Method and system for displaying attributes of items organized in a searchable hierarchical structure
    3.
    发明授权
    Method and system for displaying attributes of items organized in a searchable hierarchical structure 有权
    用于显示以可搜索的分层结构组织的项目的属性的方法和系统

    公开(公告)号:US07603367B1

    公开(公告)日:2009-10-13

    申请号:US11540933

    申请日:2006-09-29

    IPC分类号: G06F17/00 G06F17/30 G06F7/00

    摘要: A catalog or database of items capable of being searched may be organized into a browse tree structure. In accordance with aspects of the present invention, attributes that describe and are common to the items in each category can be assigned or associated with the browse node for the category. Such “browse node attributes” may be displayed with their respective associated item category. Accordingly, as a user searches the browse tree and or narrows his/her search to more specific item categories in a browse tree, the attributes corresponding to the more specific item categories can then be displayed as a superset of the attributes corresponding to a less specific category. Furthermore, the arrangement of attributes displayed to the user can be customized according to user preferences, clickstream analysis, or other techniques and the user may select which attributes are to be displayed.

    摘要翻译: 可以将能够被搜索的项目的目录或数据库组织成浏览树结构。 根据本发明的方面,可以为每个类别中的项目描述和共同的属性分配或与该类别的浏览节点相关联。 这样的“浏览节点属性”可以与它们各自相关联的项目类别一起显示。 因此,当用户在浏览树中搜索浏览树或将其搜索缩小到更具体的项目类别时,可以将对应于更具体的项目类别的属性显示为对应于较不具体的属性的属性的超集 类别。 此外,可以根据用户偏好,点击流分析或其他技术来定制显示给用户的属性的布置,并且用户可以选择要显示哪些属性。

    Surface mount interposer
    5.
    发明授权
    Surface mount interposer 失效
    表面安装插入器

    公开(公告)号:US5491303A

    公开(公告)日:1996-02-13

    申请号:US210509

    申请日:1994-03-21

    申请人: Michael L. Weiss

    发明人: Michael L. Weiss

    IPC分类号: H05K3/34 H05K3/36 H05K1/14

    摘要: An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).

    摘要翻译: 用于连接两个或多个印刷电路板(302,304)的插入器(100)是在两侧(105,107)中的每一个上具有两个或更多个焊盘(104,109)的电路承载基板(102)。 每个焊盘连接到衬底中的导电通孔(106),从而提供从一侧到另一侧的电互连。 每个焊盘在其上具有焊料凸块(108)。 通过将插入件的一侧上的焊料凸块焊接到印刷电路板(302)上的相应焊盘来制成电路组件。 插入器另一侧的焊料凸块同样焊接到第二印刷电路板(304)的相应的焊盘上。