A) with the patterned silicon-containing hard mask (layer B); and processing the semiconductor substrate with the patterned organic underlayer film (layer A).
摘要翻译： 在半导体器件的光刻工艺中提供了用作光致抗蚀剂的下层的层压体，以及通过使用层压体制造半导体器件的方法。 该方法包括：在半导体上依次层叠有机下层膜（A层），含硅硬掩模（B层），有机抗反射膜（C层）和光致抗蚀剂膜（D层）的各层 基质。 该方法还包括：在光致抗蚀剂膜（层D）中形成抗蚀剂图案; 用抗蚀剂图案蚀刻有机抗反射膜（层C）; 用图案化的有机抗反射膜（C层）蚀刻含硅硬掩模（B层）; 用图案化的含硅硬掩模（B层）蚀刻有机下层膜（层A）; 并用图案化的有机下层膜（层A）处理半导体衬底。
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公开(公告)号：US20100022089A1
公开(公告)日：2010-01-28
申请号：US12311742
申请日：2007-10-12
申请人： Satoshi Takei , Makoto Nakajima , Yasushi Sakaida , Hikaru Imamura , Keisuke Hashimoto , Takahiro Kishioka
发明人： Satoshi Takei , Makoto Nakajima , Yasushi Sakaida , Hikaru Imamura , Keisuke Hashimoto , Takahiro Kishioka
IPC分类号： H01L21/311 , G03F7/075
CPC分类号： H01L21/0332 , G03F7/0752 , G03F7/091 , G03F7/11 , H01L21/0274 , H01L21/31138 , H01L21/31144
摘要： There is provided a laminate used as an underlayer layer for a photoresist in a lithography process of a semiconductor device and a method for manufacturing a semiconductor device by using the laminate. The method comprising: laminating each layer of an organic underlayer film (layer A), a silicon-containing hard mask (layer B), an organic antireflective film (layer C) and a photoresist film (layer D) in this order on a semiconductor substrate. The method also comprises: forming a resist pattern in the photoresist film (layer D); etching the organic antireflective film (layer C) with the resist pattern; etching the silicon-containing hard mask (layer B) with the patterned organic antireflective film (layer C); etching the organic underlayer film (layer A) with the patterned silicon-containing hard mask (layer B); and processing the semiconductor substrate with the patterned organic underlayer film (layer A).
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9.发明授权Underlayer coating forming composition for lithography containing cyclodextrin compound 有权用于含环糊精化合物的光刻用底层涂料组合物公开(公告)号：US07687223B2
公开(公告)日：2010-03-30
申请号：US11666342
申请日：2005-10-25
申请人： Satoshi Takei , Tetsuya Shinjo , Keisuke Hashimoto
发明人： Satoshi Takei , Tetsuya Shinjo , Keisuke Hashimoto
CPC分类号： G03F7/091 , G03F7/094 , G03F7/11 , H01L21/0276 , H01L21/31144 , H01L21/312 , H01L21/76808 , Y10S430/111 , Y10S430/115
摘要： There is provided an underlayer coating forming composition for lithography for forming an underlayer coating having a high dry etching rate compared with photoresist, causing no intermixing with the photoresist, and excellent in property of filling hole on the semiconductor substrate, which is used in lithography process of manufacture of semiconductor device. The composition comprises a cyclodextrin compound that 10% to 90% of total number of hydroxy groups in cyclodextrin is converted into an ether or ester group, a crosslinking compound, a crosslinking catalyst and a solvent.
摘要翻译： 提供了一种用于光刻的底层涂层形成组合物，用于形成与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，不会与光致抗蚀剂混合，并且在光刻工艺中使用的半导体衬底上的填充孔性质优异 的半导体器件的制造。 该组合物包含环糊精中羟基总数的10〜90％转化为醚或酯基的环糊精化合物，交联化合物，交联催化剂和溶剂。
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10.发明申请Underlayer Coating Forming Composition For Lithography Containing Cyclodextrin Compound 有权含有环糊精化合物的平版印刷的底层涂层成型组合物公开(公告)号：US20070292767A1
公开(公告)日：2007-12-20
申请号：US11666342
申请日：2005-10-25
申请人： Satoshi Takei , Tetsuya Shinjo , Keisuke Hashimoto
发明人： Satoshi Takei , Tetsuya Shinjo , Keisuke Hashimoto
IPC分类号： G03F7/11 , H01L21/027
CPC分类号： G03F7/091 , G03F7/094 , G03F7/11 , H01L21/0276 , H01L21/31144 , H01L21/312 , H01L21/76808 , Y10S430/111 , Y10S430/115
摘要： There is provided an underlayer coating forming composition for lithography for forming an underlayer coating having a high dry etching rate compared with photoresist, causing no intermixing with the photoresist, and excellent in property of filling hole on the semiconductor substrate, which is used in lithography process of manufacture of semiconductor device. The composition comprises a cyclodextrin compound that 10% to 90% of total number of hydroxy groups in cyclodextrin is converted into an ether or ester group, a crosslinking compound, a crosslinking catalyst and a solvent.
摘要翻译： 提供了一种用于光刻的底层涂层形成组合物，用于形成与光致抗蚀剂相比具有高干蚀刻速率的下层涂层，不会与光致抗蚀剂混合，并且在光刻工艺中使用的半导体衬底上的填充孔性质优异 的半导体器件的制造。 该组合物包含环糊精中羟基总数的10〜90％转化为醚或酯基的环糊精化合物，交联化合物，交联催化剂和溶剂。
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