摘要:
A solid state lighting (SSL) device with a solid state emitter (SSE) being partially exposed in a channel loop, and methods of making and using such SSLs. The SSE can have thermally conductive projections such as fins, posts, or other structures configured to transfer heat into a fluid medium, such as a liquid coolant in the channel loop. The channel loop can include an upward channel in which the SSE is exposed to warm the coolant in the upward channel, and a downward channel through which coolant moves after being cooled by a cooling structure. The coolant in the channel loop can naturally circulate due to the heat from the SSE.
摘要:
A solid state lighting (SSL) device with a solid state emitter (SSE) being partially exposed in a channel loop, and methods of making and using such SSLs. The SSE can have thermally conductive projections such as fins, posts, or other structures configured to transfer heat into a fluid medium, such as a liquid coolant in the channel loop. The channel loop can include an upward channel in which the SSE is exposed to warm the coolant in the upward channel, and a downward channel through which coolant moves after being cooled by a cooling structure. The coolant in the channel loop can naturally circulate due to the heat from the SSE.
摘要:
A solid state lighting (SSL) device with a solid state emitter (SSE) being partially exposed in a channel loop, and methods of making and using such SSLs. The SSE can have thermally conductive projections such as fins, posts, or other structures configured to transfer heat into a fluid medium, such as a liquid coolant in the channel loop. The channel loop can include an upward channel in which the SSE is exposed to warm the coolant in the upward channel, and a downward channel through which coolant moves after being cooled by a cooling structure. The coolant in the channel loop can naturally circulate due to the heat from the SSE.
摘要:
Solid state radiation transducer (SSRT) assemblies and method for making SSRT assemblies. In one embodiment, a SSRT assembly comprises a first substrate having an epitaxial growth material and a radiation transducer on the first substrate. The radiation transducer can have a first semiconductor material grown on the first substrate, a second semiconductor material, and an active region between the first and second semiconductor materials. The SSRT can also have a first contact electrically coupled to the first semiconductor material and a second contact electrically coupled to the second semiconductor material. The first substrate has an opening through which radiation can pass to and/or from the first semiconductor material.
摘要:
Solid state lighting (“SSL”) devices with cellular arrays and associated methods of manufacturing are disclosed herein. In one embodiment, a light emitting diode includes a semiconductor material having a first surface and a second surface opposite the first surface. The semiconductor material has an aperture extending into the semiconductor material from the first surface. The light emitting diode also includes an active region in direct contact with the semiconductor material, and at least a portion of the active region is in the aperture of the semiconductor material.
摘要:
Solid state radiation transducer (SSRT) assemblies and method for making SSRT assemblies. In one embodiment, a SSRT assembly comprises a first substrate having an epitaxial growth material and a radiation transducer on the first substrate. The radiation transducer can have a first semiconductor material grown on the first substrate, a second semiconductor material, and an active region between the first and second semiconductor materials. The SSRT can also have a first contact electrically coupled to the first semiconductor material and a second contact electrically coupled to the second semiconductor material. The first substrate has an opening through which radiation can pass to and/or from the first semiconductor material.
摘要:
A solid state lighting (SSL) device with a solid state emitter (SSE) being partially exposed in a channel loop, and methods of making and using such SSLs. The SSE can have thermally conductive projections such as fins, posts, or other structures configured to transfer heat into a fluid medium, such as a liquid coolant in the channel loop. The channel loop can include an upward channel in which the SSE is exposed to warm the coolant in the upward channel, and a downward channel through which coolant moves after being cooled by a cooling structure. The coolant in the channel loop can naturally circulate due to the heat from the SSE.
摘要:
A method of forming a semiconductor device structure. The method comprises forming a block copolymer assembly comprising at least two different domains over an electrode. At least one metal precursor is selectively coupled to the block copolymer assembly to form a metal-complexed block copolymer assembly comprising at least one metal-complexed domain and at least one non-metal-complexed domain. The metal-complexed block copolymer assembly is annealed in to form at least one metal structure. Other methods of forming a semiconductor device structures are described. Semiconductor device structures are also described.
摘要:
A repairable memory cell in accordance with one or more embodiments of the present disclosure includes a storage element positioned between a first and a second electrode, and a repair element positioned between the storage element and at least one of the first electrode and the second electrode.
摘要:
Memory cells (e.g., CBRAM cells) include an ion source material over an active material and an electrode comprising metal silicide over the ion source material. The ion source material may include at least one of a chalcogenide material and a metal. Apparatuses, such as systems and devices, include a plurality of such memory cells. Memory cells include an adhesion material of metal silicide between a ion source material and an electrode of elemental metal. Methods of forming a memory cell include forming a first electrode, forming an active material, forming an ion source material, and forming a second electrode including metal silicide over the metal ion source material. Methods of adhering a material including copper and a material including tungsten include forming a tungsten silicide material over a material including copper and treating the materials.