摘要:
Methods and systems for causing the display of items for the review and selection thereof by a potential purchaser has a plurality of search tools whereby a customer can select certain search criteria for displaying items corresponding to the search criteria for review and selection thereof and comparison therebetween. In one embodiment, the system provides a brand menu whereby a customer can select one or more brands of products for displaying the same in a common display window.
摘要:
Methods and systems for causing the display of items for the review and selection thereof by a potential purchaser has a plurality of search tools whereby a customer can select certain search criteria for displaying items corresponding to the search criteria for review and selection thereof and comparison therebetween. In one embodiment, the system provides a brand menu whereby a customer can select one or more brands of products for displaying the same in a common display window.
摘要:
A catalog or database of items capable of being searched may be organized into a browse tree structure. In accordance with aspects of the present invention, attributes that describe and are common to the items in each category can be assigned or associated with the browse node for the category. Such “browse node attributes” may be displayed with their respective associated item category. Accordingly, as a user searches the browse tree and or narrows his/her search to more specific item categories in a browse tree, the attributes corresponding to the more specific item categories can then be displayed as a superset of the attributes corresponding to a less specific category. Furthermore, the arrangement of attributes displayed to the user can be customized according to user preferences, clickstream analysis, or other techniques and the user may select which attributes are to be displayed.
摘要:
A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.
摘要:
An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).